Market Newsdesk

LAS VEGAS, Jan. 06, 2025 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today in a press conference ahead of CES 2025 announced that AMD Ryzen AI PRO processors will power new Dell Pro devices. These new PCs will be the first Dell commercial devices shipping with AMD Ryzen AI PRO processors, marking a significant milestone in the strategic collaboration between AMD and Dell.

“We’re incredibly proud to collaborate with Dell on the next generation of commercial PCs powered by the AMD Ryzen AI PRO processors,” said Jack Huynh, SVP and GM of the computing and graphics group at AMD. “Ryzen AI PRO CPUs are built to handle today’s workflows and tomorrow’s AI demands, and when combined with the power of a Dell PC, they create the perfect combination for the enterprise.”

“AI PCs represent the next frontier in computing, transforming how we work, create and connect,” said Sam Burd, president, Client Solutions Group, Dell Technologies. “This progress depends on cutting-edge silicon innovation, which is why we’ve worked to engineer AMD Ryzen AI PRO processors into our new Dell Pro portfolio.”

Third-gen AMD Ryzen AI PRO processor-powered PCs have provided increased efficiency, privacy, personalization, and connectivity. The most recent generation of Ryzen AI PRO processors were designed specifically to transform business productivity with Copilot+ features including live captioning and language translation in conference calls and advanced AI image generators. AMD Ryzen AI PRO Series processors deliver cutting-edge AI compute and uncompromising performance for everyday workloads. Enabled with AMD PRO Technologies, AMD Ryzen AI PRO Series processors offer world-class security and manageability features designed to streamline IT operations and ensure exceptional ROI for businesses.

The new Dell Pro portfolio includes notebooks and desktops powered by AMD Ryzen AI PRO processor options. These PCs powered by Ryzen AI PRO leverage the combined capability of the processor’s built-in CPU, GPU, and NPU to offer exceptional battery life, powerful on-device AI, Copilot+ experiences and dependable productivity—in the office, at home or anywhere in between.

AMD and Dell have collaborated for years to drive innovation across the enterprise. AMD Threadripper PRO processors have powered high-performant workstations, letting designers, engineers and creators speed up their workflows and accelerate demanding tasks. In addition, AMD EPYC CPUs have powered Dell PowerEdge servers for multiple generations, handling workloads from traditional datacenter applications to advanced AI tasks.

Supporting Resources

• Learn more about Ryzen PRO mobile processors
• Learn more about AMD PRO Technologies
• Learn more about Ryzen AI
• Learn more about Ryzen AI Software
• Learn more about Ryzen Threadripper processors
• Become a fan of AMD on Facebook
• Follow AMD on X

About AMD

For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies. Billions of people, leading Fortune 500 businesses and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, LinkedIn and X pages.

Cautionary Statement

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including the AMD Ryzen™ AI PRO 300 Series mobile processors, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as “would,” “may,” “expects,” “believes,” “plans,” “intends,” “projects” and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD’s control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; Nvidia’s dominance in the graphics processing unit market and its aggressive business practices; competitive markets in which AMD’s products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD’s ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD’s ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD’s products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD’s ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD’s reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD’s reliance on Microsoft and other software vendors’ support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD’s supply chain; AMD’s ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; long-term impact of climate change on AMD’s business; impact of government actions and regulations such as export regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit agreement; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses; our ability to complete the acquisition of ZT Systems; impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain qualified personnel; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

© 2025 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Radeon, RDNA, Ryzen, XDNA and combinations thereof are trademarks of Advanced Micro Devices, Inc. Certain AMD technologies may require third-party enablement or activation. Supported features may vary by operating system. Please confirm with the system manufacturer for specific features. No technology or product can be completely secure.

The information contained herein is for informational purposes only and is subject to change without notice. Timelines, roadmaps, and/or product release dates shown in this Press Release are plans only and subject to change.

Contact:
Stacy MacDiarmid
AMD Communications
+1 (512) 658-2265
[email protected]

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/0fda9b80-4a14-4ea3-9805-98730d9e4860

LAS VEGAS, Jan. 06, 2025 (GLOBE NEWSWIRE) — Ahead of CES 2025, AMD (NASDAQ: AMD) today announced new gaming products to expand its leadership in desktop, mobile and handheld gaming, and deliver incredible performance for the most demanding games. AMD unveiled new Ryzen™ 9900X3D and 9950X3D Series desktop processors, offering unprecedented performance for desktop gamers, as well as the second-generation handheld gaming PC processor – the Ryzen™ Z2, enabling top-tier performance for AAA titles on the go.

“Gaming has become the one of the biggest forms of entertainment around the world, and with titles becoming more immersive and demanding, having the right hardware and software is critical for the best player experience,” said Jack Huynh, senior vice president and general manager, Computing and Graphics Group, AMD. “Today’s announcements underscore our commitment to providing gamers everywhere the freedom to choose their own gaming experiences without being held back by performance bottle necks.”

Ryzen 9950X3D and 9900X3D Desktop Processors for Gamers and Content Creators
AMD is rounding out its portfolio of exceptional desktop processors with AMD Ryzen 9950X3D and 9900X3D. The Ryzen 9950X3D is world’s best 16-core processor for gamers¹ and content creators² featuring 16 “Zen 5” CPU cores and AMD RDNA 2 graphics. Based on the utilizing 2nd Gen AMD 3D V-Cache™ technology, the new X3D processors push the boundaries of performance and innovation for desktop gamers.

The new generation of X3D processors relocates the cache memory below the core complex die (CCD), placing “Zen 5” cores closer to the cooling solution, to deliver higher clock speeds at lower temperatures and providing better performance compared to the previous generation³.

New Ryzen X3D models are expected to be on-shelf in Q1 2025.

Model	Cores/Threads	Boost 4 / Base Frequency	Total Cache	PCIe®	TDP
AMD Ryzen™ 9950X3D	16C/32T	Up to 5.7 / 4.3 GHz	144 MB	Gen 5	170W
AMD Ryzen™ 9900X3D	12C/24T	Up to 5.5 / 4.4 GHz	140 MB	Gen 5	120W

Ryzen Z2 Series Handheld Gaming Processors
Designed to bring console-class gaming to the palm of customers’ hands, AMD Ryzen™ Z2 Series processors deliver a unique blend of power and efficiency to enable world-class desktop gaming experiences in handheld form factors.

Featuring up to 8 “Zen 5” CPU cores and RDNA 3.5 architecture-powered graphics, the new Ryzen Z2 processors offer ultra-responsive gaming and breathtaking graphics with low power optimizations for hours of uninterrupted play time.

Systems powered by Ryzen Z2 processors are expected to be available starting in Q1 2025.

Model	Cores/Threads	Boost 5 / Base Frequency	Total Cache	Graphics Model AMD	Graphics Cores	cTDP
AMD Ryzen™ Z2 Extreme	8C/16T	Up to 5.0 / 2.0 GHz	24 MB	AMD RDNA™ 3.5	16	15- 35W
AMD Ryzen™ Z2	4C/8T	Up to 5.1 / 3.3 GHZ	24 MB	AMD RDNA™ 3	12	15- 30W
AMD Ryzen™ Z2 Go	4C/8T	Up to 4.3 / 3.0 GHz	10 MB	AMD RDNA™ 2	12	15- 30W

Ryzen
9000HX
Series for Mobile
Notebooks
For the ultimate mobile gaming experience, new AMD Ryzen™ 9000HX Series processors deliver the most incredible performance a gaming laptop has ever seen. Re-engineered with 2^nd generation 3D V-Cache™ technology, new Ryzen 9000HX Series have relocated the memory below the processor to deliver even higher performance benefits, lower temperatures and higher clock rates.

At the top of the stack, the Ryzen™ 9955HX3D is projected to be one of the fastest mobile processors built for gamers and creators. Featuring up to 16 cores, capable of delivering 32 threads of processing performance, systems powered by Ryzen 9000HX processors are projected to offer the most performance cores you can get in a mobile PC processor. With advanced DDR5 memory support, Ryzen 9000HX processors deliver low-power high-bandwidth memory ideal for the most performant gaming laptops.

Systems are expected to be on shelf starting the first half of 2025.

Model	Cores / Threads	Boost 6 / Base Frequency	Total Cache	Graphics Model AMD	Graphics Cores	cTDP
AMD Ryzen™ 9 9955HX3D	16/32	Up to 5.4 / 2.5 GHz	144 MB	AMD Radeon™ 610M graphics	2	55- 75W
AMD Ryzen™ 9 9955HX	16/32	Up to 5.4 / 2.5 GHz	80 MB	AMD Radeon™ 610M graphics	2	55- 75W
AMD Ryzen™ 9 9850HX	12/24	Up to 5.2/ 3.0 GHz	76 MB	AMD Radeon™ 610M graphics	2	45- 75W

AMD Strengthens Gaming Ecosystem with OEMs and Game Developers
OEMs across the board are introducing more high-performance gaming systems powered by AMD Ryzen processors. New OEM systems provide gamers with unmatched compute and graphics performance in a variety of form factors.   

“We are excited to expand our lineup of AMD-powered high-performance gaming systems in both notebook and handheld form factors,” said Jerry Kao, COO, Acer. “With the growing expectations to make AI-enhanced gaming more immersive and competitive, Acer is delivering next-level experiences for gamers and creators alike with our new devices powered by AMD processors.”

“ASUS has always been at the forefront of innovation to help gamers reach their true potential,” said Samson Hu, co-CEO, ASUS. “With the new ROG systems powered by the AMD Ryzen 9000HX Series processors, gamers can push their limits and experience extreme power and performance in top-of-the-line notebooks.”   

“At Lenovo, we’re shaping the future of gaming by delivering innovative solutions from powerful high-performance laptops and towers to handheld devices. With AMD’s cutting-edge Ryzen Z series processors, we’re pushing the boundaries of what handheld gaming devices can achieve,” said Jun Ouyang, Senior Vice President and General Manager, Consumer Segment, Intelligent Devices Group, Lenovo. “Together with AMD, we have reimagined how gamers interact with their technology across every platform, and we are committed to driving the next generation of gaming innovation that adapts to the evolving needs of gamers everywhere.” 

Supporting Resources

• Visit the AMD CES 2025 page for more information
• Learn more about Ryzen handheld processors
• Learn more about Ryzen desktop processors
• Learn more about Ryzen mobile processors
• Become a fan of AMD on Facebook
• Follow AMD on X

About AMD

For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies. Billions of people, leading Fortune 500 businesses and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, LinkedIn and X pages.

Cautionary Statement
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including the AMD Ryzen™ AI PRO 300 Series mobile processors, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as “would,” “may,” “expects,” “believes,” “plans,” “intends,” “projects” and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD’s control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; Nvidia’s dominance in the graphics processing unit market and its aggressive business practices; competitive markets in which AMD’s products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD’s ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD’s ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD’s products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD’s ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD’s reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD’s reliance on Microsoft and other software vendors’ support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD’s supply chain; AMD’s ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; long-term impact of climate change on AMD’s business; impact of government actions and regulations such as export regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit agreement; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses; our ability to complete the acquisition of ZT Systems; impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain qualified personnel; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

© 2025 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Radeon, RDNA, Ryzen, XDNA and combinations thereof are trademarks of Advanced Micro Devices, Inc. Certain AMD technologies may require third-party enablement or activation. Supported features may vary by operating system. Please confirm with the system manufacturer for specific features. No technology or product can be completely secure.

The information contained herein is for informational purposes only and is subject to change without notice. Timelines, roadmaps, and/or product release dates shown in this Press Release are plans only and subject to change.

Contact:
Stacy MacDiarmid
AMD Communications
+1 (512) 658-2265
[email protected]

____________________________________

¹ Testing as of Nov 2024 by AMD Performance Labs using the following game titles tested at 1080p high settings: Black Myth: Wukong, Avatar: Frontiers of Pandora, Hogwarts Legacy, Call of Duty: Black Ops, Starfield, CyberPunk 2077, Counter Strike 2, Finaly Fantasy XIV, Hitman 3, Warhammer 20,000: Space Marine 2, Watch Dogs: Legion, Far Cry 6, Ashes of the Singularity. Both AMD Ryzen 9 9950X3D and Ryzen 7 7950X3D systems configured as follows: GIGABYTE X870E AORUS MASTER, 32GB DDR5-6000, Nvidia RTX 4090, KRAKEN X63, Win 11 Pro 26100, VBS ON, SAM/REBAR ON. System manufacturers may vary configurations, yielding different results. GNR-27.
² Testing as of Nov 2024 by AMD Performance Labs using the following benchmarks: PugetBench Premiere Pro 24.5, PugetBench Photoshop 25.11, PugetBench Davinci Resolve 19.0.1. Geekbench 6.3, Blender 4.2.3 Monster and Classroom, Corona Benchmark, Cinebench 2024. Both AMD Ryzen 9 9950X3D and Ryzen 7 7950X3D systems configured as follows: GIGABYTE X870E AORUS MASTER, 32GB DDR5-6000, Nvidia RTX 4090, KRAKEN X63, Win 11 Pro 26100, VBS ON, SAM/REBAR ON. System manufacturers may vary configurations, yielding different results. GNR-29.
³ Testing as of Nov 2024 by AMD Performance Labs using the following benchmarks: PugetBench Premiere Pro 24.5, PugetBench Photoshop 25.11, PugetBench Davinci Resolve 19.0.1. Geekbench 6.3, Blender 4.2.3 Monster and Classroom, Corona Benchmark, Cinebench 2024. AMD Ryzen 9 9950X3D system configuration: GIGABYTE X870E AORUS MASTER, 32GB DDR5-6000, Nvidia RTX 4090, KRAKEN X63, Win 11 Pro 26100, VBS ON, SAM/REBAR ON. Intel Core Ultra 9 285K system configuration: ASUS ROG STRIX Z890-E GAMING WIFI, 32GB DDR5-6400, Nvidia RTX 4090, KRAKEN X63, Win 11 Pro 26100, VBS ON, SAM/REBAR ON. System manufacturers may vary configurations, yielding different results. GNR-30.
⁴ Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.
⁵ Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.
⁶ Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/39395e49-3205-4dc0-8dca-8e9078acdd34

Enabling businesses to crush it like never before

News Highlights:

• Modern leaders will make a powerful impression with a new class of PCs that unlock their full potential including the HP EliteBook Ultra G1i – the world’s most immersive AI business notebook¹
• Be the company superhero, managing high-performance workflows simultaneously with the world’s most powerful 14-inch mobile workstation,² the HP ZBook Ultra G1a 14 and the world’s most powerful mini workstation,³ the HP Z2 Mini G1a
• Tactile and digital worlds collide with HP Z Captis, a CES 2025 Best of Innovation winner in Computer Peripherals & Accessories
• Magically turn on your PC before you even sit down with HP Thunderbolt 4 G6 Docks, the world’s first docks with proximity activation⁴

LAS VEGAS, Jan. 06, 2025 (GLOBE NEWSWIRE) — Today at CES 2025, future business leaders will be wowed by new and powerful AI PCs and solutions from HP Inc. (NYSE: HPQ) that empower them to collaborate and lead like never before.

Working with Purpose to Drive Impact

As the work landscape evolves, so do expectations for technology. That’s why HP meticulously designed its latest lineup of commercial next-gen AI PCs to give professionals the right tools for their unique work experiences.

With HP’s newest EliteBooks, fast presentation creation, personalized emails, and a built-in recording studio are possible with just a simple click of a button, alongside built-in security and intelligence thanks to Wolf Security.

For executives, the ultra-slim HP EliteBook Ultra G1i 14-inch Notebook Next-Gen AI PC powers lighting fast decision-making and AI-enhanced collaboration experiences without sacrificing performance or cutting-edge design:

• Reclaim time: Supercharge productivity with faster local AI performance driven by up to 48 TOPS of NPU performance⁵ with Intel® Core Ultra 5 and 7 processors⁶ to spend more time on what matters. Multitask across power-intensive applications, customize webinars or podcasts more than 2x faster,⁷ and personalize emails nearly twice as fast.⁸
• Show up and lead like a visionary: Create professional-level videos with a built-in recording studio experience. Look and sound like a pro with the world’s first AI business notebook with a 9MP camera,^9,10 dual microphone, quad speaker design, and AI-powered Poly Camera Pro conferencing experiences.
• Immerse in purposeful work: Virtual interactions are brought to life and more engaging on a sharp 120 Hz 3K OLED display and the world’s largest haptic trackpad on an AI business notebook.¹¹

For leaders on the move, HP delivers robust and reliable performance wherever their work takes them with the HP EliteBook X G1i 14-inch Notebook Next-Gen AI PC and HP EliteBook X Flip G1i 14-inch Notebook Next-Gen AI PC.

• Maximized productivity: Record video demos and create presentations nearly 2x faster¹² and develop personalized emails 1.3x faster¹³ with up to 48 TOPS of NPU performance¹⁴ powered by Intel® Core Ultra 5 and 7 processors.¹⁵ An innovative thermal design with two high-density turbo fans boosts performance to handle tough tasks while staying 10% quieter.¹⁶
• Adaptability to work from anywhere: The lightweight and flexible EliteBook X Flip easily converts from laptop, tablet, and tent modes to accommodate various workstyles. Offered in atmospheric blue and glacier silver colors, this device takes creative projects to the next level and captures precise notes when paired with the HP Rechargeable Active Pen.¹⁷

The newest next-generation AI PCs in HP’s commercial lineup all feature HP AI Companion,¹⁸ a CES 2025 Innovation Awards honoree. Personalize PC settings and summarize documents to get up to speed quickly and make smarter decisions in just a few minutes. HP Wolf Security delivers built-in intelligence that protects at every level of the endpoint amidst rapidly evolving cyber threats.

Unlocking High-Performance Work

HP is transforming high-performance compute with innovations that deliver cutting-edge hardware and solutions for today’s workforce. 75% of product designers believe that current computing technology is not able to meet their multi-software requirements¹⁹ while workstation users desire smaller and lighter devices²⁰. To address this, HP is announcing the newest HP Z2 Mini G1a and the ZBook Ultra G1a, World’s first mobile workstation with AMD Ryzen™ AI Max PRO,²¹ both of which were developed in collaboration with AMD to deliver high performance in compact designs. The HP Z2 Mini and HP ZBook Ultra enable users to simultaneously engage in 3D design, render graphics-intensive projects, and work locally with LLMs. HP Z Captis, developed with Adobe, has been recognized as a Best of CES 2025 Innovation Award winner. The HP Z Captis further highlights HP’s commitment to fostering creativity without limitations and how co-engineering with industry leaders enhances creative workflows.

• 
  HP ZBook Ultra G1a
  , the world’s most powerful 14-inch mobile workstation,²² defies what’s possible on the go. As part of HP’s PC brand transformation and vision for the future, Z by HP will now be offering an Ultra in its mobile workstation portfolio. With its compact design and new AMD Ryzen™ AI Max PRO processor, the ZBook Ultra offers the performance to tackle workflows previously not possible on a laptop. Take desk-bound workflows anywhere with an ultra-thin and light design, combined with a long-lasting battery, Next-Gen AI PC features, and AI-enhanced privacy. Featuring up to 16 desktop-class CPU cores, discrete-like integrated graphics, and up to 128GB of innovative unified memory architecture, and the ability to assign up to 96GB RAM to the GPU, the ZBook Ultra enables seamless multitasking between applications.
• 
  HP Z2 Mini G1a
  
  , the world’s most powerful mini workstation,²³ exceeds the needs of workstation-class professionals. Equipped with the AMD Ryzen™ AI Max PRO processor and scalable 128GB of innovative unified memory architecture with the ability to assign up to 96 GB exclusively to the GPU, the Z2 Mini G1a delivers performance for graphics-intensive workflows. With an internal power supply, this PC cleanly fits on a desk, mounted behind a monitor, or attached under a desk. It also easily fits in a rack, and its small size allows for a high-density rack mount solution that combines performance, manageability, and security.        
• This spring, HP will launch its first-ever 18-inch mobile workstation, delivering more power for pro-graphics and massive memory and storage, at nearly the same size as a 17” workstation. With 3x turbo fans, HP Vaporforce Thermals, and next-gen discrete graphics, this powerful mobile workstation has been meticulously engineered to provide up to 200W TDP. The device aims to redefine both portability and performance with impressive capabilities to unlock new, more demanding workflows. With a product offering that includes the HP ZBook Ultra G1a and a new 18″ ZBook, HP expects to be first to market with the world’s broadest portfolio of mobile workstations.²⁴

Staying One Step Ahead in a Modern Workspace

68% of employees report experiencing moderate to severe digital friction when using technology.²⁵ It can be even more frustrating when setting up a workspace and transitioning between locations. Employees need intuitive technology that seamlessly connects and works to stay productive without interruption, which is why HP is delivering the world’s most advanced Thunderbolt 4 docks.²⁶

HP Thunderbolt 4 G6 Docks transform how professionals connect, manage, and protect their workspace – all before they sit down. HP Quick Connect found in the docks utilizes Bluetooth to detect a PC as it’s approaching, instantly waking the ecosystem of displays and accessories to start work immediately.

There are three versions of this technology: the HP Thunderbolt 4 100W G6 Dock designed for mainstream workers, and the HP Thunderbolt 4 Ultra G6 Docks featuring 180W of power delivery for creative professionals and 280W for technical specialists and power users.

These docks enable easy cloud manageability without disrupting an employee’s flow thanks to Poly Lens. The dock’s hardware and software are protected at every touchpoint with HP Wolf Security interlaced with HP Sure Start. And the Thunderbolt™ 4 technology provides high-speed power alongside a single-cable connection to multiple monitors.

Pair HP’s newest PCs and docks with the company’s comprehensive portfolio of solutions for the ultimate workspace. Poly Voyager Legend 30 & 50 SeriesHeadsets deliver flexibility to move throughout the day. With AI-enhanced noise reduction and WindSmart technology, the Poly Voyager Legend 50 Series blocks out unwanted environmental sounds so voices are heard clearly in any environment. The HP 720/725 Multi-Device Rechargeable Wireless Keyboard and Mouse Combo adds a personal touch to any desk space with ultra-fast charging ²⁷ and a battery-free design,²⁸ along with the HP 400 Quiet Wireless Mouse, which comes in five colors.

Pricing and Availability

²⁹

• The HP EliteBook Ultra G1i will be available on HP.com later this month for a starting price of $2,019.
• The HP EliteBook X G1i is expected to be available on HP.com in February for a starting price of $1,999.
• The HP EliteBook X Flip G1i is expected to be available on HP.com in February for a starting price of $2,249.
• The HP ZBook Ultra G1a is expected to be available on HP.com/z in spring of 2025. Pricing will be announced closer to availability.
• The HP Z2 Mini G1a is expected to be available on HP.com/z in spring of 2025. Pricing will be announced closer to availability.
• HP Thunderbolt 4 G6 Docks are expected to be available on HP.com in April. Pricing will be announced closer to availability.
• The Poly Voyager Legend 30 & 50 Series are expected to be available later this month in select regions and worldwide on HP.com in February. The Voyager Legend 30 will be available for $101.95, the Poly Voyager Legend 50 for $121.95, and Poly Voyager Legend 50 UC for $261.95.
• The HP 720 Multi-Device Rechargeable Wireless Keyboard and Mouse Combo is available now on HP.com for $89.99.
• The HP 400 Quiet Wireless Mouse is expected to be available on HP.com in May for $29.99.

For more information about HP at CES 2025 and additional HP news at the show, please visit the HP Press Center.

About HP

HP Inc. (NYSE: HPQ) is a global technology leader and creator of solutions that enable people to bring their ideas to life and connect to the things that matter most. Operating in more than 170 countries, HP delivers a wide range of innovative and sustainable devices, services and subscriptions for personal computing, printing, 3D printing, hybrid work, gaming, and more. For more information, please visit http://www.hp.com.

_______________
¹ Based on HP’s internal analysis of business clamshell notebooks with unique and immersive capabilities at no additional cost and an NPU as of December 2024.
² Based on HP’s internal analysis of non-gaming 14″ mobile workstations with a minimum 3 ISV certs, configurable professional graphics, and a dedicated workstation brand as of September 2024. Most powerful based on highest processor, graphics, memory, storage supported​
³ Based on HP’s internal analysis of ISV certified mini workstations with <3L volume, at least 3 ISV certifications, configurable professional graphics and a dedicated workstation brand. Powerful based on processor, integrated graphics, memory, and power supply as of October 2024.
⁴ Based on HP’s internal analysis of docks as of December 2024 with integrated proximity activation to wake connected peripherals and PC upon approach.
⁵ Features and software that require a NPU may require software purchase, subscription or enablement by a software or platform provider, and third-party software may have specific configuration or compatibility requirements. Potential NPU inferencing performance varies by use, configuration, and other factors.​
⁶ Multicore is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. Intel’s numbering, branding, and//or naming is not a measurement of higher performance.
⁷ Based on the time in seconds to complete the AI generated background effect in Canvid. Tested on pre-production HP EliteBook Ultra G1i with Core Ultra 7 268V, 32GB RAM and 1TB HDD vs. production build HP Dragonfly G4 with Intel Core i7 1370P, 32GB RAM, 1TB HDD. Actual results may vary.
⁸ Based measurement of the tokens per second for a local LLM to translate a text file from English to Japanese. Tested on pre-production HP EliteBook Ultra G1i with Core Ultra 7 268V, 32GB RAM and 1TB HDD vs. production build HP Dragonfly G4 with Intel Core i7 1370P, 32GB RAM, 1TB HDD. Actual results may vary.
⁹ Based on HP’s internal analysis of the front camera of business clamshell notebooks with an NPU as of December 2024.
¹⁰ Camera resolution refers to the image sensor active pixels. The actual image capture pixels depend on the app and/or aspect ratio selected.
¹¹ Based on HP’s internal analysis of business clamshell notebooks with an NPU as of December 2024.
¹² Based on the time in seconds to complete the AI generated background effect in Canvid. Tested on pre-production HP EliteBook X G1i with Core Ultra 7 268V, 32GB RAM and 2TB HDD vs. production build HP EliteBook 1040 G10 with Intel Core i7 1370P, 32GB RAM, 512GB HDD. Actual results may vary.
¹³ Based measurement of the tokens per second for a local LLM to translate a text file from English to Japanese. Tested on pre-production HP EliteBook X G1i with Core Ultra 7 268V, 32GB RAM and 2TB HDD vs. production build HP EliteBook 1040 G10 with Intel Core i7 1370P, 32GB RAM, 512GB HDD. Actual results may vary.
¹⁴ Features and software that require a NPU may require software purchase, subscription or enablement by a software or platform provider, and third-party software may have specific configuration or compatibility requirements. Potential NPU inferencing performance varies by use, configuration, and other factors.​
¹⁵ Multicore is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. Intel’s numbering, branding, and//or naming is not a measurement of higher performance.
¹⁶ Based on HP internal testing comparing the HP EliteBook 1040 G10 and HP EliteBook X G1i.
¹⁷ Sold separately or as an optional feature.
¹⁸ HP AI Companion is available preloaded on select HP next gen AI PCs or is available for download from the Microsoft store and requires a HP next gen AI PC with a NPU supporting 40-60 TOPS and requires Windows 11. Perform requires account set up within 30 days of PC boot. Some features require customer upload of local data. Five (5) library 100MB limit each and supports pdf, .txt., .docx files. HP may limit search prompts to 200 per calendar month.
19 Qualitative Workstream from the Global Customer Journey Mapping (CJM) Study, conducted in the US and DE by Portfolio Strategy and Horizon Strategy, June 2024. Sponsored by HP.
²⁰ Quantitative study by Mosaic Group, May 2023. Sponsored by HP.
²¹ Based on HP’s internal analysis of non-gaming 14″ mobile workstations with a minimum 3 ISV certs, configurable professional graphics, and a dedicated workstation brand as of September 2024.
²² Based on HP’s internal analysis of non-gaming 14″ mobile workstations with a minimum 3 ISV certs, configurable professional graphics, and a dedicated workstation brand as of September 2024. Most powerful based on highest processor, graphics, memory, storage supported​
²³ Based on HP’s internal analysis of ISV certified mini workstations with <3L volume, at least 3 ISV certifications, configurable professional graphics and a dedicated workstation brand. Powerful based on processor, integrated graphics, memory, and power supply as of October 2024.
²⁴ Based on HP’s internal analysis of ISV certified mini workstations with <3L volume, at least 3 ISV certifications, configurable professional graphics and a dedicated workstation brand. Powerful based on processor, integrated graphics, memory, and power supply as of October 2024.
²⁵ Hype Cycle for Digital Workplace Applications, Gartner, August 2023.
²⁶ Based on HP’s internal analysis of docks with Thunderbolt TM 4 technology as of December 2024. Most advanced pertains to Thunderbolt TM 4 power delivery that is greater than or equal to 180W, Windows and macOS compatibility, integrated LED light bar that communicates dock status, multiple end-user replaceable components for serviceability, and integrated proximity activation.
²⁷ Fast charging is based on USB Type-C ®– 3.0 port (5V, 2.5A). The actual charging time may vary depending on the port type and environmental conditions. Usage life is an estimate and varies depending on many factors, including number of active, idle and asleep hours of use, number of applications running, environmental conditions, and features used; actual usage life will vary with usage and environmental condition.
²⁸ A supercapacitor solution using non-Lithium Ion battery energy storage. Based on HP’s internal analysis of nongaming, wireless, rechargeable keyboard with 22 programmable keys that use the OEM’s software and do not use Li-Ion battery energy storage (as of May 27, 2024).
²⁹ Pricing and availability subject to change without notice.

Photos accompanying this announcement are available at:

https://www.globenewswire.com/NewsRoom/AttachmentNg/d66bac6a-44f1-4723-b669-66e4e6b53f0f

https://www.globenewswire.com/NewsRoom/AttachmentNg/ce387891-48ec-4cc9-ab9e-a5797896ee48

https://www.globenewswire.com/NewsRoom/AttachmentNg/a5218fa4-b271-4c13-8674-893f67237837

Media Contacts

[email protected]

hp.com/go/newsroom

— AMD Ryzen™ AI Max, AMD Ryzen™ AI 300 Series and AMD Ryzen™ 200 Series processors bring incredible performance for next-gen AI PCs —

— AMD Ryzen™ AI Max PRO, AMD Ryzen™ AI 300 PRO and AMD Ryzen™ 200 PRO Series processors bring cutting-edge performance to business PCs —

LAS VEGAS, Jan. 06, 2025 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) unveiled new processors today, ahead of CES 2025, furthering its leadership in the AI PC market and offering mobile users the most innovative PCs processors. AMD announced the new Ryzen™ AI Max Series processors, exceeding the demands for high-performance computing in premium thin and light notebooks; new Ryzen™ AI 300 Series “Zen-5”-based processors, rounding out the stack with additional models; and to continue the legacy of AMD “Zen 4” architecture, AMD also announced Ryzen™ 200 Series processors for everyday productivity.

AMD also expanded its commercial AI PC lineup integrating AMD PRO Technologies into the Ryzen AI Max, Ryzen AI 300 and Ryzen AI 200 Series processors. Ryzen PRO Series processors feature enterprise-grade security and manageability tools designed to help secure the modern enterprise and streamline IT operations.

“As consumers and professionals increasingly recognize the productivity benefits of AI PCs, AMD is further increasing its performance leadership in the market,” said Jack Huynh, senior vice president and general manager, Computing and Graphics Group, AMD. “With the next generation of AI-enabled processors, we are proliferating AI to devices everywhere, and bringing the power of a workstation to thin and light laptops.”

AMD Ryzen AI Max and Ryzen AI Max PRO Series Processors

The new Ryzen AI Max Series processors revolutionize what’s possible for next-gen AI PCs, offering incredible power and performance for gamers, creators and everyday users. With workstation-level performance, the Ryzen AI Max processors offer up to 16 “Zen 5” CPU cores, up to 40 AMD RDNA™ 3.5 graphics compute units, and an AMD XDNA™ 2 Neural Processing Unit (NPU) with up to 50 TOPS of AI processing ability¹ – all in ultra-portable form factors for optimum mobility.

Featuring up to 128GB of unified memory with up to 96GB available for graphics, systems powered by Ryzen AI Max for seamless and reliable multitasking, with the ability to support incredibly large AI models. With the addition of an NPU with up to 50 TOPS, Ryzen AI Max Series processors are the ultimate powerhouse for next-gen AI PCs and accelerating demanding AI-enabled workstation and creator software.

Built to redefine thin and light workstations, the new Ryzen AI Max PRO Series processors enable users to work with large engineering and architectural models and to tackle complex, AI-accelerated workloads. Equipped with AMD PRO Technologies, workstations powered by Ryzen AI Max PRO Series processors set a new standard for business-class mobile workstations.

Systems powered by Ryzen AI Max and Ryzen AI Max PRO Series Processors are expected to be available starting in Q1 2025.

Model	Cores / Threads	Boost 2 / Base Frequency	Total Cache	Graphics Model AMD	cTDP	NPU TOPS	Graphics Cores
AMD Ryzen™ AI Max+ 395	16C/32T	Up to 5.1 /3.0 GHz	80MB	AMD Radeon™ 8060S Graphics	45-120W	50	40
AMD Ryzen™ AI Max 390	12C/24T	Up to 5.0 / 3.2 GHz	76MB	AMD Radeon™ 8050S Graphics	45-120W	50	32
AMD Ryzen™ AI Max 385	8C/16T	Up to 5.0 / 3.6 GHz	40MB	AMD Radeon™ 8050S Graphics	45-120W	50	32
AMD Ryzen™ AI Max+ PRO 395	16C/32T	Up to 5.1 / 3.0 GHz	80MB	AMD Radeon™ 8060S Graphics	45-120W	50	40
AMD Ryzen™ AI Max PRO 390	12C/24T	Up to 5.0 / 3.2 GHz	76MB	AMD Radeon™ 8050S Graphics	45-120W	50	32
AMD Ryzen™ AI Max PRO 385	8C/16T	Up to 5.0 / 3.6 GHz	40MB	AMD Radeon™ 8050S Graphics	45-120W	50	32
AMD Ryzen™ AI Max PRO 380	6C/12T	Up to 4.9 / 3.6 GHz	22MB	AMD Radeon™ 8040S Graphics	45-120W	50	16

AMD Ryzen AI 300 and Ryzen AI 300 PRO Series Processors

AMD is introducing new Ryzen AI 300 Series processors, to join the Ryzen AI 300 Series family and enable premium AI experiences across notebooks. In addition to the previously announced Ryzen 9 models, the new Ryzen AI 7 and Ryzen AI 5 processor models are bringing the same trusted performance and AI capabilities to everyone.

The new Ryzen AI 300 Series processors, feature up to 8 “Zen 5” CPU cores and the latest RDNA 3.5 graphics architecture. With an industry-leading NPU³ powered by AMD XDNA 2 technology, Ryzen AI 300 Series processors provide up to five times better performance than the first generation NPU, for more AI power⁴.

For everyday business productivity, the new Ryzen AI 7 PRO 350 and Ryzen AI 5 PRO 340 processors are designed to support the next generation of Microsoft Copilot+ experiences. With a leading peak 50+ NPU TOPS of AI performance, commercial systems powered by Ryzen AI 300 PRO Series processors offer enterprises systems with the compute power to support the shift to an AI-enabled workforce. With AMD PRO Technologies, Ryzen AI 300 PRO Series processors deliver exceptional security and manageability features for business professionals on the go.

Systems powered by the new Ryzen AI 300 processors are expected to be available starting in Q1 2025.

Model	Cores / Threads	Boost 5 / Base Frequency	Total Cache	Graphics Model AMD	cTDP	NPU TOPS
AMD Ryzen™ AI 7 350	8C/16T	Up to 5.0 / 2.0 GHz	24 MB	AMD Radeon™ 860M Graphics	15-54W	50
AMD Ryzen™ AI 5 340	6C/12T	Up to 4.8 / 2.0 GHz	22 MB	AMD Radeon™ 840M Graphics	15-54W	50
AMD Ryzen™ AI 7 PRO 350	8C/16T	Up to 5.0 / 2.0 GHz	24 MB	AMD Radeon™ 860M Graphics	15-54W	50
AMD Ryzen™ AI 5 PRO 340	6C/12T	Up to 4.8 / 2.0 GHz	22 MB	AMD Radeon™ 840M Graphics	15-54W	50

AMD Ryzen 200 and Ryzen 200 PRO Series Processors
With the AMD Ryzen 200 Series processors, AMD is bringing the power and capability of “Zen 4” into the FP8 platform infrastructure bringing AI capabilities further down the stack. Ryzen 200 PRO Series mobile processors are designed to offer highly efficient and exceptional performance for everyday professionals. With up to eight CPU cores and 16 threads, AMD RDNA 3 graphics and up to 16 NPU TOPS, the Ryzen 200 Series processors offer incredible AI processing capabilities for essential applications, and sustained performance and battery life for uninterrupted use.

Systems powered by Ryzen 200 and Ryzen 200 PRO Series processors are expected to be available starting in Q2 2025.

Model	Cores / Threads	Boost 6 / Base Frequency	Total Cache	Graphics Model AMD	cTDP	NPU TOPS
AMD Ryzen™ 9 270	8C/16T	Up to 5.2 / 4.0 GHz	24MB	AMD Radeon™ 780M Graphics	35-54W	16
AMD Ryzen™ 7 260	8C/16T	Up to 5.1 / 3.8 GHz	24MB	AMD Radeon™ 780M Graphics	35-54W	16
AMD Ryzen™ 7 250	8C/16T	Up to 5.1 / 3.3 GHz	24MB	AMD Radeon™ 780M Graphics	15-30W	16
AMD Ryzen™ 5 240	6C/12T	Up to 5.0 / 4.3 GHz	22MB	AMD Radeon™ 760M Graphics	35-54W	16
AMD Ryzen™ 5 230	6C/12T	Up to 4.9 / 3.5 GHz	22MB	AMD Radeon™ 760M Graphics	15-30W	16
AMD Ryzen™ 5 220	6C/12T	Up to 4.9 / 3.2 GHz	22MB	AMD Radeon™ 740M Graphics	15-30W	N/A
AMD Ryzen™ 3 210	4C/8T	Up to 4.7 / 3.0 GHz	12MB	AMD Radeon™ 740M Graphics	15-30W	N/A
AMD Ryzen™ 7 PRO 250	8C/16T	Up to 5.1 / 3.3 GHz	24 MB	AMD Radeon™ 780M graphics	15-30W	16
AMD Ryzen™ 5 PRO 230	6C/12T	Up to 4.9 / 3.5 GHz	22 MB	AMD Radeon™ 760M graphics	15-30W	16
AMD Ryzen™ 5 PRO 220	6C/12T	Up to 4.9 / 3.2 GHz	22 MB	AMD Radeon™ 740M graphics	15-30W	N/A
AMD Ryzen™ 3 PRO 210	4C/8T	Up to 4.7 / 3 GHz	12 MB	AMD Radeon™ 740M graphics	15-30W	N/A

AMD PRO Technologies
AMD PRO Technologies provide users with enterprise-grade manageability and multi-layer security features, helping IT decision makers manage enterprise PC fleets at scale. With the recent addition of cloud-based recovery, supply chain security and additional detection and recovery processes, AMD PRO Technologies exceeds the requirements and gives users continuous protection against sophisticated attacks.

OEM Partners and Customers Continue to Lead AI PC Adoption with New Ryzen-Powered Systems
OEM partners continue to announce new AI-powered PCs and workstations featuring AMD Ryzen processors. With incredible power, performance and compatibility, these news systems exceed expectations for next-generation Copilot+ PCs. At CES this year AMD is deepening its relationships with major OEM partners, introducing a new strategic expansion with Dell, bringing new Dell Pro systems to the market powered by AMD Ryzen AI PRO processors later this year.

“It’s been incredible to see AMD and Microsoft’s longstanding partnership move into the next wave of technology, bringing AI innovation to our OEM partners,” said Pavan Davuluri, CVP Windows + Devices, Microsoft. “We’re thrilled to see the expansion of Copilot+ PCs with AMD’s new Ryzen AI products for professionals, content creators, and mainstream consumers alike.”

“ASUS has always been on the cutting edge of technology, working to bring the highest level of performance to our customers,” said Samson Hu, co-CEO, ASUS. “Today, we are announcing new Ryzen-powered systems, bringing best-in-class processing power to enable our customers to be on the forefront of AI innovation.”

“In collaboration with AMD, HP identified pain points in customer workflows that the new HP ZBook Ultra G1a and HP Z2 Mini G1a solve. Powered by AMD’s Ryzen AI Max PRO Series processors, these workstations will be the first to offer this architecture on a workstation,” said Jim Nottingham, Senior Vice President and Division President, Advanced Compute and Solutions, HP Inc. “By redefining the boundaries of what is possible on highly mobile or mini desk-side workstations, together we’re bringing customers the ability to tackle complex professional ISV and data science workflows simultaneously, while seamlessly integrating high-performance computing with the functionality of an AI PC.”

“At Lenovo, we believe meaningful innovation stems from strong partnerships. Our collaboration with AMD is a testament to this, as we work together to shape the future of computing with advanced, AI-driven solutions,” said Luca Rossi, President of Lenovo Intelligent Devices Group. “By leveraging AMD’s latest generation of cutting-edge platforms, we’re laying the groundwork for exciting new products designed to enhance personalization, boost productivity, and provide robust security. Stay tuned as we continue to empower users—whether creative professionals, businesses, or gamers—with groundbreaking solutions that push the boundaries of performance, collaboration, and innovation.”

“At MSI we are proud to build products that help gamers, creators and professionals’ level up their computing experiences,” said Eric Kuo, the Executive Vice President & NB BU GM of MSI. “Powered by new Ryzen AI 300 Series processors, the new Stealth A16 AI+ and A18 AI+ laptops bring a new level of performance for our customers.”

Customers around the globe are on the forefront of AI PC adoption, enabling their workforce to seamlessly innovate faster at all stages of their business.

“Altair® Inspire™ accelerates simulation-driven design, making fluid simulation accessible to all users. Running fluid simulation code on GPU boosts performance and scalability, enabling users to innovate faster and more efficiently,” said, Sam Mahalingam, CTO, Altair. “By leveraging the capabilities of the ROCm/HIP stack the Altair team was able to rapidly expand GPU support to AMD Radeon, including the Ryzen AI Max PRO.”

“KeyShot is thrilled to extend support for KeyShot Studio’s high-speed GPU rendering to include AMD Radeon,” said Henrik Wann Jensen, Chief Scientist, KeyShot. “The seamless enablement provided by ROCm/HIP tools was remarkable, and we are particularly excited about the substantial frame buffer available on the Ryzen AI Max PRO, which significantly enhances our rendering capabilities.” 

Supporting Resources

• Visit the AMD CES 2025 page for more information
• Learn more about Ryzen mobile processors
• Learn more about Ryzen mobile workstation processors
• Learn more about Ryzen PRO mobile processors
• Learn more about AMD PRO Technologies
• Learn more about Ryzen AI
• Learn more about Ryzen AI Software
• Become a fan of AMD on Facebook
• Follow AMD on X

About AMD

For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies. Billions of people, leading Fortune 500 businesses and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, LinkedIn and X pages.

Cautionary Statement

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products, including Ryzen™ AI Max, Ryzen AI 300 Series and Ryzen 200 Series processors and Ryzen AI Max PRO, Ryzen AI 300 PRO and Ryzen 200 PRO Series processors as well as expected benefits of AMD’s OEM partnerships, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as “would,” “may,” “expects,” “believes,” “plans,” “intends,” “projects” and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD’s control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; Nvidia’s dominance in the graphics processing unit market and its aggressive business practices; competitive markets in which AMD’s products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD’s ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD’s ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD’s products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD’s ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD’s reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD’s reliance on Microsoft and other software vendors’ support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD’s supply chain; AMD’s ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; long-term impact of climate change on AMD’s business; impact of government actions and regulations such as export regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving  expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit agreement; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses;  AMD’s ability to complete the acquisition of ZT Systems; impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain qualified personnel; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

© 2025 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Radeon, RDNA, Ryzen, XDNA and combinations thereof are trademarks of Advanced Micro Devices, Inc. Certain AMD technologies may require third-party enablement or activation. Supported features may vary by operating system. Please confirm with the system manufacturer for specific features. No technology or product can be completely secure.

The information contained herein is for informational purposes only and is subject to change without notice. Timelines, roadmaps, and/or product release dates shown in this Press Release are plans only and subject to change.

Contact:

Stacy MacDiarmid

AMD Communications
+1 (512) 658-2265
[email protected]

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/f921fd29-b75b-4676-ba05-c8e491b2f396

<sup>_______________________________________

1</sup> Trillions of Operations per Second (TOPS) for an AMD Ryzen processor is the maximum number of operations per second that can be executed in an optimal scenario and may not be typical. TOPS may vary based on several factors, including the specific system configuration, AI model, and software version. GD-243.
² Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.
³ Based on AMD product specifications and competitive products announced as of Oct 2024. AMD Ryzen™ AI PRO 300 Series processors’ NPU offers up to 55 peak TOPS. This is the most TOPS offered on any system found in enterprise today. AI PC is defined as a laptop PC with a processor that includes a neural processing unit (NPU). STXP-06.
⁴ Testing as of Sept 2024 by AMD performance labs on a Lenovo ThinkPad T14s Gen 6 with an AMD Ryzen™ AI 7 PRO 360 processor @22W, Radeon™ 880M graphics, 32GB RAM, 1TB SSD, VBS=ON, Windows 11 Pro vs. a Dell Latitude 7450 with an Intel Core Ultra 7 165U processor @15W (vPro enabled), Intel Integrated Graphics, VBS=ON, 32GB RAM, 512GB NVMe SSD, Microsoft Windows 11 Professional in the application(s) (Best Performance Mode): Cinebench R24 nT. Laptop manufactures may vary configurations yielding different results. STXP-13.
⁵ Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.
⁶ Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.

Capital Link Releases Shipping Sectors Webinar Highlights Booklet

Your 2025 Guide to Shipping Industry Trends

NEW YORK, Jan. 06, 2025 (GLOBE NEWSWIRE) — Capital Link is pleased to announce the release of the ShippingSector Webinar Highlights Booklet, titled “SHIPPING: STATE OF PLAY & WHAT LIES AHEAD”, a resource that distills top insights from the 2024 Shipping Sector Webinar Series held in December 2024.

Featuring leadership insights from senior executives of publicly listed shipping companies, the booklet provides a comprehensive analysis of the trends shaping the future of global shipping.

Focusing on six main sectors, Dry Bulk, Containers, Crude Tankers, Product Tankers, LNG and LPG, this must-have guide uncovers the trends and strategies shaping the future of shipping, amid the potential trade policy changes, a new US administration, geopolitical risks, key trade rerouting, and environmental regulations—with more changes anticipated for 2025.

WHY YOU SHOULD READ THE BOOKLET

Covering six pivotal sectors, this essential guide is a resource for investors, industry professionals, and stakeholders who seek a deeper understanding of the dynamics driving the maritime industry.

• Cutting-Edge Insights: Explore the strategies and market moves driving the industry’s evolution.
• Expert Voices: Hear directly from leading shipowners, a major stakeholder group in the global supply chain.
• Sector Spotlights: Dive deep into key segments and discover what’s next for the industry.

GET YOUR COMPLIMENTARY PDF BOOKLET AND ACCESS THE WEBINARS

Access the replay of the webinars on the Capital Link website to gain insights from industry leaders and expert panel discussions. To access information on the speakers and the webinar series, please click on the link below
https://webinars.capitallink.com/2024/shipping/

Download your complimentary PDF copy here: https://webinars.capitallink.com/2024/shipping/signup.html.

PARTICIPATING COMPANIES IN EACH SECTOR WEBINAR

DRY BULK SHIPPING SECTOR

Moderator:

Mr. Gregory Lewis, Head of Maritime Research – BTIG
Panelists:

• Mr. Aristides Pittas, Chairman & CEO – EuroDry Ltd. (NASDAQ: EDRY)
• Mr. Peder Simonsen, Interim CEO & CFO – Golden Ocean Group Ltd. (NASDAQ: GOGL) (OSLO: GOGL)
• Dr. Loukas Barmparis, President – Safe Bulkers, Inc. (NYSE: SB)
• Mr. Stamatis Tsantanis, Chairman & CEO – Seanergy Maritime Holdings Corp. (NASDAQ: SHIP); Founder, Chairman & CEO – United Maritime Corporation (NASDAQ: USEA)

CONTAINER SHIPPING SECTOR

Moderator:

Ms. Muneeba Kayani, Managing Director, Head of Europe Transport, Global Research – Bank of America Global Research
Panelists:

• Mr. Evangelos Chatzis, CFO – Danaos Corporation (NYSE: DAC)
• Mr. Aristides Pittas, Chairman & CEO – Euroseas Ltd. (NASDAQ: ESEA)
• Mr. Thomas Lister, CEO – Global Ship Lease, Inc. (NYSE: GSL)
• Mr. Constantin Baack, Co-CEO & CFO – MPC Container Ships ASA (OSLO: MPCC)

PRODUCT TANKER SHIPPING SECTOR

Moderator:

Mr. Jorgen Lian, Head of Shipping Equity Research – DNB Markets
Panelists:

• Mr. Carlos Balestra di Mottola, CEO – d’Amico International Shipping S.A. (OTCQX: DMCOF) (DIS.MI)
• Mr. Mikael Skov, CEO – Hafnia Ltd. (NYSE: HAFN) (OSLO: HAFNIA)
• Ms. Lois K. Zabrocky, CEO – International Seaways Inc. (NYSE: INSW)
• Mr. Robert Bugbee, President – Scorpio Tankers Inc. (NYSE: STNG)

CRUDE TANKERS SHIPPING SECTOR

Moderator:

Mr. Nils Thommesen , Deputy Head of Research – Fearnley Securities
Panelists:

• Mr. Svein Moxnes Harfjeld, President & CEO – DHT Holdings, Inc. (NYSE: DHT)
• Mr. Aristidis Alafouzos, CEO – Okeanis Eco Tankers Corp. (NYSE: ECO) (OSLO: OET)
• Mr. Harrys Kosmatos, Co-CFO – TEN Ltd. (NYSE: TEN)
• Mr. Kenneth Hvid, President & CEO – Teekay Tankers Ltd. (NYSE: TNK)

LNG SHIPPING SECTOR

Moderator:

Mr. Liam Burke, Managing Director – B. Riley Securities
Panelists:

• Mr. Nicholas Gleeson, CFO – ADNOC Logistics & Services (DH: ADNOCLS)
• Mr. Jerry Kalogiratos, CEO – Capital Clean Energy Carriers Corp. (NASDAQ: CCEC)
• Mr. Oystein Kalleklev, CEO – FLEX LNG Ltd. (NYSE: FLNG)

LPG SHIPPING SECTOR

Moderator:

Mr. Fredrik Dybwad, Senior Shipping Analyst – Fearnley Securities
Panelists:

• Mr. Kristian Sorensen, CEO – BW LPG Ltd. (NYSE: BWLP) (OSLO: BWLPG)
• Mr. Theodore (Ted) Young, CFO – Dorian LPG Ltd. (NYSE: LPG)
• Mr. Mads Peter Zacho, CEO – Navigator Gas (NYSE: NVGS)

ORGANIZER


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NEW YORK, NY, Jan. 06, 2025 (GLOBE NEWSWIRE) — Qomolangma Acquisition Corp. (NASDAQ: QOMO) (“Qomolangma” or the “Company”), a publicly-traded special purpose acquisition company, today announced that it will redeem all of its outstanding public shares of common stock, par value $0.0001 (the “public shares”), effective as of December 27, 2024, because Qomolangma will not consummate an initial business combination within the time period required by its Amended and Restated Certificate of Incorporation (the “Certificate of Incorporation”).

“Our board made the difficult decision to proceed with a liquidation because we believe doing so is in the best interest of our stockholders,” said Jonathan Myers, CEO of Qomolangma. “We met with many strong companies over the last two years and signed an LOI on a very promising transaction, which ultimately did not result in a definitive agreement. However, current market dynamics and our sponsor’s inability to continue to fund the extension payments persuaded us that the prudent decision was to return to stockholders the capital held in trust, with interest, on our original timeline rather than seek a further extension.”

Delisting of the Company

On January 3, 2025, the Company notified The Nasdaq Stock Market (“Nasdaq”) that the Company seeks a voluntary delisting. The Company expects that Nasdaq will file a Form 25 with the U.S. Securities and Exchange Commission (the “Commission”) to delist its securities, and that the delisting will become effective ten days after Nasdaq files the Form 25 with the Commission to complete the delisting. The Company thereafter expects to file a Form 15 with the Commission to terminate the registration of its securities under the Securities Exchange Act of 1934, as amended.

As stated in the Company’s registration statement on Form S-1, effective as of September 29, 2022, and in the Company’s Amended and Restated Certificate of Incorporation, as amended through the third amendment thereof, if the Company is unable to complete an initial business combination within 36 months of the closing of the Company’s initial public offering, the Company will: (i) cease all operations except for the purpose of winding up, (ii) as promptly as reasonably possible but not more than ten business days thereafter subject to lawfully available funds therefor, redeem 100% of the public shares in consideration of a per share price, payable in cash, equal to the quotient obtained by dividing (A) the aggregate amount then on deposit in the trust account (net of amounts withdrawn by the Company to pay its taxes and less up to $50,000 of such net interest to pay dissolution expenses), including interest, by (B) the total number of then outstanding public shares, which redemption will completely extinguish rights of the holders of the public shares (including the right to receive further liquidating distributions, if any), subject to applicable law, and (iii) as promptly as reasonably possible following such redemption, subject to the approval of the remaining stockholders and the board of directors of the Company in accordance with applicable law, dissolve and liquidate, subject in each case to the Company’s obligations under the General Corporation Law of the State of Delaware, as amended from time to time, to provide for claims of creditors and other requirements of applicable law.

Redemption Amount

The per-share redemption price for the public shares will be approximately $10.88 (the “Redemption Amount”), which amount reflects an adjustment of $50,000 of the interest and dividend income from the Company’s trust account to pay dissolution expenses. The balance of the Company’s trust account, including the reduction for the dissolution expenses, was also adjusted for $563,803 in federal taxes due for 2023 and 2024 and $59,172.80 in Delaware taxes owed for 2023 and 2024 which were removed from the trust account prior to the calculation of the Redemption Amount.

The Redemption Amount will be payable to the holders of the public shares upon presentation of their respective stock or unit certificates or other delivery of their shares or units to the Company’s transfer agent, Equiniti Trust Company LLC, formerly known as American Stock Transfer & Trust Company LLC. Beneficial owners of public shares held in “street name,” however, will not need to take any action in order to receive the Redemption Amount.

There will be no redemption rights or liquidating distributions with respect to the Company’s warrants, which will expire worthless. The Company’s sponsor has waived its redemption rights with respect to the outstanding founder shares and private placement warrants.

Forward-Looking Statements

This press release may include, and oral statements made from time to time by representatives of Qomolangma may include “forward-looking statements” within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Statements regarding possible business combinations and the financing thereof, and related matters, as well as all other statements other than statements of historical fact included in this press release are forward-looking statements. When used in this press release, words such as “anticipate,” “believe,” “continue,” “could,” “estimate,” “expect,” “intend,” “may,” “might,” “plan,” “possible,” “potential,” “predict,” “project,” “should,” “would” and similar expressions, as they relate to us or our management team, identify forward-looking statements. Such forward-looking statements are based on the beliefs of management, as well as assumptions made by, and information currently available to, the Company’s management. Actual results could differ materially from those contemplated by the forward-looking statements as a result of certain factors detailed in the Company’s filings with the Securities and Exchange Commission (“SEC”). All subsequent written or oral forward-looking statements attributable to us or persons acting on our behalf are qualified in their entirety by this paragraph. Forward-looking statements are subject to numerous conditions, many of which are beyond the control of the Company, including those set forth in the Risk Factors section of the Company’s annual report on Form 10-K for the fiscal year ended December 31, 2023, filed with the SEC on July 2, 2024. The Company undertakes no obligation to update these statements for revisions or changes after the date of this release, except as required by law.

Contacts:

Qomolangma Acquisition Corp.
Jonathan Myers, CEO
Phone: (318) 747-6340

SOURCE: Qomolangma Acquisition Corp.