{"id":973844,"date":"2026-06-18T16:34:45","date_gmt":"2026-06-18T20:34:45","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing\/"},"modified":"2026-06-18T16:34:45","modified_gmt":"2026-06-18T20:34:45","slug":"intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing\/","title":{"rendered":"Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b>Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing<\/b><\/p>\n<p>SANTA CLARA, Calif.&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<br \/>\nIntel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel\u2019s ability to deliver differentiated, system-level innovation for customers.<\/p>\n<p><b>Seok-Hee Lee Appointed to Lead Advanced Packaging<\/b><\/p>\n<p>\nAs part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused business with dedicated leadership. This reflects the growing importance and complexity of packaging as a key enabler of performance, power efficiency, and heterogeneous integration across AI systems.<\/p>\n<p>\n\u201cAdvanced packaging and system integration are becoming defining capabilities for next-generation computing systems,\u201d said Lip-Bu Tan, Intel CEO. \u201cSeok-Hee brings deep expertise in leading complex, high-scale technology and manufacturing organizations, along with a strong track record of operational execution. Seok-Hee\u2019s insights will help Intel further strengthen our system integration capabilities, allowing us to tightly couple leading-edge logic, memory, networking, and other components to build high-performance computing systems for Intel Foundry customers. He is the right leader to build and scale this critical part of the Intel Foundry business as we prepare to ramp advanced packaging technologies, including EMIB-T and HBI, to high volume for customers and partners.\u201d<\/p>\n<p>\nLee joins Intel from SK On, where he served as president and CEO, and previously served as president and CEO of SK hynix. A semiconductor veteran, he has also held engineering leadership roles at Intel and in academia, bringing deep expertise in advanced process technologies and large-scale manufacturing.<\/p>\n<p>\n\u201cIntel is uniquely positioned to lead in advanced packaging as demand for system-level integration accelerates across AI and high-performance computing,\u201d said Lee. \u201cI\u2019m excited to return home and to join the Intel team as we help advance the company\u2019s technology leadership, manufacturing capabilities, and customer commitments in this critical area.\u201d<\/p>\n<p>\nWith this change, Naga Chandrasekaran, executive vice president of Intel Foundry, will continue to report to CEO Lip-Bu Tan and lead front-end technology development and front-end manufacturing as the company focuses on accelerating the ramp of Intel 18A, Intel 14A, and future technologies. He will also continue to oversee design enablement and end-to-end customer-facing and business enablement functions that support Intel Foundry\u2019s growth. This new focused and scalable operating model reinforces Intel\u2019s commitment to strengthening its technology development and manufacturing engine, giving customers and partners greater confidence in Intel\u2019s ability to deliver with speed, consistency, and predictability.<\/p>\n<p>\nAs part of the announcement, Intel also shared that executive vice president Navid Shahriari will be retiring after a distinguished 37-year career at the company.<\/p>\n<p><b>About Intel<\/b><\/p>\n<p>\nIntel (Nasdaq: INTC) designs and manufactures advanced semiconductors that connect and power the modern world. Every day, our engineers create new technologies that enhance and shape the future of computing to enable new possibilities for every customer we serve. Learn more at <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.intel.com%2F&amp;esheet=54556856&amp;newsitemid=20260618556758&amp;lan=en-US&amp;anchor=intel.com&amp;index=1&amp;md5=1a1c73f1d8f612d6e85208b34e4cd756\">intel.com<\/a>.<\/p>\n<p>\n\u00a9 Intel Corporation. Intel, the Intel logo and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20260618556758r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20260618556758\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20260618556758\/en\/<\/a><\/span><\/p>\n<p>\nIntel Media Relations<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:ContactPR@Intel.com\">ContactPR@Intel.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> California United States North America<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Semiconductor Hardware Manufacturing Technology Packaging<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260618556758\/en\/817781\/3\/intel_logo.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing SANTA CLARA, Calif.&#8211;(BUSINESS WIRE)&#8211; Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel\u2019s ability to deliver differentiated, system-level innovation for customers. Seok-Hee Lee Appointed to Lead Advanced Packaging As part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused business with dedicated leadership. This reflects the growing importance and complexity of packaging as a key enabler of performance, power efficiency, and heterogeneous integration across AI systems. \u201cAdvanced &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-973844","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing SANTA CLARA, Calif.&#8211;(BUSINESS WIRE)&#8211; Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel\u2019s ability to deliver differentiated, system-level innovation for customers. Seok-Hee Lee Appointed to Lead Advanced Packaging As part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused business with dedicated leadership. This reflects the growing importance and complexity of packaging as a key enabler of performance, power efficiency, and heterogeneous integration across AI systems. \u201cAdvanced &hellip; Continue reading &quot;Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2026-06-18T20:34:45+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20260618556758r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing\",\"datePublished\":\"2026-06-18T20:34:45+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing\\\/\"},\"wordCount\":578,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/cts.businesswire.com\\\/ct\\\/CT?id=bwnews&amp;sty=20260618556758r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing\\\/\",\"name\":\"Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing - 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