{"id":956062,"date":"2026-04-29T11:52:52","date_gmt":"2026-04-29T15:52:52","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/vishay-specialty-thin-film-introduces-thin-film-metallized-submount-platform\/"},"modified":"2026-04-29T11:52:52","modified_gmt":"2026-04-29T15:52:52","slug":"vishay-specialty-thin-film-introduces-thin-film-metallized-submount-platform","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/vishay-specialty-thin-film-introduces-thin-film-metallized-submount-platform\/","title":{"rendered":"Vishay Specialty Thin Film Introduces Thin Film Metallized Submount Platform"},"content":{"rendered":"

\nSubmounts Enable Next-Generation Thermal, Optical, and RF Packaging
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MALVERN, Pa., April 29, 2026 (GLOBE NEWSWIRE) — Vishay Intertechnology, Inc. (NYSE: VSH) today announced its new thin film submount platform<\/a>, designed to support next-generation optical transceivers, RF modules, and advanced electronic packaging applications requiring high thermal performance, precision alignment, and high frequency signal integrity.<\/p>\n

Known for delivering high performance thin film substrates that enable smaller, faster, and more efficient electronic systems in environments where conventional solutions fall short, Vishay uses precision deposition of passive circuit elements and precision machining of advanced ceramic substrates, including aluminum nitride (AlN). This approach delivers superior thermal conductivity, dimensional stability, and electrical performance in demanding environments through the new platform.<\/p>\n

The platform is optimized for emerging applications in high speed data communications, including 800G, 1.6T, and 3.2T optical transceivers, where increasing power densities and tighter packaging constraints require enhanced heat dissipation, difficult alignment problems, and low loss interconnect performance. Vishay\u2019s thin film submounts enable designers to improve thermal management at the device level while maintaining precision alignment and signal integrity at high frequencies.<\/p>\n

\u201cNext-generation photonics and RF systems push the limits of thermal, mechanical, and electrical performance at the package level,\u201d said Michael Casper, vice president of specialty thin film at Vishay. \u201cOur thin film submount platform provides engineers with a flexible solution that enables high performance without compromising reliability.\u201d<\/p>\n

\n Key Features and Benefits:<\/strong>\n <\/p>\n