{"id":985371,"date":"2026-07-28T06:33:34","date_gmt":"2026-07-28T10:33:34","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/qnity-advances-thermal-management-portfolio-as-ai-and-high-power-electronics-push-heat-to-the-center-of-design\/"},"modified":"2026-07-28T06:33:34","modified_gmt":"2026-07-28T10:33:34","slug":"qnity-advances-thermal-management-portfolio-as-ai-and-high-power-electronics-push-heat-to-the-center-of-design","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/qnity-advances-thermal-management-portfolio-as-ai-and-high-power-electronics-push-heat-to-the-center-of-design\/","title":{"rendered":"Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design"},"content":{"rendered":"

<\/p>\n

Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design<\/b><\/p>\n

New Laird\u2122 Tflex\u2122 CR910 liquid gap filler and Laird\u2122 Tgrease\u2122 3000 thermal grease expand Qnity\u2019s thermal management portfolio, helping engineers address growing thermal challenges across the semiconductor value chain<\/i><\/p>\n

WILMINGTON, Del.–(BUSINESS WIRE<\/a>)–
\nQnity Electronics, Inc. (\u201cQnity\u201d) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the launch of two new thermal interface materials (TIM): Laird\u2122 Tflex\u2122 CR910, a two-part dispensable liquid gap filler, and Tgrease\u2122 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications.<\/p>\n

\nIncreasingly complex electronic architecture has made thermal management a foundational design requirement. Designers must manage increasing power densities while working with tighter tolerance and more complex assemblies\u2014balancing performance, manufacturability, and long-term reliability under demanding, real-world conditions.<\/p>\n

\n\u201cAs AI, advanced computing and electrification continue to push system performance to new levels, managing heat has become one of the industry’s most important engineering challenges,” said Chuck Xu, President, Interconnect Solutions, Qnity. “Thermal management is no longer simply about protecting components\u2014it’s about enabling the next generation of innovation. These innovations reflect Qnity’s broader commitment to delivering the technologies and engineering solutions that power progress across the semiconductor and electronics ecosystem.”<\/p>\n

\nDrawing on its deep expertise in materials science and application engineering, Qnity works closely with customers to develop thermal management solutions that not only solve today’s design challenges but also prepare for future technology roadmaps.<\/p>\n

Laird\u2122 Tflex\u2122 CR910<\/b> dispensable liquid gap filler combines high thermal conductivity of 9.2 W\/mK, low thermal resistance, and a soft, compliant material profile to help engineers manage large or uneven gap tolerances while withstanding mechanical stresses and maintaining thermal performance.<\/p>\n

Laird\u2122 Tgrease\u2122 3000 is<\/b> a non-silicone-based thermal grease developed for high-temperature applications, certified for use up to 200 \u00b0C operating temperature, and designed to provide efficient heat transfer across thin bondlines. Engineered specifically for Silicon Carbide (SiC) and Gallium Nitride (GaN) devices operating at increasingly elevated temperatures, Tgrease\u2122 3000 offers 3.2 W\/mK thermal conductivity, lower thermal resistance and extremely low pump-out characteristics, helping mitigate rising device temperatures, improve reliability and extend product life.<\/p>\n

\nLearn more about how Qnity is powering the next leap in electronics at www.qnityelectronics.com<\/a>.<\/p>\n

About Qnity
\n
<\/b>Qnity is a premier technology solutions provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow\u2019s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com<\/a>.<\/p>\n

\nQnity\u2122, the Qnity Node Logo, and all products, unless otherwise noted, denoted with \u2122 or \u00ae<\/sup> are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.<\/p>\n

\"\"<\/p>\n

View source version on businesswire.com: <\/span>https:\/\/www.businesswire.com\/news\/home\/20260728823961\/en\/<\/a><\/span><\/p>\n

Media Contact
\n<\/b>
Ashley Boucher
\n
Ashley.Boucher@qnityelectronics.com<\/a><\/p>\n

KEYWORDS:<\/b> Delaware United States North America<\/p>\n

INDUSTRY KEYWORDS:<\/b> Hardware Artificial Intelligence Engineering Consumer Electronics Chemicals\/Plastics Technology Semiconductor Manufacturing<\/p>\n

MEDIA:<\/b><\/p>\n\n\n\n\n
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Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design New Laird\u2122 Tflex\u2122 CR910 liquid gap filler and Laird\u2122 Tgrease\u2122 3000 thermal grease expand Qnity\u2019s thermal management portfolio, helping engineers address growing thermal challenges across the semiconductor value chain WILMINGTON, Del.–(BUSINESS WIRE)– Qnity Electronics, Inc. (\u201cQnity\u201d) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the launch of two new thermal interface materials (TIM): Laird\u2122 Tflex\u2122 CR910, a two-part dispensable liquid gap filler, and Tgrease\u2122 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications. Increasingly complex electronic architecture has made thermal management a foundational design … <\/p>\n

Continue reading “Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-985371","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nQnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/qnity-advances-thermal-management-portfolio-as-ai-and-high-power-electronics-push-heat-to-the-center-of-design\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design New Laird\u2122 Tflex\u2122 CR910 liquid gap filler and Laird\u2122 Tgrease\u2122 3000 thermal grease expand Qnity\u2019s thermal management portfolio, helping engineers address growing thermal challenges across the semiconductor value chain WILMINGTON, Del.–(BUSINESS WIRE)– Qnity Electronics, Inc. (\u201cQnity\u201d) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the launch of two new thermal interface materials (TIM): Laird\u2122 Tflex\u2122 CR910, a two-part dispensable liquid gap filler, and Tgrease\u2122 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications. 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