{"id":946136,"date":"2026-03-23T08:18:28","date_gmt":"2026-03-23T12:18:28","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/"},"modified":"2026-03-23T08:18:28","modified_gmt":"2026-03-23T12:18:28","slug":"aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/","title":{"rendered":"Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }\n.bwlistdisc { list-style-type: disc }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b>Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs<\/b><\/p>\n<p class=\"bwalignc\"><b>New Modular, Field-Serviceable Solution Combines Single-Pair Ethernet and Configurable Power in a Single Ruggedized Footprint<\/b><\/p>\n<p>SCHAFFHAUSEN, Switzerland&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<br \/>\nAptiv PLC (NYSE: APTV), a global industrial technology company and Winchester Interconnect, an Aptiv company and leading supplier of high-performance interconnect solutions, today launched Modulus\u2122, a ruggedized, modular connector platform that combines high-speed Single Pair Ethernet (SPE) and configurable power in a compact, field-serviceable design. Built for emerging Low Earth Orbit (LEO) satellite programs and unmanned aerial systems (UAS), Modulus\u2122 gives engineers the ability to future-proof dense platforms by streamlining development, optimizing signal, data, and power configuration into a single connector footprint, and simplifying serviceability by replacing individual modules in the field without pulling the full assembly.<\/p>\n<p>\nSpace and drone programs are being developed on an aggressive timeline. Leading commercial satellite operators have already outgrown what conventional connectors can handle. Engineers are under pressure to reduce size, weight, and power without sacrificing performance. Modulus\u2122 combines Winchester\u2019s ruggedized connector expertise with Aptiv\u2019s proven high-reliability connector technology, giving programs a platform they can adapt as requirements change, without a full connector redesign each time.<\/p>\n<p>\n\u201cSatellite and drone programs are trying to do more with less time in the lab,\u201d said Joseph Massaro, Vice Chair and President, Engineered Components. \u201cModulus\u2122 gives engineers the configurability they need with signal, power, and high-speed data in one platform, without giving up the ruggedness space and defense applications demand. Programs can mix-and-match modules to get the exact solution they need and service them in the field.\u201d<\/p>\n<p>\nModulus\u2122 supports multi-megabit throughput and next-generation Single Pair Ethernet data transmission, with field-configurable technology and quick-turn maintenance capabilities for small satellite constellations through tactical UAS missions.<\/p>\n<p><b>Key Advantages of Modulus\u2122 Connector Platform<\/b><\/p>\n<ul class=\"bwlistdisc\">\n<li><b>Modular Architecture:<\/b> Configurable signal, power, and high-speed data within a single connector footprint, eliminating configuration change redesigns\n<\/li>\n<li><b>Single Pair Ethernet (SPE) Capability:<\/b> Supports next-generation high-speed data transmission for space and UAS applications\n<\/li>\n<li><b>Field-Serviceable:<\/b> Individual modules can be replaced without removing the full connector assembly, reducing maintenance time and keeping programs on schedule\n<\/li>\n<li><b>SwaP Optimized:<\/b> Compact, lightweight construction for space-constrained platforms\n<\/li>\n<li><b>Scalable:<\/b> Standardized interface across multiple satellite or drone program variants\n<\/li>\n<li><b>Ruggedized:<\/b> Engineered for shock, vibration, and harsh operating environments\n<\/li>\n<\/ul>\n<p>\n\u201cThe biggest challenge was maintaining signal integrity and power performance on a truly modular architecture,\u201d said Clint Schlosser, Senior Product Manager, Winchester Interconnect. \u201cEach module carries stringent high-speed data requirements while sitting next to power and signal contacts in a small footprint. Modulus\u2122<sup \/>addresses that with controlled impedance, contact geometry optimization, and ruggedized materials, delivering predictable performance in harsh space and defense environments.\u201d<\/p>\n<p>\nWith Modulus\u2122, Aptiv and Winchester Interconnect continue to deliver scalable interconnect solutions that help customers reduce system complexity and maintain operational readiness in the most demanding applications.<\/p>\n<p>\nFor more information, visit the <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.winconn.com%2Fproducts%2Fconnectors%2Frectangular-connectors%2Fmodulus-connectors&amp;esheet=54460157&amp;newsitemid=20260323507916&amp;lan=en-US&amp;anchor=Modulus%26%238482%3B+product+page&amp;index=1&amp;md5=53e0f9c9a263de76a6698e5ce890b3a6\">Modulus\u2122 product page<\/a> or stop by the Winchester Interconnect exhibit at <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.satshow.com%2F&amp;esheet=54460157&amp;newsitemid=20260323507916&amp;lan=en-US&amp;anchor=SATShow&amp;index=2&amp;md5=4b76daaa4f399803e5e95510a0100d5d\">SATShow<\/a> in Washington, DC, March 23-26, 2026.<\/p>\n<p><b>About Aptiv<\/b><\/p>\n<p>\nAptiv is a global industrial technology company enabling more automated, electrified and digitalized solutions across multiple end-markets. Visit <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.aptiv.com%2F&amp;esheet=54460157&amp;newsitemid=20260323507916&amp;lan=en-US&amp;anchor=aptiv.com.&amp;index=3&amp;md5=b3d32eef1137a4ea9d8c6a8a7a7c0e1c\">aptiv.com.<\/a><\/p>\n<p><b>About Winchester Interconnect<\/b><\/p>\n<p>\nWinchester Interconnect, a subsidiary of <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.aptiv.com&amp;esheet=54460157&amp;newsitemid=20260323507916&amp;lan=en-US&amp;anchor=Aptiv+PLC&amp;index=4&amp;md5=4df048c94bea825a3bd4742a6b6b3948\">Aptiv PLC<\/a>, is a leading designer and manufacturer of high-precision connectors, cable assemblies, and cables for mission-critical applications in military, aerospace, industrial, medical, and space markets where unmatched performance and reliability are essential. With engineering and manufacturing locations around the world, Winchester partners closely with customers to deliver customized interconnect solutions that perform in the most demanding environments. Winchester Interconnect is part of Aptiv\u2019s Engineered Components Group, which brings together materials science, advanced manufacturing, and interconnect expertise to power the next generation of intelligent systems across industries. Learn more at <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.winconn.com&amp;esheet=54460157&amp;newsitemid=20260323507916&amp;lan=en-US&amp;anchor=www.winconn.com&amp;index=5&amp;md5=db6effba3a456b9a71eacada0feee865\">www.winconn.com<\/a>.<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20260323507916r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20260323507916\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20260323507916\/en\/<\/a><\/span><\/p>\n<p><b>Media Contacts<br \/>\n<br \/><\/b>Lisa Scalzo<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:Lisa.Scalzo@aptiv.com\">Lisa.Scalzo@aptiv.com<\/a><\/p>\n<p>\nBrooke Sinko<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:b.sinko@winconn.com\">b.sinko@winconn.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> District of Columbia Europe Switzerland United States North America<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Technology Mobile\/Wireless Engineering Automotive Manufacturing Aerospace Manufacturing Finance Drones Professional Services Defense Other Defense Hardware Government Technology Satellite<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260323507916\/en\/2014872\/3\/aptiv_logo.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs New Modular, Field-Serviceable Solution Combines Single-Pair Ethernet and Configurable Power in a Single Ruggedized Footprint SCHAFFHAUSEN, Switzerland&#8211;(BUSINESS WIRE)&#8211; Aptiv PLC (NYSE: APTV), a global industrial technology company and Winchester Interconnect, an Aptiv company and leading supplier of high-performance interconnect solutions, today launched Modulus\u2122, a ruggedized, modular connector platform that combines high-speed Single Pair Ethernet (SPE) and configurable power in a compact, field-serviceable design. Built for emerging Low Earth Orbit (LEO) satellite programs and unmanned aerial systems (UAS), Modulus\u2122 gives engineers the ability to future-proof dense platforms by streamlining development, optimizing signal, data, and power configuration into a single connector footprint, and simplifying serviceability by replacing individual modules in &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-946136","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs New Modular, Field-Serviceable Solution Combines Single-Pair Ethernet and Configurable Power in a Single Ruggedized Footprint SCHAFFHAUSEN, Switzerland&#8211;(BUSINESS WIRE)&#8211; Aptiv PLC (NYSE: APTV), a global industrial technology company and Winchester Interconnect, an Aptiv company and leading supplier of high-performance interconnect solutions, today launched Modulus\u2122, a ruggedized, modular connector platform that combines high-speed Single Pair Ethernet (SPE) and configurable power in a compact, field-serviceable design. Built for emerging Low Earth Orbit (LEO) satellite programs and unmanned aerial systems (UAS), Modulus\u2122 gives engineers the ability to future-proof dense platforms by streamlining development, optimizing signal, data, and power configuration into a single connector footprint, and simplifying serviceability by replacing individual modules in &hellip; Continue reading &quot;Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2026-03-23T12:18:28+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20260323507916r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs\",\"datePublished\":\"2026-03-23T12:18:28+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\\\/\"},\"wordCount\":684,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/cts.businesswire.com\\\/ct\\\/CT?id=bwnews&amp;sty=20260323507916r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\\\/\",\"name\":\"Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs - 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Market Newsdesk","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/","og_locale":"en_US","og_type":"article","og_title":"Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs - Market Newsdesk","og_description":"Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs New Modular, Field-Serviceable Solution Combines Single-Pair Ethernet and Configurable Power in a Single Ruggedized Footprint SCHAFFHAUSEN, Switzerland&#8211;(BUSINESS WIRE)&#8211; Aptiv PLC (NYSE: APTV), a global industrial technology company and Winchester Interconnect, an Aptiv company and leading supplier of high-performance interconnect solutions, today launched Modulus\u2122, a ruggedized, modular connector platform that combines high-speed Single Pair Ethernet (SPE) and configurable power in a compact, field-serviceable design. Built for emerging Low Earth Orbit (LEO) satellite programs and unmanned aerial systems (UAS), Modulus\u2122 gives engineers the ability to future-proof dense platforms by streamlining development, optimizing signal, data, and power configuration into a single connector footprint, and simplifying serviceability by replacing individual modules in &hellip; Continue reading \"Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/","og_site_name":"Market Newsdesk","article_published_time":"2026-03-23T12:18:28+00:00","og_image":[{"url":"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20260323507916r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs","datePublished":"2026-03-23T12:18:28+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/"},"wordCount":684,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/#primaryimage"},"thumbnailUrl":"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20260323507916r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/aptivs-winchester-interconnect-launches-modulus-connector-platform-for-leo-and-drone-programs\/","name":"Aptiv\u2019s Winchester Interconnect Launches Modulus\u2122 Connector Platform for LEO and Drone Programs - 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