Market Newsdesk

MELBOURNE BEACH, Fla., March 15, 2021 (GLOBE NEWSWIRE) — Whether narrowly escaping an accident or experiencing a sudden gut feeling to change course, there are many situations in which one might attribute their safety to guardian angels. For author and fine artist, Win Tuck-Gleason, there is no question about the active role that angels have played in her life; she has seen them firsthand. In “Angels, Of Course: A Collection of Illustrated Visits,” she fondly reflects on her numerous encounters with angels, inviting readers to bear witness to the beauty, power and radiant joy of the divine.

As Tuck-Gleason reveals through her stories and paintings, angels come in varying sizes, shapes and forms, and their presence cannot always be detected through human senses. However, they all share an important commonality as instruments of Jesus Christ. From introducing her to music and other means of artistic expression to shielding her from harm and offering much-needed comfort and happiness, angels have demonstrated the amazing feats of God’s love and confirmed His presence in her day-to-day life.

By extending her observations and experiences, Tuck-Gleason encourages readers to pay thought to the times in their own lives that may have been divinely protected and evokes appreciation for the ways in which God uses angels to provide safety, reassurance and grace. She also hopes to instill readers with confidence in the Lord’s everlasting support and hope for a bright future ahead of the isolating and challenging times of the present

“Angels, of Course is an optimistic and lovely book about how [an] angel from heaven can help people on Earth,” wrote Ella Vincent in her Starred review for Pacific Book Review. “Tuck-Gleason has written a book about faith and hope that readers will love.”

“Her full-color book is a joy to peruse or share as a gift with a dear friend,” wrote Donna Ford for the US Review of Books.

“Angels, Of Course: A Collection of Illustrated Visits”
By Win Tuck-Gleason
ISBN: 9781532086069 (softcover); 9781532097188 (hardcover); 9781532086076 (electronic)
Available from Amazon, Barnes & Noble and iUniverse

About the author
Win Tuck-Gleason is a fine artist and author. Her first love was singing and after high school, as a music festival gold metal soprano, she auditioned and was accepted into the Artist Diploma Course at the School of Music, University of Toronto. A semiprofessional singer, concerts, musicals and churches were her outlet when she had time from family and work. Tuck-Gleason is also strong in her Christian faith, having been blessed with a unique ability to see angels. Her encounters with angels led her to begin painting to capture the spiritual dimension of life. Since then, her paintings have been accepted in juried art shows and professional galleries, and have been sold in England, Canada and the United States. Originally from Ontario, Tuck-Gleason now splits her time between Newton, New Jersey, and Melbourne Beach, Florida. To learn more, please visit fineartbywintuck.com.

iUniverse, an Author Solutions, LLC, self-publishing imprint, is the leading book marketing, editorial services, and supported self-publishing provider. iUniverse recognizes excellence in book publishing through the Star, Rising Star and Editor’s Choice designations—self-publishing’s only such awards program. iUniverse is headquartered in Bloomington, Indiana. For more information or to publish a book, please visit iuniverse.com or call 1-800-AUTHORS.

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BENSALEM, Pa., March 15, 2021 (GLOBE NEWSWIRE) — Law Offices of Howard G. Smith reminds investors that class action lawsuits have been filed on behalf of shareholders of the following publicly-traded companies. Investors have until the deadlines listed below to file a lead plaintiff motion.

Investors suffering losses on their investments are encouraged to contact the Law Offices of Howard G. Smith to discuss their legal rights in these class actions at 888-638-4847 or by email to [email protected].

bluebird bio, Inc. (NASDAQ: BLUE)
Class Period: May 11, 2020 – November 4, 2020
Lead Plaintiff Deadline: April 13, 2021

The complaint filed in this class action alleges that throughout the Class Period, Defendants made materially false and/or misleading statements, as well as failed to disclose material adverse facts about the Company’s business, operations, and prospects. Specifically, Defendants failed to disclose to investors that: (1) data supporting bluebird’s BLA submission for LentiGlobin for SCD was insufficient to demonstrate drug product comparability; (2) Defendants downplayed the foreseeable impact of disruptions related to the COVID-19 pandemic on the Company’s BLA submission schedule for LentiGlobin for SCD, particularly with respect to manufacturing; (3) as a result of all the foregoing, it was foreseeable that the Company would not submit the BLA for LentiGlobin for SCD in the second half of 2021; and (4) as a result, Defendants’ positive statements about the Company’s business, operations, and prospects were materially misleading and/or lacked a reasonable basis at all relevant times.

EHang Holdings Limited (NASDAQ: EH)
Class Period: December 12, 2019 – February 16, 2021
Lead Plaintiff Deadline: April 19, 2021

Shareholders with $10,000 losses or more are encouraged to contact the firm

The complaint filed in this class action alleges that throughout the Class Period, Defendants made materially false and/or misleading statements, as well as failed to disclose material adverse facts about the Company’s business, operations, and prospects. Specifically, Defendants failed to disclose to investors that: (1) the Company’s purported regulatory approvals in Europe and North America for its EH216 were for use as a drone, and not for carrying passengers; (2) its relationship with its purported primary customer is a sham; (3) EHang has only collected on a fraction of its reported sales since its ADS began trading on NASDAQ in December 2019; (4) the Company’s manufacturing facilities were practically empty and lacked evidence of advanced manufacturing equipment or employees; and (5) as a result, Defendants’ statements about its business, operations, and prospects were materially false and misleading and/or lacked reasonable basis at all relevant times.

Jianpu Technology, Inc. (NYSE: JT)
Class Period: May 29, 2018 – February 16, 2021
Lead Plaintiff Deadline: April 19, 2021

The complaint filed in this class action alleges that throughout the Class Period, Defendants made materially false and/or misleading statements, as well as failed to disclose material adverse facts about the Company’s business, operations, and prospects. Specifically, Defendants failed to disclose to investors: (1) that certain of the Company’s transactions carried out by the Credit Card Recommendation Business Unit involved undisclosed relationships or lacked business substance; (2) that, as a result, Jianpu’s revenue and costs and expenses for fiscal 2018 and 2019 were overstated; (3) that there were material weaknesses in Jianpu’s internal control over financial reporting; (4) that, as a result of the foregoing, the Company’s fiscal 2018 Form 20-F was reasonably likely to be restated; and (5) that, as a result of the foregoing, Defendants’ positive statements about the Company’s business, operations, and prospects were materially misleading and/or lacked a reasonable basis.

Immunovant, Inc. f/k/a Health Sciences Acquisitions Corporation (NASDAQ: IMVT)
Class Period: October 2, 2019 – February 1, 2021
Lead Plaintiff Deadline: April 20, 2021

The complaint filed in this class action alleges that throughout the Class Period, Defendants made materially false and/or misleading statements, as well as failed to disclose material adverse facts about the Company’s business, operations, and prospects. Specifically, Defendants failed to disclose to investors that: (1) HSAC had performed inadequate due diligence into Legacy Immunovant prior to the Merger, and/or ignored or failed to disclose safety issues associated with IMVT-1401; (2) IMVT-1401 was less safe than the Company had led investors to believe, particularly with respect to treating TED and WAIHA; (3) the foregoing foreseeably diminished IMVT-1401’s prospects for regulatory approval, commercial viability, and profitability; and (4) as a result, Defendants’ positive statements about the Company’s business, operations, and prospects were materially misleading and/or lacked a reasonable basis at all relevant times.

To be a member of these class actions, you need not take any action at this time; you may retain counsel of your choice or take no action and remain an absent member of the class action. If you wish to learn more about these class actions, or if you have any questions concerning this announcement or your rights or interests with respect to these matters, please contact Howard G. Smith, Esquire, of Law Offices of Howard G. Smith, 3070 Bristol Pike, Suite 112, Bensalem, Pennsylvania 19020, by telephone at (215) 638-4847, toll-free at (888) 638-4847, or by email to [email protected], or visit our website at www.howardsmithlaw.com.

This press release may be considered Attorney Advertising in some jurisdictions under the applicable law and ethical rules.

Contacts

Law Offices of Howard G. Smith
Howard G. Smith, Esquire
215-638-4847
888-638-4847
[email protected]
www.howardsmithlaw.com

Washington, DC, March 15, 2021 (GLOBE NEWSWIRE) — Today, [solidcore] Founder and CEO Anne Mahlum announced that Bryan Myers, current President and COO, will assume the role of CEO effective April 19, 2021. Mahlum will remain active in the strategic direction of the business as the company’s Executive Chairperson. She has served as [solidcore]’s CEO since founding the company in Washington, DC in November 2013, and has grown it to 71 studios over those seven years.

“This is my second entrepreneurial venture and I know it’s time for me to start to make some space for what’s next,” Mahlum said. “The number one responsibility I have as [solidcore]’s founder is to ensure that the company’s future is just as bright after me as it has been with me. With 71 studios, $70M of venture funding, a new digital partnership with Equinox+, and a strong team and Board, the timing is optimal for me to transition the CEO role to Bryan.”  

Myers joined [solidcore] in 2017 after serving as the VP of Finance, Strategy, and Development at Sweetgreen. In September 2019, he was promoted to President of [solidcore]. Myers is responsible for growing the company’s physical presence, and creating revenue growth in studios within the existing studio portfolio, and overall increased its profit margin by 420bps year-over-year. He also leads the company’s Diversity, Equity, and Inclusion taskforce, a key priority for the company.

“I am humbled and honored that Anne has placed her trust in me to step up and lead the company into its next chapter,” said Myers. “Over the last seven years, Anne’s leadership as CEO has built the strong foundation on which the company stands today; I am excited to build on that momentum as we continue to expand our community all over the country and beyond.” 

Mahlum will remain influential in creating the vision for the company, including taking the lead on international expansion and acquisition opportunities. Myers will drive the company’s operations, growth plan, and budget execution.

“Bryan and I have a synergetic relationship. We have different styles and different talents, but one thing we share is a mutual respect for how the other one works,” Mahlum said. “He is one of the most thoughtful, strategic and steady-handed leaders I have ever met, and he is hands-down, the best operator I have ever worked with over my 15-year career. He is going to knock this out of the park and I’m so proud of him.”  

This transition has been in the works for the past year-and-a-half, and was supposed to materialize last year. With the pandemic wreaking havoc on the fitness industry in 2020, the transition was delayed until the company was on more stable footing. The recent funding by VMG Partners provided the perfect opportunity for Myers to step into the role.

“Anne’s been extremely thoughtful planning this transition and she and Bryan have shown a rare ability to work together effectively,” said McConnell Smith of VMG Partners “Their partnership has been instrumental to the brand’s success and we’re excited for that partnership to continue as Bryan assumes the CEO role. It’s been clear from our first interactions that Bryan is a special leader and we have nothing but confidence in his ability to lead [solidcore] through its next phase of growth.”

Myers was named a “Minority Business Leader” by Washington Business Journal in 2019. He serves on the Board of the Ridley Scholars Foundation, an organization whose mission is to attract the best and brightest African American students to the University of Virginia by offering financial support, mentorship, and programming opportunities for selected students at the university. 

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ꟷ New AMD EPYC processor extends per socket performance leadership 
and best per core performance

¹

** with new “Zen 3” cores and modern security featuresꟷ

ꟷPartners including AWS, Cisco, Dell Technologies, Google Cloud, HPE, Lenovo, Microsoft Azure, Oracle Cloud Infrastructure, Supermicro, Tencent Cloud and others grow EPYC processor ecosystem 
to an expected 400 cloud instances and 100 new OEM platforms by end of 2021ꟷ

SANTA CLARA, Calif., March 15, 2021 (GLOBE NEWSWIRE) — At a digital event, AMD (NASDAQ: AMD) announced the new AMD EPYC™ 7003 Series CPUs, which includes the AMD EPYC 7763, the world’s highest-performing server processor²*. The new EPYC 7003 series processors help HPC, cloud and enterprise customers do more, faster, by delivering the best performance of any server CPU with up to 19% more instructions per clock³.

“With the launch of our 3^rd Gen AMD EPYC processors, we are incredibly excited to deliver the fastest server CPU in the world. These processors extend our data center leadership and help customers solve today’s most complex IT challenges, while substantially growing our ecosystem,” said Forrest Norrod, senior vice president and general manager, Data Center and Embedded Solutions Business Group. “We not only double the performance over the competition in HPC, cloud and enterprise workloads with our newest server CPUs, but together with the AMD Instinct GPUs, we are breaking the exascale barrier in supercomputing and helping to tackle problems that have previously been beyond humanity’s reach.”

AMD EPYC Processors, Powering the Modern Data Center

Available immediately, AMD EPYC 7003 Series Processors have up to 64 “Zen 3” cores per processor and introduce new levels of per-core cache memory, while continuing to offer the PCIe® 4 connectivity and class-leading memory bandwidth⁴ that defined the EPYC 7002 series CPUs. 3^rd Gen AMD EPYC processors also include modern security features through AMD Infinity Guard, supporting a new feature called Secure Encrypted Virtualization-Secure Nested Paging (SEV-SNP). SEV-SNP expands the existing SEV features on EPYC processors, adding strong memory integrity protection capabilities to help prevent malicious hypervisor-based attacks by creating an isolated execution environment. You can read more about new 3^rd Gen AMD EPYC features here.

All these features and capabilities combine to help drive faster time to results and improve business outcomes for HPC, cloud and enterprise customers.

• For HPC customers that demand the most throughput computing capabilities to do more simulations in a given time period, or use bigger data sets or more complex models, AMD EPYC 7003 Series processors enable faster time to discovery with more I/O⁵ and memory throughput, and powerful “Zen 3” cores that deliver up to twice the performance for HPC workloads compared to the competition⁶.
• For cloud providers who need compute density and security capabilities, AMD EPYC 7003 Series processors offer the highest core density⁷, advanced security features and up to twice the integer performance compared to the competition⁸.
• For the enterprise, where performance and time to value are critical to support the new “work from anywhere” environment, AMD EPYC 7003 Series processors help improve efficiency, and deliver value and performance. The new processors increase transactional database processing by up to 19%⁹, improve Hadoop big data analytic sorts by up to 60% with 61% better price to performance than the competition¹⁰, and offer superior performance for flexible Hyperconverged Infrastructure – all of which help CIOs turn data into actionable insights faster.

Partners Using AMD EPYC 7003 Series Processors

The AMD EPYC processor ecosystem is expected to grow significantly by the end of 2021 with more than 400 cloud instances using all generations of EPYC processors and 100 new server platforms using 3^rd Gen EPYC processors. AMD EPYC 7003 Series processor-based solutions are available now through numerous OEMs, ODMs, cloud providers and channel partners around the world.

• 
  AWS
  – will add the AMD EPYC 7003 series processors to its core Amazon EC2 instance families later this year.
• 
  Cisco
  – introduced new Cisco Unified Computing System™ (Cisco UCS®) rack server models with AMD EPYC 7003 Series Processors designed to support modern hybrid cloud workloads.   
• 
  Dell Technologies
  
  – announced the all new PowerEdge XE8545 server with AMD EPYC 7003 series CPUs, and the company will support the new processors within its PowerEdge server portfolio.
• 
  Google Cloud
  
  – announced AMD EPYC 7003 series processors will power a new compute optimized VM, C2D, and an expansion of the existing general purpose N2D VM later this year. Google Cloud Confidential Computing will be available on both C2D and N2D.
• 
  HPE
  
  – announced it will double the lineup of AMD EPYC processor powered solutions, using the AMD EPYC 7003 series processors in new HPE ProLiant servers, HPE Apollo systems and HPE Cray EX supercomputers.
• 
  Lenovo
  
  – added ten Lenovo ThinkSystem Servers and ThinkAgile HCI solutions built on 3^rd Gen EPYC processors, and achieved more than 25 new world records across a broad set of industry-standard benchmarks in workload areas.
• 
  Microsoft Azure
  
  – announced multiple new virtual machine offerings powered by AMD EPYC 7003 series processors. Azure HBv3 virtual machines for HPC applications are generally available today, and Confidential Computing virtual machines that utilize the full security features of the new AMD EPYC 7003 series processors are in private preview.
• 
  Oracle Cloud Infrastructure
  
  – announced it is extending its flexible virtual machine and bare metal compute offerings with the new E4 platform based on 3^rd Generation AMD EPYC Processors.
• 
  Supermicro
  – introduced the AMD EPYC 7003 series processor in its Supermicro A+ single and dual socket family of Ultra, Twin, SuperBlade®, Storage and GPU Optimized Systems.
• 
  Tencent Cloud
  – announced the new Tencent Cloud SA3 server instance, powered by the 3^rd Gen AMD EPYC processors.
• 
  VMware
  
  –
  announced its latest release of VMware vSphere 7 which is optimized to take advantage of AMD EPYC processors virtualization performance, while supporting the processors’ advanced security features, including SEV-ES for both virtual machine based and containerized applications.

You can visit the 3^rd Gen AMD EPYC processor launch page to view more content from these and other partners about how they will utilize the leadership performance and capabilities of the new AMD EPYC 7003 series processors. You can also visit the AMD EPYC partner quote page, to see global partner support of the processors.

AMD EPYC 7003 Series Processor SKU Table

Supporting Resources

• Watch the AMD EPYC 7003 Series keynote
• Visit the AMD EPYC 7003 Series Processor Launch Page
• Learn more about the AMD EPYC 7003 Series Processors
• Read more about the ecosystem partners supporting AMD EPYC™
• Follow AMD on Twitter

About AMD

For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, Facebook and Twitter pages.

CAUTIONARY STATEMENT
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including the AMD EPYC™ 7003 Series processors and expected ecosystem partners and products, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as “would,” “may,” “expects,” “believes,” “plans,” “intends,” “projects” and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD’s control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; global economic uncertainty; the loss of a significant customer; the impact of the COVID-19 pandemic on AMD’s business, financial condition and results of operations; the competitive markets in which AMD’s products are sold; quarterly and seasonal sales patterns; market conditions of the industries in which AMD products are sold; the cyclical nature of the semiconductor industry; AMD’s ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; the ability of third party manufacturers to manufacture AMD’s products on a timely basis in sufficient quantities and using competitive technologies; expected manufacturing yields for AMD’s products; the availability of essential equipment, materials or manufacturing processes; AMD’s ability to introduce products on a timely basis with features and performance levels that provide value to its customers; AMD’s ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential IT outages, data loss, data breaches and cyber-attacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products in a timely manner; AMD’s reliance on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components; AMD’s reliance on Microsoft Corporation and other software vendors’ support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; the impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; the efficiency of AMD’s supply chain; AMD’s ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control the sales of its products on the gray market; the impact of government actions and regulations such as export administration regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; the impact of environmental laws, conflict minerals-related provisions and other laws or regulations; the impact of acquisitions, joint ventures and/or investments on AMD’s business, including the announced acquisition of Xilinx, and the failure to integrate acquired businesses; AMD’s ability to complete the Xilinx merger; the impact of the announcement and pendency of the Xilinx merger on AMD’s business; the impact of any impairment of the combined company’s assets on the combined company’s financial position and results of operation; the restrictions imposed by agreements governing AMD’s notes and the revolving credit facility; the potential dilutive effect if the 2.125% Convertible Senior Notes due 2026 are converted; AMD’s indebtedness; AMD’s ability to generate sufficient cash to service its debt obligations or meet its working capital requirements; AMD’s ability to repurchase its outstanding debt in the event of a change of control; AMD’s ability to generate sufficient revenue and operating cash flow or obtain external financing for research and development or other strategic investments; political, legal, economic risks and natural disasters; future impairments of goodwill and technology license purchases; AMD’s ability to attract and retain qualified personnel; AMD’s stock price volatility; and worldwide political conditions. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

AMD, the AMD Arrow logo, EPYC, Instinct, and combinations thereof are trademarks of Advanced Micro Devices, Inc.

VMware and vSphere are registered trademarks or trademarks of VMware, Inc. in the United States and other jurisdictions.

*AMD EPYC 7763
**AMD EPYC 72F3

^{_____________________________________
1} MLN-057K: Based on SPECrate®2017_int_base on 02/20/2021, a server powered by two 8c AMD EPYC 72F3 CPU has a measured estimated score of 176 with a per core score of 11.00 which is a higher per core performance score than any currently posted in any SPEC.org publication. SPEC®, SPECrate® and SPEC CPU® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.
² MLN-016: Results as of 01/28/2021 using SPECrate®2017_int_base. The AMD EPYC 7763 a measured estimated score of 798 is higher than the current highest 2P server with an AMD EPYC 7H12 and a score of 717, https://spec.org/cpu2017/results/res2020q2/cpu2017-20200525-22554.pdf. OEM published score(s) for 3rd Gen EPYC may vary. SPEC®, SPECrate® and SPEC CPU® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.
³ MLN-003: Based on AMD internal testing as of 02/1/2021, average performance improvement at ISO-frequency on an AMD EPYC™ 72F3 (8C/8T, 3.7GHz) compared to an AMD EPYC™ 7F32 (8C/8T, 3.7GHz), per-core, single thread, using a select set of workloads including SPECrate®2017_int_base, SPECrate®2017_fp_base, and representative server workloads. SPEC® and SPECrate® are registered trademarks of Standard Performance Evaluation Corporation. Learn more at spec.org.
⁴ MLN-056: Each AMD EPYC 7003 processor has 8 memory channels. Each Intel Xeon Scalable processor has 6 memory channels. 8 – 6 = 2 ÷ 6 = 0.33 AMD EPYC has 33% more memory bandwidth. Class based on industry-standard pin-based (LGA) X86 processors.
⁵ MLN-055: AMD EPYC 7003 CPUs with PCIe4 lanes have 2X the I/O throughput capacity per lane than any Intel Xeon Scalable CPU which use PCIe3. PCIe4 provides 16GB/s of link bandwidth versus PCIe3 with 8Gb/s, https://pcisig.com/pci-express-delivering-needed-bandwidth-open-compute-project.
⁶MLN-074K: Based on SPECrate®2017_fp_base on 02/20/2021, a server powered by two 64c AMD EPYC 7763 CPUs has a score of 636 a compliant result run on an ThinkSystem SR665; with Memory: 512 GB (16 x 32 GB 2Rx4 PC4-3200AA-R); OS: Red Hat Enterprise Linux release 8.3 (Ootpa); Compiler: C/C++/Fortran: Version 3.0.0 of AOCC. Versus the current highest score Intel Cascade Lake Refresh server with a score of 309 with a 2P Intel Gold 6258R based server, https://spec.org/cpu2017/results/res2020q3/cpu2017-20200915-23979.pdf. SPEC®, SPECrate® and SPEC CPU® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.
⁷ EPYC-10: AMD EPYC has up to 64c/128t and Intel Scalable has up to 56c/112t, per processor.
⁸ MLN-073K: Based on SPECrate®2017_int_base on 02/20/2021, a server powered by two 64c AMD EPYC 7763 CPUs has a score of 819 in a compliant result run on an ThinkSystem SR645; with Memory: 2 TB (32 x 64 GB 2Rx4 PC4-3200AA-R), OS: SUSE Linux Enterprise Server 12 SP5 (x86_64) Kernel 4.12.14-120-default; Compiler: C/C++/Fortran: Version 3.0.0 of AOCC. Versus the current highest score Intel Cascade Lake Refresh server with a score of 397 using 2P Intel Gold 6258R, https://spec.org/cpu2017/results/res2020q3/cpu2017-20200915-23981.pdf. SPEC®, SPECrate® and SPEC CPU® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.
⁹MLN-006: HammerDB 4.0 OLTP comparison based on AMD internal testing on Oracle® 19c RDBMS as of 02/01/2021 on a server using 2x AMD EPYC 75F3 versus a server using 2x AMD EPYC 7542 for ~19% more [~1.2x the] performance. TPROC-C: OLTP workload profile in HammerDB derived, from the TPC-C specification using 2000 Warehouses. Results may vary.
¹⁰ MLN-069K: TPC Benchmark Express™ HSph@3TB comparison based on highest system results published as of 03/12/2021. Configurations: 17-node, 1x AMD EPYC 75F3 (34.52 HSph@3TB, $35,615.50/HSph@3TB, http://www.tpc.org/5548, available 3/15/2021, Framework 1 MapReduce) versus 17-node, 2x Intel Xeon Gold 6262V (21.52 HSph@3TB, $91,276.91/HSph@3TB, http://www.tpc.org/5544, available 11/09/2020, Framework 2 Spark) for 60% higher [1.6x the] Hadoop Sort throughput performance at 61% better price/performance.
¹¹ EPYC-18: Max boost for AMD EPYC processors is the maximum frequency achievable by any single core on the processor under normal operating conditions for server systems.

SAN FRANCISCO, Calif., March 15, 2021 (GLOBE NEWSWIRE) — Fictiv today announced that company founder and CEO Dave Evans has been recognized as a Manufacturing Leadership Awards winner for his contribution to digital transformation within the industry. Designed by the National Association of Manufacturers, the awards program honors those contributing to excellence in manufacturing.

Through his work at Fictiv, Evans has helped the industry to incorporate digital tools that create a seamless digital thread connecting product companies with manufacturers to improve manufacturing speed, quality, transparency, and productivity.

Fictiv’s Digital Manufacturing Ecosystem pairs an online quote-to-order platform with a global network of highly vetted manufacturers to dramatically shorten project timelines, reduce costs, and optimize manufacturing capacity.

“I am honored to accept this award on behalf of the hardworking team at Fictiv,” said Evans. “Together, we have been able to transform antiquated processes and support manufacturers around the world in their quest to modernize operations. Through technology, they are better able to drive business growth, improve quality, and lower costs so we can bring more products to market faster and more affordably.”

Evans will be recognized at the Manufacturing Leadership Awards Gala, which will take place as a virtual event on May 19, 2021. Details on attending the virtual gala are available at https://mlawards.manufacturingleadershipcouncil.com.

About Fictiv

Fictiv offers manufacturing agility and speed through a portfolio of optimized manufacturing processes for hardware companies of all sizes. Its Digital Manufacturing Ecosystem combines an easy-to-use cloud platform; design, quoting, billing and logistics systems; and an intelligent orchestration engine that manages a network of highly vetted and managed manufacturing partners that together deliver high-quality mechanical parts at unprecedented speeds. The ecosystem is supported by “boots-on-the-ground” experts to manage programs and inspect quality along the way. Over the last six years, Fictiv has manufactured more than 12M parts for early-stage companies and large enterprises alike, helping them innovate with agility and increase supply chain predictability. www.fictiv.com

About the Manufacturing Leadership Awards

The Manufacturing Leadership Awards honor manufacturing companies and individual manufacturing leaders that are shaping the future of global manufacturing. Winning projects and individual manufacturing leaders have demonstrated achievement in one of a wide range of categories, and are chosen by a panel of expert judges for results that have delivered clear and compelling value, return on investment, and other tangible outcomes. There will be several winners in each category, including one High Achiever’s Award in each project category, as well as a 2021 Manufacturer of the Year for both small and large enterprises. Also unveiled at the gala will be the ML Awards Manufacturing Leader of the Year and Lifetime Achievement Award winners.

For more information on the Manufacturing Leadership Awards, please go to https://mlawards.manufacturingleadershipcouncil.com/.

About the National Association of Manufacturers

The National Association of Manufacturers (NAM) is the largest manufacturing association in the United States, representing small and large manufacturers in every industrial sector and in all 50 states. Manufacturing employs more than 12 million men and women, contributes $2.25 trillion to the U.S. economy annually, has the largest economic impact of any major sector and accounts for more than three-quarters of all private-sector research and development in the nation. The NAM is the powerful voice of the manufacturing community and the leading advocate for a policy agenda that helps manufacturers compete in the global economy and create jobs across the United States.

The NAM’s world-class staff of policy experts provide unmatched access and information on the key issues affecting your business and bottom line. We are on the front lines of a wide range of policy battles, from immigration reform and labor relations, to energy and the environment, to trade policy and taxes. At every turn, we are working on behalf of manufacturers in America to advance policies that help manufacturers do what they do best: create economic strength and jobs. www.nam.org

Media Contact:
Stephanie Hicks
Cosmo PR for Fictiv
805-295-9455
[email protected]

WILMINGTON, Del., March 15, 2021 (GLOBE NEWSWIRE) — Rigrodsky Law, P.A. announces that it is investigating Noble Midstream Partners, LP (“Noble Midstream”) (NASDAQ GS: NBLX) regarding possible breaches of fiduciary duties and other violations of law related to Noble Midstream’s agreement to be acquired by Chevron Corporation (“Chevron”) (NYSE: CVX). Under the terms of the agreement, Noble Midstream’s unitholders will receive 0.1393 shares of Chevron per unit.

To learn more about this investigation and your rights, visit: https://www.rl-legal.com/cases-noble-midstream-partners-lp.

You may also contact Seth D. Rigrodsky or Gina M. Serra cost and obligation free at (888) 969-4242 or [email protected].

Rigrodsky Law, P.A., with offices in Delaware and New York, has recovered hundreds of millions of dollars on behalf of investors and achieved substantial corporate governance reforms in securities fraud and corporate class actions nationwide.

Attorney advertising.  Prior results do not guarantee a similar outcome.

CONTACT:         

Rigrodsky Law, P.A.
Seth D. Rigrodsky
Gina M. Serra
(888) 969-4242 (Toll Free)
(302) 295-5310
Fax: (302) 654-7530
[email protected]
https://rl-legal.com