Semtech Advances Next-Gen AI Optical Interconnects for XPO

Semtech Advances Next-Gen AI Optical Interconnects for XPO

Semtech’s 200G/lane modulator driver and TIA ICs accelerate the industry’s transition to XPO for AI network infrastructure

CAMARILLO, Calif.–(BUSINESS WIRE)–Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, today announced its membership in the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA), an industry initiative to enable high-bandwidth optical interconnects for AI network infrastructure. As a technology partner to the MSA, Semtech brings a broad portfolio of 200G/lane modulator driver and transimpedance amplifier (TIA) integrated circuits designed to support XPO transceiver development and volume deployment.

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Semtech’s 200G/lane modulator driver and TIA ICs accelerate the industry's transition to XPO for AI network infrastructure

Semtech’s 200G/lane modulator driver and TIA ICs accelerate the industry’s transition to XPO for AI network infrastructure

AI infrastructure buildouts continue to demand higher network throughput and bandwidth density at lower power, driving the industry toward new transceiver form factors capable of meeting these requirements at scale. XPO addresses these demands in a groundbreaking new pluggable optical transceiver form factor with industry-leading faceplate density.

“AI requires datacom optics with the highest performance, speed and density, and the market is poised to rapidly shift to 200G/lane electrical solutions this year,” said Scott Wilkinson, lead analyst for optical components at Cignal AI. “As AI operators transition to these high-speed optics, demand will continue to rapidly expand from $9 billion at the start of the AI revolution in 2024 to an estimated $37 billion in 2026.”

“XPO represents an innovative and practical approach to addressing network density challenges while preserving the field-serviceability and configurability benefits of pluggable optics,” said Scott Schube, vice president of applications engineering and product definition at Semtech. “Semtech’s portfolio of high-performance modulator drivers and TIAs is designed to support the XPO ecosystem from early prototyping through volume deployment.”

Semtech’s 200G/lane Optical IC Portfolio for XPO

Semtech provides a broad portfolio of high-performance linear modulator driver and TIA ICs with low power, ultra-low latency and high density designed to support XPO transceiver applications.

Semtech’s XPO product family includes:

  • GN1834L and GN1834DL quad TIAs with 750mm channel pitch

  • GN1838L and GN1838DL octal TIAs with 500mm channel pitch

  • GN42T380 octal TIA with 375mm channel pitch

  • TN1877 quad and TN1887 octal Mach-Zehnder Modulator (MZM) drivers with 625mm channel pitch

  • GN42M380 octal MZM driver with 375mm channel pitch

Key capabilities of the family include:

  • Multiple configurations for maximum module and PIC design flexibility

  • High linearity for best link integrity

  • On-chip equalization to seamlessly optimize performance over different electrical PCB and optical channels, and enable use of different optics

  • Integrated telemetry features for rapid time-to-market and link analysis and tuning

  • Ultra-low latency optimized for high-density AI network switch and fabric applications

  • High integration enabling compact transceiver designs consistent with XPO form factor requirements

About the XPO MSA

The XPO MSA is an industry initiative to define a new 12.8T high-density optical transceiver form factor for AI infrastructure. The current generation delivers 12.8T per module at 200G/lane using an integrated liquid-cooling design, with the MSA outlining a roadmap toward a future generation based on 400G/lane electrical interfaces. The MSA includes module, photonics and technology partners working to accelerate XPO development and deployment.

Semtech will demonstrate its high-speed driver and TIA solutions for XPO and other optical and copper interconnect applications at the European Conference on Optical Communication (ECOC) 2026, booth #2054, from Sept. 21–23 in Málaga, Spain.

About Semtech Corporation

Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected IoT devices worldwide. Our global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit us at Semtech.com or follow us on LinkedIn or X.

Semtech and the Semtech logo are registered trademarks or service marks of Semtech Corporation or its subsidiaries. All other trademarks, service marks and trade names mentioned in this press release are the property of their respective owners.

SMTC-P

Michelle Lozada, [email protected]

KEYWORDS: Europe Spain United States North America California

INDUSTRY KEYWORDS: Mobile/Wireless Technology Semiconductor Other Technology Networks Hardware Data Management IOT (Internet of Things) Consumer Electronics Artificial Intelligence

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Semtech’s 200G/lane modulator driver and TIA ICs accelerate the industry’s transition to XPO for AI network infrastructure
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Teradyne Introduces Iris 100: Production-Proven Test System for MicroLED Devices

Teradyne Introduces Iris 100: Production-Proven Test System for MicroLED Devices

Delivers semiconductor-grade test for next-generation optical interconnects powering scale-up in AI data centers.

NORTH READING, Mass.–(BUSINESS WIRE)–Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced Iris 100, a production-ready optical test platform for microLED devices. Teradyne Iris 100 brings semiconductor-grade optical test to microLED manufacturing, measuring every individual emitter in an array and integrating directly with the Teradyne UltraFLEXplus platform for combined optical and electrical test.

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Teradyne Iris 100 brings semiconductor-grade optical test to microLED manufacturing, measuring every individual emitter in an array and integrating directly with the Teradyne UltraFLEXplus platform for combined optical and electrical test.

Teradyne Iris 100 brings semiconductor-grade optical test to microLED manufacturing, measuring every individual emitter in an array and integrating directly with the Teradyne UltraFLEXplus platform for combined optical and electrical test.

MicroLED technology underpins two of the fastest-moving areas in advanced electronics, augmented reality (AR) microdisplays and optical data interconnects for AI data center architectures. Both depend on devices that contain hundreds of thousands to millions of individual emitters, each of which must be characterized with production-level precision and throughput. Bench-top optical instruments can characterize these devices in the lab, but they cannot deliver the throughput and cost-per-unit economics that volume manufacturing requires.

Teradyne Iris 100 was engineered for high-volume precision manufacturing with its spectrometer and high-resolution camera that measure the spectral response of the array, and per-pixel luminance and uniformity. Advanced test parallelization and image-processing algorithms enable characterization of a full array containing millions of microLEDs with high throughput. Leveraging Teradyne’s widely adopted IG-XL software, Iris 100 detects optical defects such as dead/stuck pixels and cluster defects early in the manufacturing process. Its NIST-traceable calibration workflow enables absolute measurements that correlate lots, wafers, and manufacturing sites.

“MicroLED is shifting from lab to volume production for both AR microdisplays and, increasingly, optical interconnects, which are becoming foundational to how AI data centers scale beyond copper,” said Shannon Poulin, president of the Semiconductor Test division at Teradyne. “Both technologies demand per-emitter test at production throughput, and Iris 100 delivers that today on test infrastructure our customers already run at scale.”

Teradyne Iris 100 follows the introduction of Teradyne Photon 100 for silicon photonics and co-packaged optics test earlier this year and the acquisition of photonic test specialist Quantifi Photonics in 2025, extending Teradyne’s test capabilities across the full spectrum of emerging optical test requirements. Iris 100 supports wafer and final test, letting manufacturers add microLED test to fleets they already run, with a roadmap to support photodetector test capabilities in the same insertion.

For more information, find Teradyne at ECOC, stand 2118, September 21-23 in Malaga, Spain, and visit teradyne.com/products/iris-100.

About Teradyne

Teradyne (NASDAQ: TER) designs, develops, and manufactures automated test equipment and advanced robotics systems. Its semiconductor and electronics test solutions span the full AI device supply chain, from wafer to data center, enabling customers to meet the quality and reliability standards the AI era demands. Its advanced robotics business deploys intelligent automation across manufacturing, logistics, and data center operations for customers worldwide. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.

For more information, contact:

Amy McAndrews

Investor Relations

Tel 978-370-3945

[email protected]

KEYWORDS: Europe Spain United States North America Massachusetts

INDUSTRY KEYWORDS: Technology Semiconductor Engineering Other Technology Manufacturing Hardware Electronic Design Automation Robotics Data Management Artificial Intelligence

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SEALSQ, WISeKey and Canton of Jura Sign MoU to Establish a Swiss Post-Quantum Semiconductor and Cybersecurity Center

DELÉMONT, Switzerland, Sept. 21, 2026 (GLOBE NEWSWIRE) —


Proposed CHF 40-60 million public-private initiative aims to establish sovereign semiconductor personalization capabilities in Switzerland and create up to 250+ direct jobs in the Canton of Jura

SEALSQ Corp (NASDAQ: LAES) (“SEALSQ” or “Company”), a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products, its parent company, WISeKey International Holding Ltd (SIX: WIHN; NASDAQ: WKEY), (“WISeKey” or “the Company”) a global leader in cybersecurity, digital identity and IoT, and The Republic and Canton of Jura, Switzerland, today announced the signing of a Memorandum of Understanding (“MoU”) to collaborate on the establishment of a Post-Quantum Semiconductor and Cybersecurity Center (the “Jura Center”) in the Canton of Jura.

The proposed Jura Center represents an indicative investment of approximately CHF 40-60 million over a period of six years. The initiative is intended to establish a strategic Swiss capability for the design, personalization, testing and secure provisioning of next-generation post-quantum semiconductor technologies.

At the heart of the project will be SEALSQ’s QS7001 Quantum Shield, a secure semiconductor designed to implement post-quantum cryptographic algorithms standardized by the U.S. National Institute of Standards and Technology, including ML-KEM and ML-DSA.

The Jura Center is expected to establish capabilities for cryptographic root-of-trust injection, secure firmware personalization, testing and certification, complemented progressively by ASIC design capabilities.

Building a Swiss Sovereign Semiconductor Capability

The initiative is designed to combine SEALSQ and WISeKey’s cybersecurity and semiconductor technologies with the Canton of Jura’s longstanding expertise in precision manufacturing, microtechnology and high-quality industrial production.

The project seeks to transfer skills deeply rooted in Jura’s watchmaking and microtechnology industries – including precision, quality control and traceability – into secure semiconductor personalization.

The project aims to establish approximately 40 direct jobs within two years, 150 by Year 5 and more than 250 by Year 8. At least 60% of these positions are expected to be filled by residents of the Canton.

A Public-Private Partnership

The Jura Center is expected to be developed as a public-private partnership, with the majority of its financing coming from WISeKey, SEALSQ, private investors and industrial partners. The Canton of Jura would act as a strategic catalyst, facilitating the establishment of the project and evaluating potential support within the applicable cantonal and federal frameworks.

The parties will also explore cooperation with HE-Arc Ingénierie for training, recruitment and applied research and with relevant Swiss technology and industrial organizations.

Building on the Quantix Model

This initiative builds upon the experience of Quantix Edge Security, the EUR 40 million semiconductor design and personalization center being developed in Murcia, Spain, by WISeKey and SEALSQ with Spanish partners.

The Spanish Government, through the Sociedad Española de Transformación Tecnológica (SETT), committed EUR 19.6 million to that public-private initiative in June 2025. The Jura Center intends to adapt the experience and methodologies developed in Murcia to Switzerland’s specific industrial and sovereignty requirements.

Strategic Opportunity for Switzerland

The Center will also evaluate opportunities associated with Swiss defense procurement and armasuisse industrial participation programs, where secure semiconductor and ASIC capabilities established on Swiss territory could potentially provide an attractive platform for industrial offset projects.

Secure semiconductors and ASICs are increasingly relevant to avionics, secure communications, sensors and other defense systems, creating an opportunity to strengthen Switzerland’s domestic technological and industrial base.

Carlos Moreira, CEO of SEALSQ, said: “The quantum era is transforming cybersecurity into an issue of technological sovereignty. Switzerland must be able not only to design advanced security technologies, but also to personalize, provision and protect the cryptographic roots of trust inside semiconductors on Swiss soil. The Jura has an extraordinary industrial culture built around precision, reliability and microtechnology. Our ambition is to combine this industrial DNA with SEALSQ’s post-quantum semiconductor technology and create a new strategic capability for Switzerland. We are already applying this model in Murcia, where the initiative generated initial revenue during the second quarter of 2026. Based on this early commercial progress, believe the Jura Center can become an important European center for post-quantum semiconductor security, creating highly qualified employment, strengthening the regional technology ecosystem while reinforcing Switzerland’s technological sovereignty.”

Stéphane Theurillat, Minister of Economy of the Canton of Jura added, “This partnership marks an important milestone for Jura and sends a strong signal about our ambition to attract and develop strategic investments. The project combines digital infrastructure with Jura’s strong industrial capabilities and will contribute to further diversifying our economy. It also represents a significant opportunity to strengthen digital sovereignty while creating value and new business opportunities within our regional ecosystem. The Government of the Republic and Canton of Jura strongly welcomes this announcement and is fully committed to supporting the project. Together with the relevant authorities and services, we will work closely with the company to facilitate a fast and successful establishment in Jura and create the conditions for its long-term development.”

Next Steps

Following the MoU, the parties intend to establish a joint working group to develop the detailed business plan, select the site, structure the public-private financing model, develop academic and industrial partnerships, evaluate Swiss federal and armasuisse opportunities, and establish the regulatory and certification roadmap.

The concept envisages the Center operating through a Swiss company incorporated in the Canton of Jura, supported by an appropriate public-private governance structure.

Upon completion of this preparatory work, the Parties intend to move from the MoU to a detailed implementation framework governing the establishment, financing and operation of the Jura Center..

About WISeKey

WISeKey International Holding Ltd (“WISeKey”, SIX: WIHN; Nasdaq: WKEY) is a global leader in cybersecurity, digital identity, and IoT solutions platform. It operates as a Swiss-based holding company through several operational subsidiaries, each dedicated to specific aspects of its technology portfolio. The subsidiaries include (i) SEALSQ Corp (Nasdaq: LAES), which focuses on semiconductors, PKI, and post-quantum technology products, (ii) WISeKey SA, which specializes in RoT and PKI solutions for secure authentication and identification in IoT, blockchain, and AI, (iii) WISeSat AG which focuses on space technology for secure satellite communication, specifically for IoT applications, (iv) WISe.ART Corp which focuses on trusted blockchain NFTs and operates the WISe.ART marketplace for secure NFT transactions, and (v) SEALCOIN AG which focuses on decentralized physical internet with DePIN technology and houses the development of the SEALCOIN platform.

Each subsidiary contributes to WISeKey’s mission of securing the internet while focusing on their respective areas of research and expertise. Their technologies seamlessly integrate into the comprehensive WISeKey platform. WISeKey secures digital identity ecosystems for individuals and objects using blockchain, AI, and IoT technologies. With over 1.6 billion microchips deployed across various IoT sectors, WISeKey plays a vital role in securing the Internet of Everything. Trusted by the OISTE/WISeKey cryptographic Root of Trust, WISeKey provides secure authentication and identification for IoT, blockchain, and AI applications. The WISeKey Root of Trust ensures the integrity of online transactions between objects and people. For more information on WISeKey’s strategic direction and its subsidiary companies, please visit www.wisekey.com.

About SEALSQ:

SEALSQ is a leading innovator in Post-Quantum Technology hardware and software solutions. Our technology seamlessly integrates Semiconductors, PKI (Public Key Infrastructure), and Provisioning Services, with a strategic emphasis on developing state-of-the-art Quantum Resistant Cryptography and Semiconductors designed to address the urgent security challenges posed by quantum computing. As quantum computers advance, traditional cryptographic methods like RSA and Elliptic Curve Cryptography (ECC) are increasingly vulnerable.

SEALSQ is pioneering the development of Post-Quantum Semiconductors that provide robust, future-proof protection for sensitive data across a wide range of applications, including Multi-Factor Authentication tokens, Smart Energy, Medical and Healthcare Systems, Defense, IT Network Infrastructure, Automotive, and Industrial Automation and Control Systems. By embedding Post-Quantum Cryptography into our semiconductor solutions, SEALSQ ensures that organizations stay protected against quantum threats. Our products are engineered to safeguard critical systems, enhancing resilience and security across diverse industries.

For more information on our Post-Quantum Semiconductors and security solutions, please visit www.sealsq.com.

Forward-Looking Statements

This communication expressly or implicitly contains certain forward-looking statements concerning SEALSQ Corp and its businesses. Forward-looking statements include statements regarding our business strategy, financial performance, results of operations, market data, events or developments that we expect or anticipate will occur in the future, as well as any other statements which are not historical facts. Although we believe that the expectations reflected in such forward-looking statements are reasonable, no assurance can be given that such expectations will prove to have been correct. These statements involve known and unknown risks and are based upon a number of assumptions and estimates which are inherently subject to significant uncertainties and contingencies, many of which are beyond our control. Actual results may differ materially from those expressed or implied by such forward-looking statements. Important factors that, in our view, could cause actual results to differ materially from those discussed in the forward-looking statements include SEALSQ’s ability to continue beneficial transactions with material parties, including a limited number of significant customers; market demand and semiconductor industry conditions; and the risks discussed in SEALSQ’s filings with the SEC. Risks and uncertainties are further described in reports filed by SEALSQ with the SEC.

SEALSQ Corp is providing this communication as of this date and does not undertake to update any forward-looking statements contained herein as a result of new information, future events or otherwise.

SEALSQ Corp.
Carlos Moreira
Chairman & CEO
Tel: +41 22 594 3000
[email protected]
SEALSQ Investor Relations (US)
The Equity Group Inc.
Lena Cati
Tel: +1 212 836-9611
[email protected]



UVJC to Launch NovaJet at WESEMiBAY as Semiconductor Industry Looks Beyond Traditional Scaling

UVJC to Launch NovaJet at WESEMiBAY as Semiconductor Industry Looks Beyond Traditional Scaling

  • NovaJet, the first commercial system built on UVJC’s Universal Vapor Jet Printing, makes its debut at Booth 8G03 during the WESEMiBAY Semiconductor Ecosystem Conference and Expo in Shenzhen from 14 to 16 October
  • UVJC will introduce its dry, solvent-free and maskless thin-film deposition technology to manufacturers seeking precise, flexible and efficient paths from materials research to production.

SINGAPORE–(BUSINESS WIRE)–Universal Vapor Jet Corporation (UVJC), a wholly-owned subsidiary of Universal Display Corporation (UDC) (Nasdaq: OLED), is set to unveil NovaJet, the first commercial system built on its proprietary Universal Vapor Jet Printing (UVJP) platform, at the WESEMiBAY Semiconductor Ecosystem Conference and Expo in Shenzhen, China, from 14 to 16 October 2026.

The launch marks UVJC’s first trade show appearance and introduces the company’s dry, solvent-free and maskless approach to thin-film deposition to one of Asia’s most important semiconductor ecosystems.

At Booth 8G03, a scale model of NovaJet will serve as the centerpiece of UVJC’s display, alongside coated substrates and printed samples produced on the production system installed and operating at its headquarters and R&D facility in Singapore.

“NovaJet is an important step in bringing UVJP closer to real-world manufacturing,” said Mr Chandran Nair, Chief Executive Officer of UVJC. “We look forward to introducing this advanced system to customers, partners and researchers attending WESEMiBAY, and discussing how UVJP can support a more precise, flexible and efficient path from materials research through manufacturing.”

Nair, together with UVJC’s Head of Business Development in China, Li Jiafan, will also present at the conference on “Enabling Dry and Patterned Thin-Film Printing for Next-Generation Manufacturing” on 15 October 2026, providing attendees with a deeper look at UVJP and its potential applications across semiconductor and advanced electronics manufacturing.

Demand for deposition methods that can deliver greater manufacturing precision, flexibility and process control continues to grow as the industry moves towards more complex device architectures, advanced packaging and new material systems.

A dry vapour-phase process for digitally patterned thin-film deposition, UVJP enables precise placement of functional materials directly onto substrates, while reducing process steps associated with solvents, masks, drying and lithography-related methods.

The process also works without substrate heating, making it suitable for delicate, non-planar and temperature-sensitive surfaces. It can support multiple materials and graded compositions in a single step, opening a broad range of potential applications across semiconductors and electronics, as well as life sciences and renewable energy.

Manufacturers, research institutions and industry partners interested in learning more about NovaJet and UVJP are invited to meet with the UVJC team at Booth 8G03 during WESEMiBAY. To schedule a meeting, discuss evaluation opportunities or pilot programs, contact [email protected].

About Universal Vapor Jet Corporation

Universal Vapor Jet Corporation (UVJC), a wholly-owned subsidiary of Universal Display Corporation (UDC), is at the forefront of developing cutting-edge tools and processes that bridge the gap between laboratory research and industrial-scale applications.

Leveraging its proprietary Universal Vapor Jet Printing (UVJP) technology, UVJC offers scalable, solvent-free, and maskless thin-film print and deposition solutions across a spectrum of industries, including semiconductors, electronics, life sciences and renewable energy. The innovative technology is designed to meet the growing demands of precision manufacturing while offering greater efficiency and sustainability. Established in 2024, UVJC is headquartered in Singapore.

To learn more about Universal Vapor Jet Corporation, please visit www.uvjc.com.

Media contacts

UVJC Communications

[email protected]

KEYWORDS: China Singapore Southeast Asia Asia Pacific

INDUSTRY KEYWORDS: Chemicals/Plastics Semiconductor Alternative Energy Energy Manufacturing Technology Nanotechnology Other Manufacturing Science Biotechnology Packaging Other Science Health Engineering Research

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Telix and ITM Join Forces to Create a Radiopharmaceutical Powerhouse

  • Transformational merger reinforces Telix’s long-term growth strategy as a vertically integrated radiopharmaceutical company with enhanced capabilities across development, isotope production and global manufacturing, underpinned by commercial excellence and the industry’s most extensive therapeutic pipeline.
  • ITM is the world’s leading supplier of therapeutic radioisotopes, with broad capabilities spanning lutetium-177 (177Lu), actinium-225 (225Ac) and terbium-161 (161Tb) production.
  • ITM is the only producer of globally scaled commercial-grade 177Lu and serves as a key supplier for both commercially available and future therapeutic radiopharmaceuticals.
  • ITM’s commercial-scale and profitable isotope production business significantly contributes to cash generation while deepening Telix’s supply chain for isotopes required for its therapeutics pipeline.
  • ITM’s complementary pipeline includes ITM-11 (177Lu-edotreotide), a novel therapeutic candidate for the treatment of gastroenteropancreatic neuroendocrine tumors (GEP-NETs), which has successfully completed Phase 3 development, potentially accelerating Telix’s entry into a validated commercial market for targeted radionuclide therapy (TRT).
  • Upfront consideration of US$1.65 billion on a cash-free/debt-free basis. After adjustments, ITM Shareholders are expected to be paid approximately US$1.25 billion in Telix Shares at US$11.841 per share, released as Nasdaq ADRs after the respective escrow periods.
  • Additional contingent consideration of up to US$700 million upon achievement of future regulatory approvals and commercial sales milestones for ITM-11.
  • The transaction is subject to Telix Shareholder approval and other customary closing conditions.

MELBOURNE, Australia and INDIANAPOLIS and MUNICH, Sept. 21, 2026 (GLOBE NEWSWIRE) — Telix Pharmaceuticals Limited (ASX: TLX, NASDAQ: TLX, “Telix”) today announces it has signed a strategic agreement to lead a merger with ITM Isotope Technologies Munich SE (“ITM”), a global leader in radioisotope production and radiopharmaceutical development.

The merger will further strengthen Telix’s leadership as a vertically integrated radiopharmaceutical company with the capabilities required to develop, manufacture and deliver innovative treatments to patients globally. The combined organization will be uniquely positioned as a radiopharmaceutical industry leader, differentiated by a world-class scaled isotope manufacturing business with a validated global distribution network, a market-leading commercial precision medicine platform and the industry’s most extensive therapeutic radiopharmaceutical pipeline.

Founded in 2004, ITM is a private company with a leading commercial scale radioisotope manufacturing and global distribution network spanning over 65 countries. ITM is a key supplier of 177Lu and – with a compound annual growth rate (CAGR) of 40% from 2021 to 2025 – delivered annual revenue of US$273 million in 20252. This commercial momentum is underpinned by increasing global demand for TRT and radioisotopes for commercially approved products and assets under clinical development. The global nuclear medicine market is forecast to reach US$41 billion by 20343.

ITM’s late-stage novel pipeline is complementary to Telix and includes ITM-11 (177Lu-edotreotide), a differentiated somatostatin receptor (SSTR)-targeted treatment for GEP-NETs. ITM-11 has completed a successful Phase 3 trial (COMPETE, NCT03049189)4 and fully enrolled a second indication expansion Phase 3 study (COMPOSE, NCT04919226) with an interim analysis expected in H1 2027. If approved, ITM-11 has the potential to accelerate Telix’s entry into the commercial therapeutic market and expand its presence in neuroendocrine tumors, a commercially validated and clinically significant market for TRT.

The combined organization is expected to generate unaudited pro forma 2026 revenue and income exceeding US$1.3 billion5, based on management estimates. ITM’s radioisotope manufacturing business is profitable and generates cash flow. Continued growth from manufacturing, cost savings and further targeted synergies and pipeline optimization are expected to support a positive EBITDA6 contribution in 20277 and onward. If approved by health regulators, the launch of ITM-11 is expected to drive further upside, with the potential to generate additional high-margin therapeutic revenue in the near term.

Telix Managing Director and Group CEO, Dr. Christian Behrenbruch, said, “This merger positions Telix at the forefront of the consolidation that is occurring as the industry matures. ITM is the leader in radioisotope production, with deep scientific expertise and a track record of value-adding innovation. We have enjoyed a close working relationship with ITM for many years and there is strong management alignment for the rationale behind this transaction. By combining our complementary strengths, we will create a company with commercial scale, world-leading supply and the most exciting theranostic drug portfolio in the sector. Importantly, this combination further expands our late-stage therapeutic pipeline with two completed Phase 3 trials and deepens radioisotope security, while bringing together the mission-critical capabilities needed to deliver radiopharmaceutical treatments to patients around the world.”

ITM Chief Executive Officer, Dr. Andrew Cavey, added, “Joining two radiopharmaceutical pioneers creates a company with unmatched breadth and depth across the value chain, supported by deep expertise and talent. Our management teams have a track record of working together and a nuanced understanding of our respective commercial strengths and customer relationships. Together, we believe Telix and ITM will be uniquely positioned to capitalize on rapidly growing global demand for radiopharmaceuticals to the benefit of both shareholders and patients.”

Deal Terms

Under the terms of the agreement and subject to Shareholder approval, Telix will acquire 100% of the shares in ITM for US$1.65 billion upfront on a cash-free/debt-free basis expected as follows:

  • US$1.25 billion will be paid to the sellers in the form of 105.8 million Telix shares (priced at the 30-day trailing VWAP as of signing of US$11.841) and released to the sellers as Nasdaq-listed ADRs at the end of their respective escrow periods;
  • US$302 million of net debt will be assumed by Telix at closing; and
  • US$96 million of management equity rollover and transaction expenses payable by the sellers8; and in each case subject to closing adjustments.

Additional contingent consideration of up to US$700 million will become payable upon the achievement of specified regulatory approvals and sales milestones for ITM-11 as set out below:

  • Up to US$250 million upon U.S. Food and Drug Administration (FDA) approval of ITM-11 across three different indications:
    • US$100 million upon FDA approval for expected first indication in G1-G2 GEP-NETs no later than December 31, 2027;
    • US$100 million upon FDA approval for G2-G3 GEP-NETs indication no later than December 31, 2030; and
    • US$50 million upon FDA approval for Lung NETs indication no later than December 31, 2031; and
  • Up to US$450 million based on ITM-11 net global sales in FY 2030 in excess of US$150 million.

All milestone consideration will be payable in cash or Shares9 at Telix’s election10. Consideration paid to ITM Shareholders at closing is subject to financial adjustments at closing, indemnity holdbacks, and escrow (lockup) restrictions on the Shares issued at closing of up to 15 months which may be waived in limited part to allow the sellers to pay their tax and transaction expense liabilities.

Upon completion of the transaction, Telix Shareholders will own approximately 76.3% and ITM Shareholders will own approximately 23.7% of Telix shares on issue. The transaction has been approved by Telix’s Board of Directors and, as of signing, Shareholders holding over 90%11 of ITM’s Shares. The transaction is expected to close by the end of FY 2026 subject to Telix Shareholder approval as required under the ASX Listing Rules, regulatory approvals, and other customary closing conditions.

Refer to the Investor Presentation lodged today with the ASX for further information on the transaction.

A Notice of Meeting will be sent to Telix Shareholders for an extraordinary general meeting expected to be held in November 2026.

Advisors

Morgan Stanley Australia Limited acted as exclusive financial advisor to Telix. Sidley Austin LLP and Herbert Smith Freehills Kramer LLP acted as legal counsel to Telix. Centerview Partners acted as exclusive financial advisor to ITM. Latham & Watkins LLP acted as legal counsel to ITM.

About ITM Isotope Technologies Munich SE

ITM, a leading radiopharmaceutical biotech company, is dedicated to providing a new generation of radiopharmaceutical therapeutics and diagnostics for hard-to-treat tumors. The company aims to meet the needs of cancer patients, clinicians, and partners through excellence in development, production, and global supply of medical radioisotopes. With improved patient benefit as the driving principle for all it does, ITM advances a broad precision oncology pipeline, including multiple Phase 3 studies, combining the company’s high-quality radioisotopes with a range of targeting molecules. By leveraging two decades of pioneering radiopharma expertise, its respected industry position and its established global network, ITM strives to provide patients with more effective targeted treatment to improve clinical outcomes and quality of life.

ITM is headquartered in Munich, Germany with two GMP manufacturing sites and a global distribution network spanning 65 countries. Through its agreement with Isogen, ITM has 15-year exclusive access to Bruce Power’s nuclear reactors in Canada for the irradiation services required to manufacture 177Lu. For further information, visit: www.itm-radiopharma.com

About
Telix Pharmaceuticals Limited

Telix Pharmaceuticals (ASX: TLX, NASDAQ: TLX) is a commercial-stage global radiopharmaceutical company, advancing targeted theranostics to improve outcomes for people with cancer across the patient journey. Theranostics pairs a precision diagnostic with a targeted therapy to both diagnose and treat disease.

Telix’s commercial franchise is anchored by its precision diagnostics portfolio: Illuccix® (kit for the preparation of gallium-68 gozetotide injection), commercially available in 22 countries including the U.S., and Gozellix® (kit for the preparation of gallium-68 gozetotide injection), approved by the U.S. Food and Drug Administration (FDA) for prostate imaging, and Pixclara® (floretyrosine F 18) approved by the FDA for glioma imaging. The Company’s late-stage therapeutic pipeline includes three investigational assets in pivotal-stage trials: TLX591-Tx (lutetium-177 (177Lu) rosopatamab tetraxetan) in prostate cancer, TLX101-Tx (iodofalan 131I) in recurrent glioblastoma, and TLX250-Tx (lutetium (177Lu) girentuximab tetraxetan) in kidney cancer, additionally complemented by a deep pipeline of next generation candidates. TLX591-Tx, TLX101-Tx and TLX250-Tx have not received marketing authorizations in any jurisdiction.

Telix is headquartered in Melbourne, Australia, with operations across North America, Europe, Latin America and Asia-Pacific. For more information, visit www.telixpharma.com or follow Telix on LinkedIn, X and Facebook.

Investor Relations
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This announcement has been authorized for release by the Telix Pharmaceuticals Limited Disclosure Committee on behalf of the Board.

Legal Notices

Cautionary Statement Regarding Forward-Looking Statements.

You should read this announcement together with our risk factors, as disclosed in our most recently filed reports with the Australian Securities Exchange (ASX), U.S. Securities and Exchange Commission (SEC), including our Annual Report on Form 20-F filed with the SEC, or on our website.

The information contained in this announcement is not intended to be an offer for subscription, invitation or recommendation with respect to securities of Telix Pharmaceuticals Limited (Telix) in any jurisdiction, including the United States. The information and opinions contained in this announcement are subject to change without notification. To the maximum extent permitted by law, Telix and ITM disclaim any obligation or undertaking to update or revise any information or opinions contained in this announcement, including any forward-looking statements (as referred to below), whether as a result of new information, future developments, a change in expectations or assumptions, or otherwise. No representation or warranty, express or implied, is made in relation to the accuracy or completeness of the information contained or opinions expressed in the course of this announcement.

This announcement may contain forward-looking statements, including within the meaning of the U.S. Private Securities Litigation Reform Act of 1995, that relate to anticipated future events, financial performance, plans, strategies or business developments. Forward-looking statements can generally be identified by the use of words such as “may”, “expect”, “intend”, “plan”, “estimate”, “anticipate”, “believe”, “outlook”, “forecast” and “guidance”, or the negative of these words or other similar terms or expressions. Forward-looking statements involve known and unknown risks, uncertainties and other factors that may cause Telix or ITM’s actual results, levels of activity, performance or achievements to differ materially from any future results, levels of activity, performance or achievements expressed or implied by these forward-looking statements. Forward-looking statements are based on Telix’s and, as applicable, ITM’s good-faith assumptions as to the financial, market, regulatory and other risks and considerations that exist and affect Telix or ITM’s respective businesses and operations in the future and there can be no assurance that any of the assumptions will prove to be correct. In the context of Telix and ITM’s respective businesses, forward-looking statements may include, but are not limited to, statements about: the initiation, timing, progress, completion and results of preclinical and clinical trials, and research and development programs; ability to advance product candidates into, enroll and successfully complete, clinical studies, including multi-national clinical trials; the timing or likelihood of regulatory filings and approvals for product candidates, including the planned NDA resubmission for ITM-11 and the planned BLA resubmission for TLX250-Px, manufacturing activities and product marketing activities; sales, marketing and distribution and manufacturing capabilities and strategies; the commercialization of product candidates, if or when they have been approved; the parties’ ability to obtain an adequate supply of raw materials at reasonable costs for their respective products and product candidates; estimates of expenses, future revenues and capital requirements; the parties’ financial performance; developments relating to the parties’ respective competitors and industry; the anticipated impact of U.S. and foreign tariffs and other macroeconomic conditions on the parties’ respective businesses, including as a result of war or other geopolitical conflicts; and the pricing and reimbursement of the parties’ product candidates, if and after they have been approved. Telix or ITM’s actual results, performance or achievements may be materially different from those which may be expressed or implied by such statements, and the differences may be adverse. Accordingly, you should not place undue reliance on these forward-looking statements.

Trademarks and Trade Names. All trademarks and trade names referenced in this press release are the property of Telix Pharmaceuticals Limited (Telix) or, where applicable, the property of ITM or their respective owners. For convenience, trademarks and trade names may appear without the ® or ™ symbols. Such omissions are not intended to indicate any waiver of rights by Telix, ITM or the respective owners. Trademark registration status may vary from country to country. Telix and ITM do not intend the use or display of any third-party trademarks or trade names to imply any affiliation with, endorsement by, or sponsorship from those third parties.

©2026 Telix Pharmaceuticals Limited and ITM Isotope Technologies Munich SE. All rights reserved.

                                  

1 Based on the 30-day trailing VWAP on the ASX prior to signing of A$16.65, converted at an AUD/USD exchange rate of 0.71.
2 ITM audited financial statements (2025).
3 MEDraysintell Current Landscape of the Nuclear Medicine Market, 2025 edition.
4 Walter T, et al. The Lancet, July 2, 2026.
5 Refer to slide 20 of the Investor Presentation released by Telix to the ASX in conjunction with this announcement.
6 Earnings before interest, tax, depreciation and amortization.
7 Subject to the realization of targeted synergies and commercial timing assumptions. Excludes one-off implementation costs.
8 Sellers may allocate and sell some of the Telix Shares deducted from closing consideration to settle a portion of these transaction expenses.
9 Priced and settled at the 30-day trailing VWAP prior to milestone achievement and converted to Nasdaq ADRs.
10 Telix will seek Shareholder approval for the issue of Shares for the milestone payments based on Telix share price at signing.
11 Remaining ITM shareholders expected to sign Joinder Agreements to the Share Purchase Agreement prior to closing.



Faraday Future Founder and Global CEO YT Jia Weekly Investor Update: Shares Details from FF’s 919 FF EAI Robotics “Four-Core Full-Stack AI” Ecosystem New Product Series Launch; Four Industry Productivity Solutions, Nine New EAI Devices Unveiled

Faraday Future Founder and Global CEO YT Jia Weekly Investor Update: Shares Details from FF’s 919 FF EAI Robotics “Four-Core Full-Stack AI” Ecosystem New Product Series Launch; Four Industry Productivity Solutions, Nine New EAI Devices Unveiled

  • Launching nine new EAI Devices across five models, three product series, and two major robot forms, all on sale now, and available for immediate delivery. With this lineup, FF becomes the U.S. robotics company with the widest range of EAI Device forms, the broadest size coverage, and the largest number of product models.
  • FF has established a “Light on Four, Heavy on Four” operating model, remaining light on capital, assets, marketing and sales while focusing on product strength, AI, real-world utility and users to improve the efficiency of strategy execution.
  • FF Master Mini starts at $9,990 and is North America’s first compact EAI humanoid robot priced below $10,000 to combine programming education, open development and sports competition. Both FX Aegis Mega configurations are priced at $74,990 and offer exceptional value among mid-sized industrial robot dogs in the U.S. market.
  • As of the end of August, cumulative shipments and sales of FF EAI robots reached 552 units. In the Q2 financial results we released, the average contribution margin on our robotics products was approximately 30%.

LOS ANGELES–(BUSINESS WIRE)–Faraday Future Intelligent Electric Inc. (NASDAQ: FFAI) (“Faraday Future”, “FF” or the “Company”), a California-based global Embodied AI (EAI) ecosystem company, today shared a weekly business update from YT Jia, Founder and Global CEO of FF.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260920309558/en/

Faraday Future Founder and Global CEO YT Jia Weekly Investor Update: Shares Details from FF’s 919 FF EAI Robotics “Four-Core Full-Stack AI” Ecosystem New Product Series Launch; Four Industry Productivity Solutions, Nine New EAI Devices Unveiled

Faraday Future Founder and Global CEO YT Jia Weekly Investor Update: Shares Details from FF’s 919 FF EAI Robotics “Four-Core Full-Stack AI” Ecosystem New Product Series Launch; Four Industry Productivity Solutions, Nine New EAI Devices Unveiled

“Hello from weekly report issue No. 73, our special edition for the 919 FF EAI Robotics “Four-Core Full-Stack AI” Ecosystem New Product Series Launch. Hello to all our users, customers, investors, and Futurists around the world! Welcome to our annual 919 event! Take a look. This is what we are building: the world’s one-of-a-kind “One-Brain Multi-Form Multi-Capability” FF EAI Robot World 2.0. Pretty incredible, right? How has FF, in less than a year, built a “Four-Core Full-Stack AI” EAI Robotics Ecosystem that is already gaining a competitive edge? And how have we completed Robot World 2.0 with 24 EAI Devices within the EAI Devices Core? I think there are five key reasons.

The first is our forward-looking strategy and our business model. Back in February, we introduced what we believe will be a major direction for the robotics industry: “One Brain, Multiple Forms; Multiple Forms, Multiple Capabilities.” Some of our industry peers, including Figure, are following a “One Form Does It All” approach. We respect their work, but we believe this approach has clear limits and will not be the best long-term path for robotics. Dr. Fei-Fei Li recently shared a similar view that different robot forms will coexist.

We have also developed a business model that we call “Light on Four, Heavy on Four.” We stay light on capital, assets, marketing, and sales. At the same time, we put our greatest focus on product power, AI, real-world utility, and our users. This helps us move from strategy to execution much faster. And the results are starting to show. As of the end of August, cumulative shipments and sales of FF EAI robots reached 552 units. In the Q2 financial results we released, the average contribution margin on our robotics products was approximately 30%. These results are also a strong sign that users recognize the real-world value of our Four-Core Full-Stack AI robots.

The second reason is how we develop our products and technology: through in-house development plus open collaboration. We are bringing 12 years of AI technology and industry capabilities from FF’s automotive business into EAI Robotics. This foundation has helped us build our Four-Core Full-Stack AI Ecosystem and create a self-evolving flywheel across its four cores. Within the EAI Devices Core, the full FF EAI Robot World 2.0 lineup is now complete. Our “Built in USA” program is also moving forward according to its three-phase timeline. It will cover future generations of the nine EAI Devices being unveiled today.

The third reason is our work in supply chain, manufacturing, and compliance. Through the “Built in USA” Acceleration Program, we are bringing the capabilities and resources developed over many years in the EAI EV industry into EAI Robotics. This helps us turn our existing strengths into competitive advantages much faster.

The fourth reason is our user ecosystem. We give customers three ways to access our products: the EAI Device, the EAI Device + Skills, and the EAI Device + Industry Solutions. Together with our “6+1” Direct Sales and Robot-Sharing Rental Network, these offerings allow us to serve both B2B and B2C markets and continue supporting customers after delivery. A one-time product sale can grow into a long-term customer relationship and a continuing source of ecosystem revenue.

And the fifth reason is the industry alliance we are building. Through our Global EAI Industry Bridge and the EAI Robotics “Made in USA” Alliance, we are bringing more suppliers, customers, and capital partners into our ecosystem.

Today’s event will focus on new products from two of our four cores: the EAI Devices Core and the Industry Productivity Solutions Core. Let me give you a quick preview. There are five things to watch today.

First, EAI Devices. We are launching nine new EAI Devices across five models, three product series, and two major robot forms. They will go on sale today and be available for immediate delivery. With this lineup, FF becomes the U.S. robotics company with the widest range of EAI Device forms, the broadest size coverage, and the largest number of product models. For industries and users, this means an EAI Brain, solutions, and data, all covering the widest range of device forms.

Second, Industry Productivity Solutions. We will launch four EAI Robotics solutions for four key application areas: K–12 education, research, security, and inspection. These solutions give industries a repeatable path for putting robots into practical, real-world use.

Third, sales and delivery. Customers will have three product options: the EAI Device, the EAI Device + Skills, and the EAI Device + Industry Solutions. We are supporting these products through our “6+1” FF EAI Robotics Direct Sales and Robot-Sharing Rental Network, giving customers more ways to buy, deploy, and access our robots.

Fourth, RoboShare. RoboShare has officially signed an MOU with Hifivebot, a U.S. robot rental platform. It is also evaluating opportunities to expand the RoboShare network into more categories of AI devices, including autonomous shared mobility, and explore a broader asset-sharing service for Physical AI.

And fifth, our next global events. On September 23, FF will hold an EAI Robotics launch event in the Middle East with local partners. On September 28, we will hold part 2 of our EAI Robotics “Built in USA” Launch and Business Partner Conference. At the same time, we will exhibit at IROS 2026 in Pittsburgh. If you are attending, please visit us at Booth 932 to see our robots in action and speak with our team.

Now, let’s move to the EAI Devices Core. The nine new EAI Devices we are introducing today range in MSRP from $9,990 to $137,900. Our goal is to give customers the lowest possible price while delivering much more than the device itself. Every product is backed by a complete Four-Core Full-Stack AI Ecosystem built for extreme price-performance ratio. Our value formula is simple: “Lowest Price + Four-Core Value + Ongoing Service.”

Let me quickly walk you through the lineup. The All-New Futurist, our All-in-One Professional Expert, comes in two versions. The Standard version is priced at $89,900 and includes a Skills Package valued at $10,000. The Ultra version is priced at $129,900 and includes a Skills Package valued at $15,000.

The FF Master Mini—the all-rounder built to go from classroom to competition—comes in three configurations, with prices starting at $9,990. The starting price includes a Skills Package valued at $1,000. It is the first compact EAI humanoid robot in North America priced below $10,000 to bring education, development, and robotics competition together in one platform. For industrial applications, the FX Aegis Mega is our midsize industrial quadruped designed to deliver an extreme price-performance ratio in the U.S. market. Both configurations are priced at $74,990, and each includes a Skills Package valued at $8,000.

The FX Aegis Classic Ultra-W is our professional lightweight EAI wheel-legged quadruped designed for security and companionship. It is priced at $12,990 and includes a Skills Package valued at $3,000. And for large-scale industrial applications, the FX Aegis Hyper is priced at $137,900 and includes a Skills Package valued at $15,000.

Sales and delivery are now underway for all these new products. You can place your order through our official website, Amazon, RobotShop, and other sales channels. For more detailed product information, including compliance information, please visit our official website. Next, let’s turn to the Industry Productivity Solutions Core of FF EAI Robotics.

In July, we officially upgraded the FF EAI Robotics strategy to a Four-Core Full-Stack AI Ecosystem Strategy. By working together, these four cores give FF EAI a complete system-level advantage. This is what sets us apart from companies focused on only one EAI Device, one platform, or one single application. The most important advantage of our Solutions Core is its ability to turn a one-time robotics project into a standardized productivity asset that can be deployed again and again.

Today, we are launching EAI Robotics solutions for four key application areas across two major ecosystems. Our Education Ecosystem Solutions 1.0 is now officially complete. Right here, we are launching our K–12 Education Solution and Research Solution. At the same time, within our Security and Inspection Ecosystem, we are launching our Security Solution and Inspection Solution. We welcome customers from every industry to contact us for pricing, discuss your specific needs, and explore opportunities to work together. Our goal is to offer solutions with the highest ROI in the industry, so customers can achieve the greatest possible return on their investment, backed by reliable long-term service.

As more application scenarios connect to our ecosystem, more real-world data will be generated. Our Skills and Agents will also continue to improve. Step by step, we will turn Physical AI from isolated capabilities into real industry productivity that can scale. “EAI, solving real-world problems and shaping a civilization of human-machine symbiotic productivity.” Thanks for tuning in, I will see you next week!”

ABOUT FARADAY FUTURE

Founded in 2014, Faraday Future (FF) is a U.S.-based Physical AI ecosystem company dedicated to reshaping the future of robotics and mobility solutions through AI innovation and technologies. FF focuses on two major product strategies within the Embodied AI (EAI) robotics business: EAI humanoid and bionic robots, and EAI automotive-focused robots. By building a “Four-Core Full-Stack AI” ecosystem of EAI Brain and Developer Platform, EAI Devices, Industry Productivity Solutions and EAI Data Factory, FF aims to create an evolutionary flywheel: scaled device delivery, data collection and training, continuous evolution of the EAI Brain, stronger product capability, and even larger-scale delivery and deployment. Through this flywheel, FF seeks to maximize its commercial value and lead to the advancement of Physical AI. For more information, please visit Faraday Future’s official website: https://www.ff.com/

FORWARD LOOKING STATEMENTS

Important factors, that may affect actual results or outcomes include, among others: the Company’s ability to continue as a going concern and improve its liquidity and financial position; the Company’s ability to pay its outstanding obligations, which it currently lacks; the availability of sufficient share capital to meet its current obligations and execute on its strategy; the willingness of convertible debt investors to fund the Company; demand for the Company’s robotics products; the ability of B2B preorder companies to locate customers to purchase our robotics products, on which their nonbinding preorders substantially depend; competition in the robotics industry, which includes companies with far superior experience, funding and name recognition; the ability of the Company to build an EAI education ecosystem that serves both the B2C consumer market and the B2B institutional education market; the acceptance by teachers and students of the Company’s robotics products in the education market; the ability of the Company to expand into additional markets for its robotics products; the Company’s reliance on a single OEM for most of its robotics products; the Company’s reliance on Chinese OEMs for all of its robotics products; the possibility of the federal government banning imports of Chinese robotics products; the Company’s ability to get the planned robotics products to comply with all applicable U.S. rules and regulations; the ability of the robotics OEM to timely supply robotics to the Company; tariff uncertainty for imported products, particularly from China; demand from automobile dealers for robotics products; the Company’s ability to homologate FX vehicles for sale; the Company’s ability to secure the necessary funding to execute on the FX strategy, which is substantial; the Company’s ability to secure an occupancy certificate covering all of its Hanford facility; the Company’s ability to remediate its material weaknesses in internal control over financial reporting and the risks related to the restatement of previously issued consolidated financial statements; the Company’s limited operating history and the significant barriers to growth it faces; the Company’s history of substantial losses and expectation of continued losses; the success of the Company’s payroll expense reduction plan; the Company’s ability to execute on its plans to develop and market its vehicles and the timing of these development programs; the Company’s estimates of the size of the markets for its vehicles and cost to bring those vehicles to market; the rate and degree of market acceptance of the Company’s vehicles; the Company’s ability to cover future warranty claims; the success of other competing manufacturers; the performance and security of the Company’s vehicles; current and potential litigation involving the Company; the Company’s ability to receive funds from, satisfy the conditions precedent of and close on the various financings described elsewhere by the Company; the result of future financing efforts, the failure of any of which could result in the Company seeking protection under the Bankruptcy Code; the Company’s indebtedness; the Company’s ability to use its “at-the-market” program; insurance coverage; general economic and market conditions impacting demand for the Company’s products; potential negative impacts of a reverse stock split; potential cost, headcount and salary reduction actions may not be sufficient or may not achieve their expected results; circumstances outside of the Company’s control, such as natural disasters, climate change, health epidemics and pandemics, terrorist attacks, and civil unrest; risks related to the Company’s operations in China; the success of the Company’s remedial measures taken in response to the Special Committee findings; the Company’s dependence on its suppliers and contract manufacturer; the Company’s ability to develop and protect its technologies; the Company’s ability to protect against cybersecurity risks; and the ability of the Company to attract and retain employees, any adverse developments in existing legal proceedings or the initiation of new legal proceedings, and volatility of the Company’s stock price. You should carefully consider the foregoing factors and the other risks and uncertainties described in the “Risk Factors” section of the Company’s Form 10-Q for the quarter ended June 30, 2026, filed with the SEC on August 13, 2026; the quarter ended March 31, 2026, filed with the SEC on May 14, 2026, and Form 10-K filed with the SEC on March 31, 2026, and other documents filed by the Company from time to time with the SEC.

Investors (English): [email protected]
Investors (Chinese): [email protected]
Media: [email protected]

KEYWORDS: United States North America California

INDUSTRY KEYWORDS: Automotive Manufacturing Technology Manufacturing Specialty Robotics Security Other Manufacturing Retail Software Artificial Intelligence Hardware

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Faraday Future Founder and Global CEO YT Jia Weekly Investor Update: Shares Details from FF’s 919 FF EAI Robotics “Four-Core Full-Stack AI” Ecosystem New Product Series Launch; Four Industry Productivity Solutions, Nine New EAI Devices Unveiled
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Qfin Holdings Announces Changes in Management and Board Composition

SHANGHAI, China, Sept. 20, 2026 (GLOBE NEWSWIRE) — Qfin Holdings, Inc. (NASDAQ: QFIN; HKEx: 3660) (“Qfin Holdings” or the “Company”), a leading AI-empowered Credit-Tech platform in China, today announced changes in its senior management and the composition of its board of directors (the “Board”). In light of the growth and potential of the Company’s international business and its long-term strategic development, Mr. Haisheng Wu, the chief executive officer and a director of the Company, intends to focus more of his time on the development of the Company’s international business. In order to dedicate his attention to this area, Mr. Wu will step down as the chief executive officer and a director of the Company and will cease to be a member of the compensation committee of the Board.

The Board has approved the appointment of Mr. Yan Zheng as the chief executive officer and a director of the Company, succeeding Mr. Wu, effective September 21, 2026.

Prior to his appointment as the chief executive officer, Mr. Zheng served as the Company’s vice president from February 2017 and as its chief risk officer from July 2020. Mr. Zheng has 18 years of experience in consumer finance risk management. Before joining the Company, Mr. Zheng co-founded Shenzhen Samoyed Internet Finance Service Co. Ltd. in May 2015, and was in charge of its credit product risk management. Prior to that, Mr. Zheng worked at the risk management department at the headquarters of China Merchants Bank (Shanghai Stock Exchange: 600036) from November 2014 to April 2015 and was responsible for the preparation and establishment of China Merchants Union Consumer Finance Company Limited. Prior to that, Mr. Zheng worked at the risk management department of the Credit Card Center of China Merchants Bank from July 2008 to October 2014, primarily responsible for the consumer credit policies, credit limits and the preparation and establishment of China Merchants Union Consumer Finance Company Limited. Mr. Zheng received his bachelor’s degree in quantitative economics (Chinese-foreign) from Shanghai University of Finance and Economics in 2008 and his EMBA degree from Fudan University in 2025.

“Mr. Wu has made an invaluable contribution to the Company since the inception of our business and throughout his tenure as chief executive officer. On behalf of the Board, I would like to express our sincere gratitude to Mr. Wu for his leadership and dedication during his years of service. We are pleased that Mr. Wu will stay with the Company and focus on our international expansion, and he will work closely with Mr. Zheng to ensure a smooth transition of responsibilities. We are confident that Mr. Wu’s experience and insight will continue to provide valuable input to the Company’s long-term development,” said Mr. Fan Zhao, chairman of the Board. “We are delighted to welcome Mr. Zheng to the Board and appoint him as the Company’s chief executive officer. Mr. Zheng has 18 years of experience in consumer finance risk management, and we are confident that he will lead the Company into a new stage of business development. We look forward to working closely with him in maximizing long-term value for all of our shareholders.”

About Qfin Holdings

Qfin Holdings is a leading AI-empowered Credit-Tech platform in China. By leveraging its sophisticated machine learning models and data analytics capabilities, the Company provides a comprehensive suite of technology services to assist financial institutions and consumers and SMEs in the loan lifecycle, ranging from borrower acquisition, preliminary credit assessment, fund matching and post-facilitation services. The Company is dedicated to making credit services more accessible and personalized to consumers and SMEs through Credit-Tech services to financial institutions.

For more information, please visit: https://ir.qfin.com.

Safe Harbor Statement

Any forward-looking statements contained in this announcement are made under the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995. Forward-looking statements can be identified by terminology such as “will,” “expects,” “anticipates,” “future,” “intends,” “plans,” “believes,” “estimates” and similar statements. Among other things, the quotations from management in this announcement, as well as the Company’s strategic and operational plans, contain forward-looking statements. Qfin Holdings may also make written or oral forward-looking statements in its periodic reports to the U.S. Securities and Exchange Commission (“SEC”), in announcements made on the website of The Stock Exchange of Hong Kong Limited (the “Hong Kong Stock Exchange”), in its annual report to shareholders, in press releases and other written materials and in oral statements made by its officers, directors or employees to third parties. Statements that are not historical facts, including the Company’s beliefs and expectations, are forward-looking statements. Forward-looking statements involve inherent risks and uncertainties. A number of factors could cause actual results to differ materially from those contained in any forward-looking statement, which factors include but not limited to the following: the Company’s growth strategies, changes in laws, rules and regulatory environments, the recognition of the Company’s brand, market acceptance of the Company’s products and services, trends and developments in the credit-tech industry, governmental policies relating to the credit-tech industry, general economic conditions in China and around the globe, and assumptions underlying or related to any of the foregoing. Further information regarding these and other risks and uncertainties is included in Qfin Holdings’ filings with the SEC and announcements on the website of the Hong Kong Stock Exchange. All information provided in this press release is as of the date of this press release, and Qfin Holdings does not undertake any obligation to update any forward-looking statement, except as required under applicable law.

For more information, please contact:
Qfin Holdings
E-mail: [email protected]



Coherent Showcases Optical Innovations to Scale AI Infrastructure at ECOC 2026

SAXONBURG, Pa., Sept. 20, 2026 (GLOBE NEWSWIRE) — Coherent Corp. (NYSE: COHR), the global leader in photonics, today announced new optical technologies and live demonstrations designed to help customers scale AI infrastructure at the European Conference on Optical Communication (ECOC) 2026 in Málaga, Spain.

At Stand 2100, Hall 2, Coherent will showcase innovations spanning AI datacenter connectivity, co-packaged optics (CPO) and near-packaged optics (NPO), next-generation pluggable transceivers, optical transport, specialty fibers, optical circuit switching, advanced materials, and thermal management addressing rising power density.

PhotonLink™, a new integrated optics platforms which brings together Coherent’s critical optical technologies and integration capabilities to support CPO, NPO and emerging chip to chip connectivity. The platform combines components and complete optical assemblies with manufacturing at scale. Additional details about PhotonLink will be announced separately.

“Scaling AI infrastructure requires more than bandwidth – it requires solving power, integration and thermal challenges together,” said Dr. Sanjai Parthasarathi, Chief Marketing Officer at Coherent. “At ECOC, we are demonstrating how Coherent’s expertise across materials, components and optical systems helps customers address those challenges – from connections near compute to links between datacenters.”

FEATURED TECHNOLOGY DEMONSTRATIONS

Coherent’s demonstrations illustrate how its vertical integration across materials, devices, components, modules and systems supports different AI connectivity architectures including scale-across, scale-out, scale-up and chip to chip. Highlights include:


3.2T 2xDR4 Transceiver in an OSFP-Size Package


Coherent will demonstrate a compact 3.2T pluggable architecture with dual 1.6T optical paths in an OSFP-size package. The technology demonstration incorporates eight 425G PAM4 line-side optical lanes, Coherent Differential EMLs and Coherent photodiodes, highlighting progress toward next-generation 400G-per-lane optical connectivity.


6.4T NPO Optical Engine


A 6.4T NPO demonstration will showcase a compact and power-efficient optical engine for high-density AI Scale-Up and Scale-Out fabrics. The demonstration brings together silicon photonics, fiber attach technology, ELSFPs, and Coherent laser technology to illustrate the advantages of vertical integration across critical optical interfaces.


VCSEL-Based Optics for AI Scale-Up


Coherent will demonstrate high-density 2D VCSEL and photodiode arrays for highly parallel optical architectures in CPO and NPO low latency connectivity.


Full C-Band Pluggable Optical Line System


For DCI and Scale-Across applications, Coherent will showcase its LS200 full C-band pluggable optical line system for datacenter interconnect and transport applications. The compact architecture brings pluggable line-system functionality closer to the router or switch while supporting flexible point-to-point optical transport.

OPTICAL COMPONENTS, ASSEMBLIES AND MODULES

Coherent will also showcase new products and emerging technologies across its optical networking portfolio, including:

  • FlexConnect

    A detachable fiber array unit connector for CPO applications designed to simplify assembly and maintenance, with repeatable plug-unplug performance, interchangeability and an epoxy-free optical path compatible with high-power lasers.

  • OptiAlign

    A high-precision fiber array unit for CPO applications designed to support precise pitch control and high fiber-channel counts. Coherent combines an internally developed V-groove with customized fiber dimensions to address demanding optical alignment requirements.

  • OptiFocus

    A two-in-one coupling lens design for ELS, intended to simplify optical assembly while providing high coupling efficiency.

  • FiberPack

    A passive fiber assembly kit for scale-up and scale-out architectures that integrates fiber attach, micro-lens, tray, and termination technologies, drawing on Coherent’s vertically integrated optical-components manufacturing.

  • OptiPolar Array X

    A multi-channel Polarization Beam Splitter Array in a super-compact form factor based on glass material optimized for multi-lane systems.

  • 2D micro-VCSEL and PD array

    High Density 2D Array of individually addressable emitters and PD array with integrated lenses designed for flip chip bonding in NPO or CPO architectures.

  • Specialty Fibers

    Tight geometry-controlled Polarization Maintaining Fiber; Mode-Matched Fiber for improved coupling efficiency into edge-coupled silicon photonics; and multi-core fiber for high-density AI datacenter solutions.
  • Ultra-High-Power (UHP) CW laser

    Enabled by a proprietary design and advanced manufacturing processes, this ultra-high-power continuous-wave (CW) laser delivers high spectral stability, narrow linewidth, and low relative intensity noise (RIN) across its full operating range.
  • Pluggable Optical Line System (POLS)

    A full C-band optical line system with a high-power, variable-gain amplifier in a compact QSFP form factor. Designed for 800G ZR/ZR+ digital coherent optics, it supports up to 32 DWDM wavelengths over a single fiber pair, carrying up to 25.6Tbps across links from 2km to 200km.

THERMAL MANAGEMENT FOR HIGH DENSITY AI INFRASTRUCTURE

Coherent will also showcase Thermadite™ materials, diamond-based solutions and other advanced materials and components designed to address the growing power density and cooling requirements of AI infrastructure.

PARTNER AND QUANTUM TECHNOLOGY DEMONSTRATIONS

Coherent will participate in OIF interoperability and, separately, demonstrate quantum technologies for networking and encryption applications with industry partners.

With Quside, Coherent will demonstrate quantum random number generation for encryption applications using live quantum entropy alongside Coherent optical connectivity. With CUbIQ, Coherent will participate in a quantum key distribution demonstration in a compact pluggable architecture.

INDUSTRY THOUGHT LEADERSHIP AT ECOC 2026

Coherent executives and technology experts will contribute to Market Focus sessions and the ECOC technical program, covering AI datacenter infrastructure, CPO, optical interconnect scaling, advanced materials, coherent-lite optics and satellite connectivity.

MARKET FOCUS


Monday, September 21, 2026

Cooling Smarter: How Advanced Materials Unlock Datacenter Efficiency
Speaker: Dr. Sanjai Parthasarathi
11:40 a.m. – 11:55 a.m.

Panel: Modules and Subsystems
Co-Chair: Dr. Sanjai Parthasarathi
1:00 p.m. – 5:00 p.m.

Beyond 1.6T: Enabling AI Datacenter Scale with Coherent-Lite Optics
Speaker: Shawn Esser
3:20 p.m. – 3:35 p.m.


Tuesday, September 22, 2026

Scaling the Optical Future: Technologies Enabling Scale-Up, Scale-Out, and Scale-Across AI Infrastructure
Speaker: Dr. Julie Sheridan Eng
10:00 a.m. – 10:15 a.m.

Co-Packaged Optics: From Industry Promise to Reality
Speaker: Justin Abbott
11:00 a.m. – 11:15 a.m.

Fireside Chat on the Increasing Role of Photonics in Next-Generation AI/ML Interconnects
Speaker: Dr. Giovanni Barbarossa
1:00 p.m. – 1:55 p.m.

Panel: Realistic Check of AI Interconnect Scaling Solutions for the Post-1.6T Era
Panelist: Dr. Sanjai Parthasarathi
4:00 p.m. – 5:00 p.m.


Wednesday, September 23, 2026

Scaling Ground Station Connectivity for Satellite Constellations
Speaker: Jessica Wang
10:20 a.m. – 10:35 a.m.

ECOC CONFERENCE


Sunday, September 20, 2026

Workshop: “Light Sources for Next-Generation Optical Communication Systems for AI Datacenters”
Organizer: Dr. Wilfried Maineult
9:00 a.m. – 12:30 p.m.

Workshop: “Hybrid Solutions for Very High Speed PON – the best (or worst) of coherent and IMDD worlds”
Speaker: Dr. Noriaki Kaneda
2:45 p.m. – 3:00 p.m.

Workshop: “Can Fast Narrow Channels Keep Rising Without Limit or Will Slow and Wide Become the Winner?”
Speaker: Dr. Chris Kocot
4:30 p.m. – 4:42 p.m.


Wednesday, September 23, 2026

Poster Presentation: “PAM4 448 Gb/s per Lane InP MZM-SOA Array PIC for Next-Generation CPO”
Speaker: Dr. Anna Tatarczak
3:30 p.m. – 5:00 p.m.

Public Presentation: “2.3 Tbit/s Backside-Emitting 1060 nm VCSEL Array on Silicon Interposer for CPO Applications”
Speaker: Dr. Marc Ganzhorn
5:00 p.m. – 5:15 p.m.


Thursday, September 24, 2026

Technical Session: “Novel Modulators: Discrete Photonic Devices and Technologies”
Chair: Dr. Wilfried Maineult
9:00 a.m. – 10:30 a.m.

Visitors to ECOC 2026 can experience Coherent’s latest optical networking technologies and meet with company experts at Stand 2100, Hall 2, at FYCMA – Trade Fair & Congress Center in Málaga, September 21-23, to explore the demonstrations and discuss optical connectivity and break-through technologies.

For more information, visit www.coherent.com.

About Coherent 
Coherent is the global photonics leader. We harness photons to drive innovation. Industry leaders in the datacenter, communications, and industrial markets rely on Coherent’s world-leading technology to fuel their own innovation and growth. Founded in 1971 and operating in more than 20 countries, Coherent brings the industry’s broadest, deepest technology stack; unmatched supply chain resilience; and global scale to help its customers solve their toughest technology challenges.

Media Contact:

[email protected] 



SECZ Investors Have Opportunity to Join Securitize Corp. Fraud Investigation with SBS Law

SECZ Investors Have Opportunity to Join Securitize Corp. Fraud Investigation with SBS Law

LOS ANGELES–(BUSINESS WIRE)–Schall, Brown & Schwartz LLP (“SBS”), a national shareholder rights litigation firm, announces that it is investigating claims on behalf of investors of Securitize Corp. (“Securitize” or “the Company”) (NYSE: SECZ) for violations of the securities laws.

INVESTIGATION DETAILS: The investigation focuses on whether the Company issued false and/or misleading statements and/or failed to disclose information pertinent to investors.

If you are a shareholder who suffered a loss, click here to participate.

We also encourage you to contact Brian Schall or David Schwartz of Schall, Brown & Schwartz LLP, 2049 Century Park East, Suite 2460, Los Angeles, CA 90067, at 310-301-3335, to discuss your rights free of charge. You can also reach us through the firm’s website at www.schallfirm.com, or by email at [email protected].

WHY SBS? Schall, Brown & Schwartz LLP represents investors around the world and specializes in securities class action lawsuits and shareholder rights litigation. Bringing together the extensive experience and diverse skillsets of founding partners Brian Schall, Andrew Brown, and David Schwartz, SBS is dedicated to aggressively advocating for every investor.

This press release may be considered Attorney Advertising in some jurisdictions under the applicable law and rules of ethics.

Schall, Brown & Schwartz LLP

Brian Schall, Esq.,

Andrew Brown, Esq.,

David Schwartz, Esq.,

www.schallfirm.com

Office: 310-301-3335

[email protected]

KEYWORDS: United States North America California

INDUSTRY KEYWORDS: Class Action Lawsuit Professional Services Legal

MEDIA:

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Keysight to Demonstrate End-to-End Solutions for Scaling AI Infrastructure at ECOC 2026

Keysight to Demonstrate End-to-End Solutions for Scaling AI Infrastructure at ECOC 2026

SANTA ROSA, Calif.–(BUSINESS WIRE)–
Keysight (NYSE: KEYS):

What: At ECOC 2026, Keysight Technologies will demonstrate solutions that help engineers design, characterize, validate, benchmark, and scale the high-speed optical and AI infrastructure required for next-generation data centers. Highlights will span photonic design and characterization, AI infrastructure and interconnect validation, next-generation optical research, 1.6T optical validation and production test.

When: September 21–23, 2026

Where: Keysight booth #1154, FYCMA, Málaga, Spain

More information: Keysight at ECOC

Keysight experts will showcase solutions to:

  • Accelerate photonic design and characterization: Connect photonic simulation with automated PIC test and 220 GHz characterization to bridge the gap between design, validation, and high-volume manufacturing.
  • Advance next-generation optical links: Explore 3.2T optical research and 1.6T transmitter and receiver validation to reduce design uncertainty and accelerate optical link development.
  • Validate AI infrastructure: Validate high-speed AI and data center interconnects, benchmark AI fabric performance, emulate real-world workloads, and test AI transport and inference at scale.
  • Scale 1.6T production: Combine high-speed optical measurement with automated interconnect validation to minimize test time, optimize yield, and accelerate production ramps.
  • Explore AI-enabled test automation: See how AI and intelligent automation simplify photonics test development, troubleshooting, and data analysis.

About Keysight Technologies

Keysight (NYSE: KEYS) serves technology innovators as a mission-critical design enablement partner for the world’s most complex engineering challenges. By connecting market-leading design, emulation, and test solutions across the full life cycle, Keysight helps engineering teams accelerate innovation, reduce risk, and bring new technologies to market faster. Customers across AI infrastructure, communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics rely on Keysight to bridge virtual design and physical reality, enabling confident decisions earlier. Learn more at www.keysight.com.

Keysight Media Contacts

Andrea Mueller

Americas

[email protected]

Fusako Dohi

Asia

[email protected]

Jenny Gallacher

Europe

[email protected]

KEYWORDS: California Europe Spain United States North America

INDUSTRY KEYWORDS: Software Networks Hardware Artificial Intelligence Data Management Engineering Technology Manufacturing

MEDIA:

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