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MELVILLE, N.Y., April 8, 2021 /PRNewswire/ — Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., has launched the FPA-5520iV LF Option for back-end process semiconductor lithography systems. This device features an i-line stepper¹ with a 1.5 micrometer² resolution and a wide exposure field of 52 mm x 68 mm for advanced packaging³.

In the field of semiconductor chip performance enhancement, alongside the miniaturization of circuits in front-end process of semiconductor manufacturing, higher-density packaging in back-end processes has become a valuable resource within this market. Advanced packaging with high performance requires fine redistribution layer patterns⁴, and in recent years, semiconductor lithography systems have been used for this purpose. Inheriting the same basic functionality of its predecessor model, the FPA-5520iV, released in July 2016, the new FPA-5520iV LF Option for advanced packaging achieves a wide exposure field of circuit patterns to meet a variety of advanced packaging needs including heterogeneous integration⁵.

As a result of its projection optical system, the Option recognizes single exposure with a large field of 52 mm × 68 mm — more than four times the standard exposure field (26 mm x 33 mm) of front-end process lithography systems, making support for integrations possible, in which multiple large semiconductor chips are bonded. In addition, with a high resolution of 1.5 micrometers, it is possible to expose fine redistribution layer patterns, thus supporting a variety of advanced packaging types. What’s more, by introducing this high resolution option, redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.

The FPA-5520iV LF Option inherits the basic performance of the FPA-5520iV, which has received praise for its ability to handle warped reconstituted substrates⁶, an issue which can occur in packaging layers during the mass-production process. This system also offers enhanced availability by detecting alignment marks on the reconstituted substrates with large chip array variations.

The back-end process of semiconductor manufacturing

In the semiconductor chip manufacturing process, the semiconductor lithography system plays the role of “exposing” the circuit patterns. In the series of lithography processes, the process of forming a semiconductor chip on a silicon wafer is called the “front-end process.” Meanwhile, the “back-end process” entails sealing a delicate semiconductor chip in a package, known as the “packaging process,” to protect it from the external environment and to enable electrical connection with the external portion.

The Canon Lithography System website

The “Canon Lithography System Website” features easy-to-understand explanations, including illustrations and videos, of the technologies behind semiconductor lithography, as well as a dedicated page for kids.

URL: https://global.canon/en/product/indtech/semicon/50th/ 

About Canon U.S.A., Inc.

Canon U.S.A., Inc., is a leading provider of consumer, business-to-business, and industrial digital imaging solutions to the United States and to Latin America and the Caribbean markets. With approximately $30.4 billion in global revenue, its parent company, Canon Inc. (NYSE:CAJ), ranks third overall in U.S. patents granted in 2020† and is one of Fortune Magazine’s World’s Most Admired Companies in 2020. Canon U.S.A. is dedicated to its Kyosei philosophy of social and environmental responsibility. To keep apprised of the latest news from Canon U.S.A., sign up for the Company’s RSS news feed by visiting www.usa.canon.com/rss and follow us on Twitter @CanonUSA.

† Based on weekly patent counts issued by United States Patent and Trademark Office.

Availability and other specifications are subject to change without notice.

¹ A semiconductor lithography system that utilizes a 365 nm wavelength mercury lamp as the light source. 1 nm (1 nanometer) = 1 billionth of a meter.

² 1 micrometer = one millionth of a meter = one thousandth of a millimeter.

³ Protects delicate semiconductor chips from the external environment and allows them to be electrically connected to the outside at the implementation.

⁴ Fine wiring for connecting between semiconductor chips or between semiconductor chips and bumps (protruding connecting electrodes).

⁵ Packaging to combine different chips such as CPU and DRAM, or CPU and GPU. The chips can be placed close together and connected by a number of circuits to increase processing capability.

⁶ Wafers created by attaching and encasing in resin multiple individual semiconductor chips that are produced during the front-end processes of semiconductor manufacturing.

CONTACT: Nicole Esan, [email protected]

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SOURCE Canon U.S.A. Inc.

NEW YORK, April 8, 2021 /PRNewswire/ —

If you own shares in any of the companies listed above and
would like to discuss our investigations or have any questions concerning
this notice or your rights or interests, please contact:

Joshua Rubin, Esq.

WeissLaw LLP
1500 Broadway, 16^th Floor
New York, NY  10036
(212) 682-3025
(888) 593-4771
[email protected]

Houston Wire & Cable Company (NASDAQ: HWCC)

WeissLaw LLP is investigating possible breaches of fiduciary duty and other violations of law by the board of directors of Houston Wire & Cable Company (NASDAQ: HWCC) in connection with the proposed acquisition of the company by Omni Cable, LLC (“OmniCable”). Under the terms of the merger agreement, HWCC shareholders will receive $5.30 in cash for each share of HWCC common stock that they hold. If you own HWCC shares and wish to discuss this investigation or your rights, please call us or visit our website: https://www.weisslawllp.com/hwcc/

Frank’s International N.V. (NYSE: FI)

WeissLaw LLP is investigating possible breaches of fiduciary duty and other violations of law by the board of directors of Frank’s International N.V. (NYSE: FI) in connection with the proposed acquisition of the company by Expro Group (“Expro”). Under the terms of the merger agreement, Expro shareholders will receive 7.272 FI shares per Expro share they own. Upon consummation of the transaction, FI shareholders will only own approximately 35% of the combined entity, with Expro shareholders owning approximately 65%. If you own FI shares and wish to discuss this investigation or your rights, please call us or visit our website: https://www.weisslawllp.com/fi/

Severn Bancorp, Inc. (NASDAQ: SVBI)

WeissLaw LLP is investigating possible breaches of fiduciary duty and other violations of law by the board of directors of Severn Bancorp, Inc. (NASDAQ: SVBI) in connection with the proposed acquisition of the company by Shore Bancshares, Inc. (“Shore”). Under the terms of the merger agreement, Shore will acquire SVBI in a mixed cash-and-stock transaction, pursuant to which SVBI shareholders will receive $1.59 in cash and 0.6207 of a Shore common stock for each SVBI share that they own, representing implied per-share merger consideration of approximately $12.18 based upon Shore’s April 7, 2021 closing price of $17.06. If you own SVBI shares and wish to discuss this investigation or your rights, please call us or visit our website: https://www.weisslawllp.com/svbi/

Viking Energy Group, Inc. (OTC: VKIN)

WeissLaw LLP is investigating possible breaches of fiduciary duty and other violations of law by the board of directors of Viking Energy Group, Inc. (OTC: VKIN) in connection with the company’s proposed merger with Camber Energy, Inc. (NYSE: CEI). Under the terms of the merger agreement, which is structured as a reverse merger, CEI will issue newly-issued shares of common stock in exchange for the balance of VKIN common stock on a one-for-one basis. CEI currently owns approximately 62% of VKIN’s issued and outstanding common shares. If you own VKIN shares and wish to discuss this investigation or your rights, please call us or visit our website: https://www.weisslawllp.com/vkin/

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SOURCE WeissLaw LLP

NEW YORK, April 8, 2021 /PRNewswire/ — WeissLaw LLP is investigating possible breaches of fiduciary duty and other violations of law by the board of directors of Century Bancorp, Inc. (“Century”) (NASDAQ: CNBKA) in connection with the proposed acquisition of the Company by Eastern Bankshares, Inc. (“Eastern”). Under the terms of the all-cash merger agreement, Century shareholders will receive $115.28 in cash for each share of Century common stock that they hold. The transaction is valued at approximately $642 million. 

If you own


Century


 shares and wish to discuss this investigation or have any questions concerning this notice or your rights or interests, visit our website:

https://www.weisslawllp.com/CNBKA/

Or please contact:



Joshua Rubin, Esq.

WeissLaw LLP
1500 Broadway, 16^th Floor
New York, NY  10036
(212) 682-3025
(888) 593-4771
[email protected]

WeissLaw LLP is investigating whether Century’s board acted in the best interest of Century’s public shareholders in agreeing to the proposed transaction, whether the per-share merger consideration adequately compensates Century’s shareholders, and whether all information regarding the process undertaken by the board and the valuation of the transaction will be fully and fairly disclosed to Century’s public shareholders. 

WeissLaw LLP has litigated hundreds of stockholder class and derivative actions for violations of corporate and fiduciary duties. We have recovered over a billion dollars for defrauded clients and obtained important corporate governance relief in many of these cases. If you have information or would like legal advice concerning possible corporate wrongdoing (including insider trading, waste of corporate assets, accounting fraud, or materially misleading information), consumer fraud (including false advertising, defective products, or other deceptive business practices), or anti-trust violations, please email us at [email protected]

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SOURCE WeissLaw LLP

NEW YORK, April 8, 2021 /PRNewswire/ — DDB North America announced today the addition of a new regional leadership position. Jatinder Singh joins DDB North America as Chief Data Officer and, reporting into regional CEO Justin Thomas-Copeland, will spearhead data science innovation for all DDB North America offices.

Singh joins as DDB North America continues to fortify its data capabilities to underpin client work, following the appointment of Justin Thomas-Copeland in 2020. Thomas-Copland has championed data as a tool for marketers to harness and infuse insights which further drive creativity. To enable this, he has introduced new technology platforms which capture cultural insights and create scaled audience understanding.   

Singh will continue to diversify data usage across all functions of DDB North America and deliver solutions for clients across industries. 

“Jatinder Singh is an incredible operator and we’re excited to have him on board to fuel creativity in new and exciting ways for the region,” says Thomas-Copeland. “Jatinder is human first and will be instrumental in translating data insights into progressive, unexpected creative solutions that move mountains for our teams and clients and ensure that our creativity is always business accountable. He will be critical as we build out a DDB more integrated and creative than ever.”

Singh joins from within Omnicom, DDB’s holding network, and was previously the Global Chief Marketing Sciences Officer for the Omnicom Precision Marketing Group (OPMG). Singh’s career echoes DDB North America’s connective and creative spirit with data-driven creativity experiences including AT&T, Ford Motor Company, IBM, iShares, McDonald’s, Pfizer, SAP, Uber and the Volkswagen Group.

“DDB North America has made incredible strides in data science innovation to understand consumers and manifest this understanding in creative excellence. I am honored to be a part of such growth,” says Singh. “Data will continue to evolve and push creativity farther, DDB is the perfect incubator for the growth of both data and creativity.”

ABOUT DDB

DDB Worldwide (www.ddb.com) is one of the world’s largest and leading advertising and marketing networks. DDB has been named Agency of the Year numerous times by the Cannes International Festival of Creativity and the industry’s leading advertising publications and awards shows. WARC has listed DDB as one of the Top 3 Global Networks for 13 of the last 16 years. The agency’s clients include Unilever, Mars, Johnson & Johnson, and Molson Coors, among others.

Founded in 1949, DDB is part of the Omnicom Group (NYSE) and consists of more than 200 offices in over 90 countries with its flagship office in New York, NY.

ABOUT OMNICOM

Omnicom Group Inc. (NYSE – OMC) is a leading global marketing and corporate communications company. Omnicom’s branded networks and numerous specialty firms provide advertising, strategic media planning and buying, digital and interactive marketing, direct and promotional marketing, public relations and other specialty communications services to over 5,000 clients in more than 100 countries.

CONTACT: Xavier Totor, [email protected]

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SOURCE DDB North America