{"id":968274,"date":"2026-05-28T13:03:08","date_gmt":"2026-05-28T17:03:08","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\/"},"modified":"2026-05-28T13:03:08","modified_gmt":"2026-05-28T17:03:08","slug":"cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\/","title":{"rendered":"Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand"},"content":{"rendered":"

<\/p>\n

Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand<\/b><\/p>\n

Multi-year agreement expands Memory, NVIDIA NVLink-C2C and advanced Interface IP, and agentic AI-optimized GPU\u2011accelerated EDA and SDA flows on Samsung Foundry\u2019s second-generation 2nm node for next-generation AI infrastructure and physical AI designs<\/i><\/p>\n

SAN JOSE, Calif. & SEOUL, South Korea–(BUSINESS WIRE<\/a>)–
\nCadence (Nasdaq: CDNS) and Samsung Foundry today announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence\u2019s agentic AI digital, custom, 3D\u2011IC and system design and analysis (SDA) flows for Samsung Foundry\u2019s second-generation 2nm process technology. This collaboration delivers a signoff\u2011ready platform for next\u2011generation AI infrastructure and physical AI designs across data center, edge and intelligent devices.<\/p>\n

\nBuilding on the companies\u2019 2025 announcement of certified Cadence tools and IP on multiple Samsung Foundry nodes, including second-generation 2nm, this new multi-year agreement further broadens the Cadence\u00ae portfolio of Memory and Interface IP, including NVIDIA NVLink-C2C-enabled interconnect and CUDA-X GPU-accelerated libraries spanning high-speed SerDes, PCIe\u00ae, UCIe\u00ae and all leading memory interfaces on second-generation 2nm. It also deepens enablement of certified Cadence flows so ecosystem partners can implement large AI, HPC and advanced system designs with higher performance, lower power and faster time to tapeout.<\/p>\n

\n\u201cAI infrastructure and physical AI are pushing the industry into advanced node and 3D\u2011IC designs that demand far more capacity, integration and signoff confidence than ever before,\u201d said Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence. \u201cWith this next phase of our Samsung Foundry collaboration, we\u2019re giving joint customers a production\u2011proven platform to deliver the next-generation of AI and HPC systems to market faster.\u201d<\/p>\n

\n\u201cCustomers are increasingly drawn to Samsung Foundry\u2019s second-generation 2nm for leading\u2011edge AI designs that must keep pace with the exploding demand across AI infrastructure and emerging physical AI applications,\u201d said Jongshin Shin, executive vice president and head of Foundry Design Platform Development at Samsung Electronics. \u201cOur expanded Cadence partnership delivers a robust semiconductor and 3D-IC platform with advanced Memory, Interface IP and AI-optimized flows for superior performance, efficiency and innovation.\u201d<\/p>\n

Agentic AI EDA\/SDA Platform and 3D-IC Design on Samsung Foundry\u2019s Second-Generation 2nm<\/b><\/p>\n

\nCadence and Samsung Foundry deliver a comprehensive certified flow on second-generation 2nm, including Cadence\u2019s Innovus\u2122 Implementation System for digital implementation, Virtuoso\u00ae Studio for analog and custom design, Integrity\u2122 3D\u2011IC Platform for full 3D\u2011IC system planning and implementation, Voltus\u2122 IC Power Integrity Solution for power integrity and system\u2011level power analysis, and Quantus\u2122 Extraction Solution and Tempus\u2122 Timing Solution for signoff.<\/p>\n

\nCadence enables key second-generation 2nm design features, including the Innovus system and Genus\u2122 Synthesis Solution\u2019s glitch power optimization in the place and route flow, and a smart hierarchical flow to achieve optimal performance, power, and area (PPA) and turnaround time (TAT).<\/p>\n

\nSamsung 3D Cube-H design is enabled with a full system planning, implementation and signoff flow for hybrid copper bonding (HCB) technology, including Cadence Cerebrus\u00ae Intelligent Chip Explorer, Integrity 3D\u2011IC, Innovus Implementation, Voltus IC Power Integrity (ERA) and Pegasus\u2122 Verification System. It includes silicon interposer auto-routing and optimization, and ensures tighter connectivity between analysis, signoff, and verification, with the Tempus and Pegasus solutions providing trusted, confident signoff.<\/p>\n

Advancing NVLink-C2C Interconnect for Next-Generation AI Infrastructure<\/b><\/p>\n

\nNVIDIA is leveraging Cadence and Samsung Foundry\u2019s expanded advanced-node and 3D-IC platform to deliver high-bandwidth interconnect through NVIDIA NVLink-C2C and CUDA-X GPU accelerated capabilities\u2014foundational technologies that power next-generation accelerated computing systems and strengthen the broader ecosystem\u2019s ability to produce high-performance AI semiconductors.<\/p>\n

\n\u201cAs AI workloads scale and system architectures grow more demanding, the semiconductor ecosystem depends on tools and platforms that can keep pace with simulation and design complexity at advanced nodes,\u201d said Timothy Costa, vice president and general manager of computational engineering, NVIDIA. “By leveraging Cadence\u2019s GPU-accelerated design flows on Samsung Foundry\u2019s second-generation 2nm platform, we\u2019re optimizing the performance and delivery of next-generation AI architectures and high-bandwidth interconnects.\u201d<\/p>\n

Enabling Ambarella\u2019s Next-Generation Edge AI Platform<\/b><\/p>\n

\nAmbarella is developing its next-generation 2nm edge AI platform to extend its leadership in high-performance, ultra-low-power AI perception and physical AI SoCs for intelligent edge systems spanning robotics, drones, autonomous machines, and advanced sensing applications.<\/p>\n

\n\u201cAmbarella\u2019s edge AI strategy is focused on delivering industry\u2011leading performance per watt, scalable AI acceleration, and robust multi\u2011sensor processing at the most advanced process nodes,\u201d said Chan Lee, chief operating officer at Ambarella. \u201cOur collaboration with Cadence and Samsung Foundry to deliver IP for PCIe 5.0 for our next\u2011generation 2nm edge AI platform has been critical as we address the design, verification and manufacturing complexity of this node. Having a signoff\u2011ready, co\u2011optimized IP and tools solution, together with a robust, production\u2011proven design kit and PDK, enables our teams to move forward with confidence, reduce risk and stay focused on accelerating innovation in low\u2011power AI perception, physical AI and intelligent edge computing.\u201d<\/p>\n

\nCadence and Samsung Foundry will highlight their enhanced partnership and design enablement during the Samsung Advanced Foundry Ecosystem (SAFE) 2026 event, featuring technical sessions and demonstrations showcasing second-generation 2nm and 3D-IC design flows for GPU-accelerated AI workloads.<\/p>\n

About Cadence<\/b><\/p>\n

\nCadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence\u2019s Intelligent System Design\u2122 strategy, are essential for the world\u2019s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics. In 2024, Cadence was recognized by the Wall Street Journal as one of the world\u2019s top 100 best-managed companies. Cadence solutions offer limitless opportunities\u2014learn more at www.cadence.com<\/a>.<\/p>\n

\u00a9 2026 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at <\/i>www.cadence.com\/go\/trademarks<\/i><\/a> are trademarks or registered trademarks of Cadence Design Systems, Inc. PCI Express and PCIe are registered trademarks of PCI-SIG. PCI Express and PCIe are registered trademarks of PCI-SIG. Universal Chiplet Interconnect Express and UCIe are trademarks of the UCIe Consortium. All other trademarks are the property of their respective owners.<\/i><\/p>\n

Category: Featured<\/b><\/p>\n

\"\"<\/p>\n

View source version on businesswire.com: <\/span>https:\/\/www.businesswire.com\/news\/home\/20260528147066\/en\/<\/a><\/span><\/p>\n

\nFor more information, please contact:
\n
Cadence Newsroom
\n
408-944-7039
\n
newsroom@cadence.com<\/a><\/p>\n

KEYWORDS:<\/b> South Korea United States North America Asia Pacific California<\/p>\n

INDUSTRY KEYWORDS:<\/b> Electronic Design Automation Semiconductor Technology Other Technology Software Artificial Intelligence<\/p>\n

MEDIA:<\/b><\/p>\n\n","protected":false},"excerpt":{"rendered":"

Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand Multi-year agreement expands Memory, NVIDIA NVLink-C2C and advanced Interface IP, and agentic AI-optimized GPU\u2011accelerated EDA and SDA flows on Samsung Foundry\u2019s second-generation 2nm node for next-generation AI infrastructure and physical AI designs SAN JOSE, Calif. & SEOUL, South Korea–(BUSINESS WIRE)– Cadence (Nasdaq: CDNS) and Samsung Foundry today announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence\u2019s agentic AI digital, custom, 3D\u2011IC and system design and analysis (SDA) flows for Samsung Foundry\u2019s second-generation 2nm process technology. This collaboration delivers a signoff\u2011ready platform for next\u2011generation AI infrastructure and physical AI designs across data center, edge and intelligent … <\/p>\n

Continue reading “Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-968274","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nCadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand Multi-year agreement expands Memory, NVIDIA NVLink-C2C and advanced Interface IP, and agentic AI-optimized GPU\u2011accelerated EDA and SDA flows on Samsung Foundry\u2019s second-generation 2nm node for next-generation AI infrastructure and physical AI designs SAN JOSE, Calif. & SEOUL, South Korea–(BUSINESS WIRE)– Cadence (Nasdaq: CDNS) and Samsung Foundry today announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence\u2019s agentic AI digital, custom, 3D\u2011IC and system design and analysis (SDA) flows for Samsung Foundry\u2019s second-generation 2nm process technology. This collaboration delivers a signoff\u2011ready platform for next\u2011generation AI infrastructure and physical AI designs across data center, edge and intelligent … Continue reading "Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand"\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2026-05-28T17:03:08+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&sty=20260528147066r1&sid=flmnd&distro=nx&lang=en\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"5 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand\",\"datePublished\":\"2026-05-28T17:03:08+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\\\/\"},\"wordCount\":1122,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/cts.businesswire.com\\\/ct\\\/CT?id=bwnews&sty=20260528147066r1&sid=flmnd&distro=nx&lang=en\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\\\/\",\"name\":\"Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand - 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This collaboration delivers a signoff\u2011ready platform for next\u2011generation AI infrastructure and physical AI designs across data center, edge and intelligent … Continue reading \"Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\/","og_site_name":"Market Newsdesk","article_published_time":"2026-05-28T17:03:08+00:00","og_image":[{"url":"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&sty=20260528147066r1&sid=flmnd&distro=nx&lang=en","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"5 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand","datePublished":"2026-05-28T17:03:08+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\/"},"wordCount":1122,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\/#primaryimage"},"thumbnailUrl":"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&sty=20260528147066r1&sid=flmnd&distro=nx&lang=en","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-to-meet-surging-ai-infrastructure-and-physical-ai-demand\/","name":"Cadence and Samsung Foundry Deepen 2nm and 3D\u2011IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand - 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