{"id":975460,"date":"2026-06-24T18:31:05","date_gmt":"2026-06-24T22:31:05","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/qualcomm-and-hugging-face-expand-relationship-to-advance-open-developer-driven-ai-from-device-to-cloud\/"},"modified":"2026-06-24T18:31:05","modified_gmt":"2026-06-24T22:31:05","slug":"qualcomm-and-hugging-face-expand-relationship-to-advance-open-developer-driven-ai-from-device-to-cloud","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/qualcomm-and-hugging-face-expand-relationship-to-advance-open-developer-driven-ai-from-device-to-cloud\/","title":{"rendered":"Qualcomm and Hugging Face Expand Relationship to Advance Open, Developer-Driven AI from Device to Cloud"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }\n.bwlistdisc { list-style-type: disc }\n.bwuline { text-decoration: underline }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b>Qualcomm and Hugging Face Expand Relationship to Advance Open, Developer-Driven AI from Device to Cloud<\/b><\/p>\n<p>NEW YORK&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<br \/>\nQualcomm Technologies, Inc. (NASDAQ: QCOM):<\/p>\n<p id=\"news-body-cta\">This press release features multimedia. View the full release here: <a href=\"https:\/\/www.businesswire.com\/news\/home\/20260624641281\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20260624641281\/en\/<\/a><\/p>\n<div id=\"bwbodyimg\" style=\"width: 480px;float:left;padding-left:0px;padding-right:20px;padding-top:0px;padding-bottom:0px\"><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260624641281\/en\/2838813\/4\/QCHF.jpg\" alt=\"\" \/><\/div>\n<p><b>Highlights:<\/b><\/p>\n<ul class=\"bwlistdisc\">\n<li>\nBrings Hugging Face internal and developer workloads onto Qualcomm Dragonfly data center solutions.<\/p>\n<\/li>\n<li>\nEnables agentic AI model onboarding on Qualcomm Technologies\u2019 platforms across the compute continuum (devices to data center).<\/p>\n<\/li>\n<li>\nDevelopment of Hugging Face Agent for hybrid orchestration of AI workloads between devices with Qualcomm Technologies\u2019 platforms and data center solutions.<\/p>\n<\/li>\n<\/ul>\n<p>\nQualcomm Technologies, Inc. (NASDAQ: QCOM) today announced the expansion of its strategic relationship with Hugging Face to advance open, developer-driven artificial intelligence (AI) from devices to cloud infrastructure. This collaboration is intended to unite Qualcomm Technologies\u2019 industry-leading device to data center platforms with Hugging Face\u2019s global AI community, model ecosystem, and developer software tools, to enable a new era of agentic AI and hybrid inference at scale.<\/p>\n<p>\nThe collaboration is designed to unlock a unified AI experience by seamlessly connecting edge devices and cloud systems powered by Qualcomm Technologies\u2019 products. Through this effort, applications can intelligently balance performance, cost, and latency in order to deliver more powerful and accessible AI solutions for developers and enterprises worldwide.<\/p>\n<p>\n\u201cThis engagement represents a major step forward in making advanced AI more open, scalable, and accessible,\u201d said Cristiano Amon, President and CEO, Qualcomm Incorporated. \u201cBy combining Qualcomm\u2019s leadership in high-performance, low-power computing with Hugging Face\u2019s vibrant developer ecosystem, we are enabling a new generation of AI applications that seamlessly span device and cloud.\u201d<\/p>\n<p>\n&#8220;Increasingly the world is running on open and local models because they&#8217;re more affordable than the big APIs and private by design,&#8221; said Cl\u00e9ment Delangue, Co-founder and CEO, Hugging Face. &#8220;Together with Qualcomm Technologies, using Modular software and tools, we&#8217;re making it easy for our 16 million developers to run open models everywhere, from a device in your hand to a full rack in the data center, with agents that work across the compute continuum.\u201d<\/p>\n<p>\nThe collaboration is expected to focus on three key pillars across Qualcomm, Snapdragon, Dragonwing and Dragonfly family of products, driving AI usage from Hugging Face\u2019s 16 million developers across data center infrastructure, accelerating AI model deployment from edge devices to cloud, and enabling agentic AI orchestration on hybrid AI environments.<\/p>\n<p>\nThe first element focuses on driving open AI model usage by connecting Qualcomm Technologies\u2019 data center infrastructure with Hugging Face\u2019s AI storage infrastructure. Through the collaboration, Hugging Face\u2019s storage and inference services are planned to map to high-performance, energy-efficient data center solutions powered by Qualcomm Dragonfly\u2122 products. Further, the Hugging Face global developer ecosystem is expected to be able to deploy and scale AI workloads on data center solutions powered by Qualcomm Dragonfly products, with the goal of creating a direct path from model experimentation to production deployment of apps and agents.<\/p>\n<p>\nThe second element of the collaboration is planned to accelerate AI model deployment across devices and data center racks powered by Qualcomm Technologies products. With over 3 million open models for every task, domain and modality, Hugging Face offers ready-to-use models for every use case and industry.<span class=\"bwuline\" \/>AI models from the Hugging Face ecosystem are planned to be onboarded on Qualcomm Technologies platforms using an Agent that handles setup, optimization and deployment, with zero manual integration work. This is intended to make it easier for developers to bring advanced AI capabilities to smartphones, PCs, wearables, industrial systems, automotive platforms, newer edge devices and data center solutions powered by Qualcomm products, with a single workflow from edge to cloud. This work is designed to simplify the developer journey, reducing time to deployment of AI applications and agents. As part of the engagement, Hugging Face will offer access to Hugging Face PRO to customers using devices or cloud systems with Qualcomm Technologies\u2019 platforms, enabling premium storage, compute and collaboration to build with open models.<\/p>\n<p>\nThe third element enables the orchestration of Agentic AI across device and cloud environments powered by Qualcomm Technologies products. Qualcomm Technologies and Hugging Face plan to support a distributed AI framework in which intelligent agents can operate across on-device and cloud systems, dynamically orchestrating models and workflows based on performance, cost, privacy, and latency needs. Together, these efforts are intended to help developers build a more seamless hybrid AI experience, where intelligence can move fluidly across the compute continuum from edge devices to data center infrastructure. Developers will be able to access Modular\u2019s AI software components and tools via the Hugging Face ecosystem.<\/p>\n<p><b>About Qualcomm<\/b><\/p>\n<p>\nQualcomm is a global computing leader at the center of the AI era, enabling intelligence to scale from the most personal devices to large-scale infrastructure. Building on more than four decades of innovation, we develop platforms and solutions that bring together advanced AI, high-performance low power computing, and industry-leading connectivity\u2014powering products and services used around the world. At Qualcomm, we are engineering human progress.<\/p>\n<p>\nQualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering and research and development functions and substantially all of our products and services businesses, including our QCT semiconductor business. Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and\/or its subsidiaries. Qualcomm patents are licensed by Qualcomm Incorporated. Qualcomm, Snapdragon, Qualcomm Dragonwing and Qualcomm Dragonfly are trademarks or registered trademarks of Qualcomm Incorporated.<\/p>\n<p><b>About Hugging Face<\/b><\/p>\n<p>\nHugging Face is the leading open platform for AI Builders, making it easy for developers to build their own AI using open source and its collaboration platform hosting millions of open models and datasets for the global AI community.<\/p>\n<p>\nHugging Face PRO (<a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fhf.co%2Fpro&amp;esheet=54559547&amp;newsitemid=20260624641281&amp;lan=en-US&amp;anchor=hf.co%2Fpro&amp;index=1&amp;md5=031edb3519606d324e98ed10fd2e21e0\">hf.co\/pro<\/a>) is an all-in-one subscription to discover, use, and build with AI on Hugging Face.<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20260624641281r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20260624641281\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20260624641281\/en\/<\/a><\/span><\/p>\n<p>\nQualcomm Contacts:<br \/>\n<br \/>Clare Conley, Communications<br \/>\n<br \/>Phone: 1-858-845-5959<br \/>\n<br \/>Email: <a rel=\"nofollow\" href=\"mailto:corpcomm@qualcomm.com\">corpcomm@qualcomm.com<br \/>\n<\/a><\/p>\n<p>Brett Simpson, Investor Relations<br \/>\n<br \/>Phone: 1-858-658-4813<br \/>\n<br \/>Email: <a rel=\"nofollow\" href=\"mailto:ir@qualcomm.com\">ir@qualcomm.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> New York United States North America<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Data Management Semiconductor Technology Software Artificial Intelligence Internet Hardware<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Photo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260624641281\/en\/2838813\/3\/QCHF.jpg\" alt=\"Photo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260624641281\/en\/2310939\/3\/Qualcomm_Logo.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Qualcomm and Hugging Face Expand Relationship to Advance Open, Developer-Driven AI from Device to Cloud NEW YORK&#8211;(BUSINESS WIRE)&#8211; Qualcomm Technologies, Inc. (NASDAQ: QCOM): This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20260624641281\/en\/ Highlights: Brings Hugging Face internal and developer workloads onto Qualcomm Dragonfly data center solutions. Enables agentic AI model onboarding on Qualcomm Technologies\u2019 platforms across the compute continuum (devices to data center). Development of Hugging Face Agent for hybrid orchestration of AI workloads between devices with Qualcomm Technologies\u2019 platforms and data center solutions. Qualcomm Technologies, Inc. (NASDAQ: QCOM) today announced the expansion of its strategic relationship with Hugging Face to advance open, developer-driven artificial intelligence (AI) from devices to cloud infrastructure. This collaboration is intended to unite &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/qualcomm-and-hugging-face-expand-relationship-to-advance-open-developer-driven-ai-from-device-to-cloud\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Qualcomm and Hugging Face Expand Relationship to Advance Open, Developer-Driven AI from Device to Cloud&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-975460","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Qualcomm and Hugging Face Expand Relationship to Advance Open, Developer-Driven AI from Device to Cloud - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/qualcomm-and-hugging-face-expand-relationship-to-advance-open-developer-driven-ai-from-device-to-cloud\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Qualcomm and Hugging Face Expand Relationship to Advance Open, Developer-Driven AI from Device to Cloud - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Qualcomm and Hugging Face Expand Relationship to Advance Open, Developer-Driven AI from Device to Cloud NEW YORK&#8211;(BUSINESS WIRE)&#8211; Qualcomm Technologies, Inc. (NASDAQ: QCOM): This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20260624641281\/en\/ Highlights: Brings Hugging Face internal and developer workloads onto Qualcomm Dragonfly data center solutions. Enables agentic AI model onboarding on Qualcomm Technologies\u2019 platforms across the compute continuum (devices to data center). Development of Hugging Face Agent for hybrid orchestration of AI workloads between devices with Qualcomm Technologies\u2019 platforms and data center solutions. Qualcomm Technologies, Inc. (NASDAQ: QCOM) today announced the expansion of its strategic relationship with Hugging Face to advance open, developer-driven artificial intelligence (AI) from devices to cloud infrastructure. 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(NASDAQ: QCOM): This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20260624641281\/en\/ Highlights: Brings Hugging Face internal and developer workloads onto Qualcomm Dragonfly data center solutions. Enables agentic AI model onboarding on Qualcomm Technologies\u2019 platforms across the compute continuum (devices to data center). Development of Hugging Face Agent for hybrid orchestration of AI workloads between devices with Qualcomm Technologies\u2019 platforms and data center solutions. Qualcomm Technologies, Inc. (NASDAQ: QCOM) today announced the expansion of its strategic relationship with Hugging Face to advance open, developer-driven artificial intelligence (AI) from devices to cloud infrastructure. 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