{"id":974725,"date":"2026-06-23T09:30:27","date_gmt":"2026-06-23T13:30:27","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/"},"modified":"2026-06-23T09:30:27","modified_gmt":"2026-06-23T13:30:27","slug":"globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/","title":{"rendered":"GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications"},"content":{"rendered":"

\nProduction-ready 3DI technology supports more compact FEMs for advanced 5G devices
\n<\/h2>\n
\n

MALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) — GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE\u2122 wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-performance cellular front-ends. Manufactured at GF\u2019s 300mm facility in Singapore, 9SW SLATE technology is expected to ramp to volume production by the second half of 2027.<\/p>\n

GF\u2019s first-generation SLATE technology supports wafer-to-wafer (W2W) bonding, enabling designers to bond two 9SW wafers to stack and integrate large-size field-effect transistors (FETs) in vertical architectures. By folding large FETs across bonded wafers, SLATE technology can reduce overall die size by up to 45%, decreasing RF board space and total design area for space-constrained applications in smart mobile devices, including switches, low-noise amplifiers (LNAs) and antenna tuners.<\/p>\n

First introduced in 2023, the 9SW RF-SOI platform is GF\u2019s most advanced RF solution for front-end modules (FEMs), spanning sub-8GHz and FR3 frequency ranges for 5G mobile devices and satellite communications. 9SW, the fourth generation of GF\u2019s XSW technology, delivers a significant reduction in standby currents for longer battery life with a more than 20% enhancement in efficiency through lower on-resistance and off-capacitance (Ron*Coff).<\/p>\n

\u201cDeploying SLATE on 9SW represents a significant step forward in RF integration, enabling our customers to design more compact and power-efficient solutions for next-generation 5G devices without compromising RF performance,\u201d said Shankaran Janardhanan, senior vice president of GF\u2019s RF business. \u201cBy combining our industry-leading 9SW platform with SLATE advanced packaging technology, we are unlocking new opportunities for innovation across next-generation mobile and wireless applications.\u201d<\/p>\n

\u201cGF\u2019s SLATE technology applied to its 9SW platform represents an important advancement in RF front-end integration, enabling designers to overcome traditional scaling and integration challenges,\u201d said Vinod Kariat, corporate vice president of Custom IC and PCB group at Cadence. \u201cThrough Cadence\u2019s Virtuoso Studio homogeneous integration, analysis and verification users can unlock SLATE\u2019s 3D integration potential \u2013 giving designers the speed and confidence to deliver next-generation 5G front-end modules from concept to silicon.\u201d<\/p>\n

GF\u2019s SLATE wafer-to-wafer bonding technology offers a roadmap for heterogeneous 3DI across its many differentiated technologies, including FDX\u2122 FD-SOI, RF-SOI and silicon germanium (SiGe), for even greater system-level capabilities across diverse markets such as data centers, satellite connectivity, IoT and mobile devices.<\/p>\n

An integrated process design kit (PDK) is available through the GF Connect portal to help jumpstart the design process. 9SW and 9SW SLATE are available for prototyping through GF\u2019s GlobalShuttle\u2122 multi-project wafer program<\/a> with shuttles scheduled for the second half of the year.<\/p>\n

\n About GF <\/strong>
\n
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other high-growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF\u2019s talented, global team\u00a0remains\u00a0focused every day on security,\u00a0longevity\u00a0and sustainability. For more information, visit\u00a0www.gf.com<\/a>.\u00a0<\/p>\n

\n Forward-looking information<\/strong>
\n
This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law.<\/p>\n

\n Media Contact: <\/strong>
\n
Stephanie Gonzalez
stephanie.gonzalez@gf.com<\/a><\/p>\n

\"\"
\n
\n \"\"\n <\/div>\n

<\/div>\n","protected":false},"excerpt":{"rendered":"

Production-ready 3DI technology supports more compact FEMs for advanced 5G devices MALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) — GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE\u2122 wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-performance cellular front-ends. Manufactured at GF\u2019s 300mm facility in Singapore, 9SW SLATE technology is expected to ramp to volume production by the second half of 2027. GF\u2019s first-generation SLATE technology supports wafer-to-wafer (W2W) bonding, enabling designers to bond two 9SW wafers to stack and integrate large-size field-effect transistors (FETs) in vertical architectures. By folding large FETs across bonded wafers, SLATE technology can reduce overall die size by up to 45%, decreasing … <\/p>\n

Continue reading “GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-974725","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nGlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Production-ready 3DI technology supports more compact FEMs for advanced 5G devices MALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) — GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE\u2122 wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-performance cellular front-ends. Manufactured at GF\u2019s 300mm facility in Singapore, 9SW SLATE technology is expected to ramp to volume production by the second half of 2027. GF\u2019s first-generation SLATE technology supports wafer-to-wafer (W2W) bonding, enabling designers to bond two 9SW wafers to stack and integrate large-size field-effect transistors (FETs) in vertical architectures. By folding large FETs across bonded wafers, SLATE technology can reduce overall die size by up to 45%, decreasing … Continue reading "GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications"\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2026-06-23T13:30:27+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTc1MTA1NiM3NjcyOTIyIzIwOTk0MzQ=\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications\",\"datePublished\":\"2026-06-23T13:30:27+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/\"},\"wordCount\":622,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTc1MTA1NiM3NjcyOTIyIzIwOTk0MzQ=\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/\",\"name\":\"GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications - Market Newsdesk\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTc1MTA1NiM3NjcyOTIyIzIwOTk0MzQ=\",\"datePublished\":\"2026-06-23T13:30:27+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTc1MTA1NiM3NjcyOTIyIzIwOTk0MzQ=\",\"contentUrl\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTc1MTA1NiM3NjcyOTIyIzIwOTk0MzQ=\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#website\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/\",\"name\":\"Market Newsdesk\",\"description\":\"Latest Business News in Real Time\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\",\"name\":\"Newsdesk\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g\",\"caption\":\"Newsdesk\"},\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/author\\\/newsdesk\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications - Market Newsdesk","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/","og_locale":"en_US","og_type":"article","og_title":"GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications - Market Newsdesk","og_description":"Production-ready 3DI technology supports more compact FEMs for advanced 5G devices MALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) — GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE\u2122 wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-performance cellular front-ends. Manufactured at GF\u2019s 300mm facility in Singapore, 9SW SLATE technology is expected to ramp to volume production by the second half of 2027. GF\u2019s first-generation SLATE technology supports wafer-to-wafer (W2W) bonding, enabling designers to bond two 9SW wafers to stack and integrate large-size field-effect transistors (FETs) in vertical architectures. By folding large FETs across bonded wafers, SLATE technology can reduce overall die size by up to 45%, decreasing … Continue reading \"GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/","og_site_name":"Market Newsdesk","article_published_time":"2026-06-23T13:30:27+00:00","og_image":[{"url":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTc1MTA1NiM3NjcyOTIyIzIwOTk0MzQ=","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications","datePublished":"2026-06-23T13:30:27+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/"},"wordCount":622,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/#primaryimage"},"thumbnailUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTc1MTA1NiM3NjcyOTIyIzIwOTk0MzQ=","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/","name":"GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications - Market Newsdesk","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/#primaryimage"},"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/#primaryimage"},"thumbnailUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTc1MTA1NiM3NjcyOTIyIzIwOTk0MzQ=","datePublished":"2026-06-23T13:30:27+00:00","author":{"@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"breadcrumb":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/#primaryimage","url":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTc1MTA1NiM3NjcyOTIyIzIwOTk0MzQ=","contentUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTc1MTA1NiM3NjcyOTIyIzIwOTk0MzQ="},{"@type":"BreadcrumbList","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/globalfoundries-qualifies-slate-advanced-packaging-technology-on-9sw-platform-for-next-generation-radio-frequency-applications\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.marketnewsdesk.com\/"},{"@type":"ListItem","position":2,"name":"GlobalFoundries qualifies SLATE\u2122 advanced packaging technology on 9SW platform for next-generation radio frequency applications"}]},{"@type":"WebSite","@id":"https:\/\/www.marketnewsdesk.com\/#website","url":"https:\/\/www.marketnewsdesk.com\/","name":"Market Newsdesk","description":"Latest Business News in Real Time","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.marketnewsdesk.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Person","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979","name":"Newsdesk","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","caption":"Newsdesk"},"url":"https:\/\/www.marketnewsdesk.com\/index.php\/author\/newsdesk\/"}]}},"_links":{"self":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts\/974725","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/comments?post=974725"}],"version-history":[{"count":0,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts\/974725\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/media?parent=974725"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/categories?post=974725"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/tags?post=974725"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}