{"id":935726,"date":"2026-02-10T16:10:45","date_gmt":"2026-02-10T21:10:45","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/"},"modified":"2026-02-10T16:10:45","modified_gmt":"2026-02-10T21:10:45","slug":"applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/","title":{"rendered":"Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips"},"content":{"rendered":"<div class=\"mw_release\">\n<ul type=\"disc\">\n<li>\n          <em>New chipmaking systems boost the energy-efficient performance of Gate-All-Around transistors and wiring at 2nm and beyond<\/em>\n        <\/li>\n<li>\n          <em>Viva\u2122 pure radical treatment smoothens GAA silicon nanosheets with atomic-level precision to increase transistor performance<\/em>\n        <\/li>\n<li>\n          <em>Sym3\u2122 Z Magnum\u2122 conductor etch system delivers angstrom-level 3D trench profile control to increase silicon nanosheet uniformity and performance<\/em>\n        <\/li>\n<li>\n          <em>Spectral\u2122 atomic layer deposition system replaces today\u2019s tungsten transistor contacts with molybdenum, a new contact metal that lowers electrical resistance at the critical link between transistors and the copper wiring network<\/em>\n        <\/li>\n<li>\n          <em>The new systems are now being used by multiple leading foundry-logic manufacturers<\/em><\/p>\n<\/li>\n<\/ul>\n<p>SANTA CLARA, Calif., Feb.  10, 2026  (GLOBE NEWSWIRE) &#8212; Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced new deposition, etch and materials modification systems that boost the performance of leading-edge logic chips at 2nm and beyond. The technologies supercharge AI compute through atomic-scale improvements to the most fundamental electronic building block \u2013 the transistor.<\/p>\n<p>The transition to Gate-All-Around (GAA) transistors is a major industry inflection and a critical enabler of the energy-efficient computing needed to deliver more powerful AI chips. As 2nm-class GAA chips ramp to volume production this year, Applied is introducing new material innovations to enhance next-generation GAA transistors for angstrom nodes. The combined impact of the new chipmaking systems contributes a significant portion of the total energy-efficient performance gains of GAA process node transitions.<\/p>\n<p>\u201cThe rapid progress of AI is pushing compute performance to the limit, and breakthroughs in computing begin with the transistor,\u201d said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. \u201cTo keep pace in the angstrom era, Applied is delivering materials engineering breakthroughs that improve energy-efficient compute. Together, these new systems extend Applied\u2019s longstanding leadership in driving major transistor and wiring inflections, while helping customers accelerate their chip roadmaps to keep up with the blistering pace of AI.\u201d<\/p>\n<p>\n        <strong>New Viva\u2122 Radical Treatment System Enables Precision Engineering of GAA Transistor Nanosheets<\/strong>\n      <\/p>\n<p>At the heart of GAA transistors are horizontal stacks of current-carrying \u201cnanosheets.\u201d Made of ultra-thin silicon just a few nanometers wide, the physical features of these nanosheets must be exceptionally well defined to ensure that each one acts as an efficient conducting path for charge carriers. Of crucial importance is the surface condition of these nanosheets, as even atomic-scale roughness or contamination can significantly impact their electrical properties and, ultimately, the overall chip performance. A pristine, highly uniform nanosheet surface dramatically enhances the channel\u2019s electron mobility, which plays a central role in determining how fast transistors can switch on and off, resulting in faster, more energy-efficient transistors engineered to meet the demands of next-generation AI chips.<\/p>\n<p>The <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=gJNV7eyQqb31wlusxqNjFFkyvK7S556KjV0sKJI-TU6OK7TuXPCBCJn6MAccI54rGXfvYVU1axbpMV95XkpFCy7_PtFw8tSaKTah5BCmvWVE-IgyMOLXoPAAQnce7SfcNcae5jvDSLRyEJj7bCQwfOHykiy2rydxP4i4ja2Sjyg0Uzv1fwGkTlfhiz5EjZXyag6oj_YpDNV8L0gdP1Ls_e591DStVZrSazEOI0tSUgI=\" rel=\"nofollow\" target=\"_blank\">Applied Producer\u2122 Viva\u2122 radical treatment system<\/a> delivers angstrom-level precision engineering of these nanosheet surfaces. At the core of Viva is a patented delivery architecture that generates ultra-pure radical species. The technique combines Applied\u2019s remote plasma source with other hardware innovations to filter out high-energy charged ions that can damage the surface structure. The concentrated neutral radicals create a more gentle, damage-free treatment environment, enabling uniform surface treatments in deeply buried transistor structures.<\/p>\n<p>The Viva system is being adopted by leading logic chipmakers for advanced channel engineering at 2nm and beyond process nodes.<\/p>\n<p>The new Viva system has additional applications across both logic and memory. When combined with the <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=gJNV7eyQqb31wlusxqNjFLMJ8wUq-_WT5G5p8WOmXHXnn_3ycxIe-RqcK1FEABTey78EPqTbsmBdF4ZFrC_KCZ66cltkOGN9E-rRP8Qs69yBRBTwR4GxxOGfhCFVgOBiAEr4I23RZSNVelGnmJ6hlb9psRLjujbjMF9ofY75Nz5iR-sGBdNyaQcQDDQyLoiopSME8p5ANjYrcdUP0ypNR9qNmIfpY5sNJVzsvc8Eoo8D_D2u2bSR0WKIpsnt6s9AOiU85cCGIYsrCjm3PkaFeg==\" rel=\"nofollow\" target=\"_blank\">Applied Producer Pyra\u2122 thermal annealing process<\/a>, the supplemental radical treatment further reduces the resistance of conducting copper wires, promising to extend the use of copper in the lower metal layers of the most advanced nodes.<\/p>\n<p>\n        <strong>New Sym3\u2122 Z\u00a0Magnum\u2122\u00a0Etch System\u00a0Creates Angstrom-Level\u00a03D\u00a0Trenches\u00a0with Enhanced Plasma Control\u00a0<\/strong><br \/>\n        <br \/>\n        <strong>\u202f\u00a0<\/strong><br \/>\n        <br \/>The vertical 3D architecture of GAA transistors requires chipmakers to carve deep, narrow trenches with exceptional precision. These features must\u00a0maintain\u00a0uniform depth, straight sidewalls, and flat, rectangular bottoms, since even small variations can\u00a0impact\u00a0transistor speed, power\u00a0efficiency\u00a0and overall performance. As nodes shrink, this precision has made advanced plasma etch indispensable.\u00a0<br \/>\u202f\u00a0<br \/>Today Applied is introducing\u00a0the <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=qhvqGolR1XL2mspCTCefPEAHn8s43wK9CtvoQ3NTEgqAoVmUn9mdtD5v6pFgqFQu7TocgtXVSkfqNSXhRFURTjyyVjUhBgwIjEcyKhvwP1pNfUbM7B4v6wlaqOZTwqHLLhNp30j08H2_TOR9_KulWLs399E3dqSvfSyHLMkj6FjFQ0lIZQL_jD8sRCFYFF1R\" rel=\"nofollow\" target=\"_blank\">Centris\u2122 Sym3\u2122 Z Magnum\u2122\u00a0etch system<\/a> \u2013 the newest\u00a0member of the\u00a0Sym3 Z family. The Sym3 Z platform brought\u00a0pulsed\u00a0voltage\u00a0technology\u00a0(PVT) into\u00a0high-volume\u00a0production, using microsecond-scale ion\u00a0control\u00a0to create the high-aspect-ratio\u00a0features in GAA transistors. It has achieved broad adoption,\u00a0with\u00a0tool-of-record\u00a0status in 2nm\u00a0logic\u00a0manufacturing\u00a0and\u00a0more than\u00a0250\u00a0chambers in the field.\u00a0<br \/>\u202f\u00a0<br \/>To extend scaling, Sym3 Z Magnum debuts a breakthrough second-generation pulsed voltage technology (PVT2). PVT2 not only eliminates the traditional tradeoff between ion directionality and near-wafer plasma control, it also enables independent ion-angle and ion-energy tuning. These capabilities deliver far more defined ion trajectories directly to the wafer surface. By pairing PVT2 with the system\u2019s new source technology, Sym3 Z Magnum produces clean, precise\u00a0trenches that enable uniform nanosheets, faster switching, and higher-quality epitaxy \u2013 boosting transistor speed and overall chip performance.<br \/>\u00a0\u202f\u00a0<br \/>Beyond angstrom-class logic, Sym3 Z Magnum\u00a0advances DRAM and\u00a0high-bandwidth\u00a0memory (HBM) technologies\u00a0by delivering the precise profiles needed for denser arrays\u00a0and\u00a0taller stacks.\u00a0Its broad applications drive rapid\u00a0adoption among leading chipmakers and strengthen Applied\u2019s leadership in advanced etch.\u00a0<\/p>\n<p>\n        <strong>New Spectral\u2122 ALD System Lowers Contact Resistance with Selective Deposition of Molybdenum <\/strong>\n      <\/p>\n<p>Delivering more powerful AI requires innovation beyond the transistor device. As scaling continues below 2nm, the tiny metal contacts that link each transistor to the wiring network become ever thinner, contributing significantly to the chip\u2019s total resistance and creating a bottleneck to performance and energy efficiency. At these nanoscale dimensions, traditional tungsten contacts face challenges in their ability to efficiently conduct electrons. Molybdenum \u2013 a metal that can be made thinner while preserving efficient electron flow \u2013 has emerged as a promising alternative for next-generation contacts at angstrom nodes.<\/p>\n<p>The <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=gJNV7eyQqb31wlusxqNjFCg3axm-Pl19wn8FxKyKuP0UHZJptCVz2dXSd_prta6PsADZUzGrF2xGvJldi-yN_2SsMGnEMm3jsWSm2o6Q8KIcTIqw-QFKzP2ef1OwZx0orjNojcbBnlpQy68PXQPi19nwL7HM2W36fCp3MAuRUJ10SIiwKaF29dwp7RaMYYlbZetdbJuEUvgwzZ2wQlEEMtoE_V8sPAVuDxZTdpcDcGY=\" rel=\"nofollow\" target=\"_blank\">Applied Centris\u2122 Spectral\u2122 Molybdenum ALD* system<\/a>\u00a0selectively deposits monocrystalline molybdenum, reducing critical contact resistance by as much as 15 percent beyond today\u2019s industry benchmark \u2013 the <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=gJNV7eyQqb31wlusxqNjFG47L5rgY7piVYllz3Sku_Ydzf4uIYpthlZJZod7Y7LgxyJnJHFehbWa2LtJv34r_Sxen54SQjo6DtiI1irJsL_d9JjBM35fRb2fSBxSD3gTBHWniDAVOF0j8TC08ILlHWzopme44CeHPVW8X1_pG4HcE7OFFhUCdqTaw6HYnPjp36blKLb9NkTpDo4EMWwcszXnB6rHnUF5SARAL-XZehk=\" rel=\"nofollow\" target=\"_blank\">Applied Endura\u2122 Volta\u2122 Selective Tungsten system<\/a>. Since these contacts form the smallest connections between interconnects and transistors, maintaining low resistance is critical to ensure maximum chip performance and energy efficiency.\u00a0<\/p>\n<p>Spectral represents a new series of ALD tools that feature state-of-the-art quad reactor design with precision chemical delivery, a variety of plasma and thermal processing capabilities, and specialized hardware for both temporal and spatial ALD operation \u2013 providing the ability to create a breadth of advanced films to power advanced AI chips.<\/p>\n<p>The Spectral system is being adopted by leading logic chipmakers at 2nm and below process nodes. An animation of the system\u2019s capabilities can be viewed <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=ptuHqKC-TzokT4jsqQ-vahRoHP5L-qJM5gCUOfLywao8sh4-YxrHBKJA8FqZl_PiA5Fr8n09tj8gee4hC985wn2HnzjQwvF9fQMtA3jqzwTO4p3gM3Zynet7470zbMpN\" rel=\"nofollow\" target=\"_blank\">here<\/a>.<\/p>\n<p>A media kit with additional information on the Viva, Sym3 Z and Spectral systems is available on the Applied Materials <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=FKG42aKNAtCTvq6MDjUB4plmNGl1UtTOrmN35NO2MN0V3DJxxhXeYmjUkF1EdufFDR05SaxFxIc1P1yKmBdCgYLwj4vV8UVnZeZOpgWzqY111jYxTFM2VgycO0snFhiL-U8ttVydmDJ6XW2Ja_k7mg==\" rel=\"nofollow\" target=\"_blank\">website<\/a>.<\/p>\n<p>*ALD = Atomic Layer Deposition<\/p>\n<p>\n        <strong>About Applied Materials<\/strong><br \/>\n        <br \/>Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions that are at the foundation of virtually every new semiconductor and advanced display in the world. The technology we create is essential to advancing AI and accelerating the commercialization of next-generation chips. At Applied, we push the boundaries of science and engineering to deliver material innovation that changes the world. Learn more at <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=1k8jYta6_n-KiE6If8aqSqlALzAdLlNb27aAxjWdk0liLy4JZtk6baGTd7g_bx0it7DDDCqeRCteKyCuOc6YnbUxfmJz2FDEmsJU7IRfkrjtzq_0xgsIfko_CffujJdz\" rel=\"nofollow\" target=\"_blank\">www.appliedmaterials.com<\/a>.<\/p>\n<p>\n        <strong>Contact:<\/strong><br \/>\n        <br \/>\n        <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=3oBP3TDD2yP9gQ32OqM_V45ZK0pWaPy_EPSkm2FU3rms9q9SS-WWg_6oXJTIjLMfmUmlRziDdFHZk0nClMeznpQVytb5z_izlyzI88gl4ys=\" rel=\"nofollow\" target=\"_blank\">Ricky Gradwohl<\/a> (Media) 408.235.4676<br \/><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=Zqk60UxEWSkN81A9AL6hPO7QYfqEdjww1hV2LLxdMJdg8TzQUejmF-UTYqDkt2FYCzBlGKAmNatn6dIiOfEPTiI1wzk-2MfyOSlMgNH3d3k=\" rel=\"nofollow\" target=\"_blank\">Mike Sullivan<\/a> (Financial Community) 408.986.7977<\/p>\n<p>A photo accompanying this announcement is available at <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=_OfbUc4Rxc5odjbD8GS6482A4J8LfO_5BLhVD--SB5CDShjBtj5m8c_tCxHeoVDi_UfeStEM8aOspeDR45qpoTvEH5QnYdD-t-1415vTBzlMWz-PFlZNhMClbnAghS9-YxVcnaM8V9XfF1e6S81IL1PV7dGIwf8Z74GHNCkNzTzsXUtvxCk1Qp8UYb2BD_AM3eYv5dk-ZlzDSr4CcwOznOUCtKagrir2EsJ6e0xmWBr-yHkh5IL6l4RsvTE89h0YHRHeQvJFt7dN97zyx_6tMQ==\" rel=\"nofollow\" target=\"_blank\">https:\/\/www.globenewswire.com\/NewsRoom\/AttachmentNg\/50ebed0d-d115-420d-a789-f7f1d4261cdd<\/a><\/p>\n<p>      <img decoding=\"async\" alt=\"\" class=\"__GNW8366DE3E__IMG\" src=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTY1MjI5MCM3NDE3NjA1IzIwMDcxNDQ=\" \/><br \/>\n      <br \/>\n      <img decoding=\"async\" alt=\"\" src=\"https:\/\/ml.globenewswire.com\/media\/OGE1MjQwNWQtNDgwMi00MWRiLWI1YmMtNjA5Yjg0NDI5ODJkLTEwMTg3MTctMjAyNi0wMi0xMC1lbg==\/tiny\/Applied-Materials-Inc-.png\" \/>\n    <\/div>\n<div class=\"mw_contactinfo\"><\/div>\n","protected":false},"excerpt":{"rendered":"<p>New chipmaking systems boost the energy-efficient performance of Gate-All-Around transistors and wiring at 2nm and beyond Viva\u2122 pure radical treatment smoothens GAA silicon nanosheets with atomic-level precision to increase transistor performance Sym3\u2122 Z Magnum\u2122 conductor etch system delivers angstrom-level 3D trench profile control to increase silicon nanosheet uniformity and performance Spectral\u2122 atomic layer deposition system replaces today\u2019s tungsten transistor contacts with molybdenum, a new contact metal that lowers electrical resistance at the critical link between transistors and the copper wiring network The new systems are now being used by multiple leading foundry-logic manufacturers SANTA CLARA, Calif., Feb. 10, 2026 (GLOBE NEWSWIRE) &#8212; Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced new deposition, etch and &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-935726","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"New chipmaking systems boost the energy-efficient performance of Gate-All-Around transistors and wiring at 2nm and beyond Viva\u2122 pure radical treatment smoothens GAA silicon nanosheets with atomic-level precision to increase transistor performance Sym3\u2122 Z Magnum\u2122 conductor etch system delivers angstrom-level 3D trench profile control to increase silicon nanosheet uniformity and performance Spectral\u2122 atomic layer deposition system replaces today\u2019s tungsten transistor contacts with molybdenum, a new contact metal that lowers electrical resistance at the critical link between transistors and the copper wiring network The new systems are now being used by multiple leading foundry-logic manufacturers SANTA CLARA, Calif., Feb. 10, 2026 (GLOBE NEWSWIRE) &#8212; Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced new deposition, etch and &hellip; Continue reading &quot;Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2026-02-10T21:10:45+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTY1MjI5MCM3NDE3NjA1IzIwMDcxNDQ=\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"6 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips\",\"datePublished\":\"2026-02-10T21:10:45+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/\"},\"wordCount\":1204,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTY1MjI5MCM3NDE3NjA1IzIwMDcxNDQ=\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/\",\"name\":\"Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips - Market Newsdesk\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTY1MjI5MCM3NDE3NjA1IzIwMDcxNDQ=\",\"datePublished\":\"2026-02-10T21:10:45+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTY1MjI5MCM3NDE3NjA1IzIwMDcxNDQ=\",\"contentUrl\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTY1MjI5MCM3NDE3NjA1IzIwMDcxNDQ=\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#website\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/\",\"name\":\"Market Newsdesk\",\"description\":\"Latest Business News in Real Time\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\",\"name\":\"Newsdesk\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g\",\"caption\":\"Newsdesk\"},\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/author\\\/newsdesk\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips - Market Newsdesk","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/","og_locale":"en_US","og_type":"article","og_title":"Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips - Market Newsdesk","og_description":"New chipmaking systems boost the energy-efficient performance of Gate-All-Around transistors and wiring at 2nm and beyond Viva\u2122 pure radical treatment smoothens GAA silicon nanosheets with atomic-level precision to increase transistor performance Sym3\u2122 Z Magnum\u2122 conductor etch system delivers angstrom-level 3D trench profile control to increase silicon nanosheet uniformity and performance Spectral\u2122 atomic layer deposition system replaces today\u2019s tungsten transistor contacts with molybdenum, a new contact metal that lowers electrical resistance at the critical link between transistors and the copper wiring network The new systems are now being used by multiple leading foundry-logic manufacturers SANTA CLARA, Calif., Feb. 10, 2026 (GLOBE NEWSWIRE) &#8212; Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced new deposition, etch and &hellip; Continue reading \"Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/","og_site_name":"Market Newsdesk","article_published_time":"2026-02-10T21:10:45+00:00","og_image":[{"url":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTY1MjI5MCM3NDE3NjA1IzIwMDcxNDQ=","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"6 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips","datePublished":"2026-02-10T21:10:45+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/"},"wordCount":1204,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/#primaryimage"},"thumbnailUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTY1MjI5MCM3NDE3NjA1IzIwMDcxNDQ=","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/","name":"Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips - Market Newsdesk","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/#primaryimage"},"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/#primaryimage"},"thumbnailUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTY1MjI5MCM3NDE3NjA1IzIwMDcxNDQ=","datePublished":"2026-02-10T21:10:45+00:00","author":{"@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"breadcrumb":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/#primaryimage","url":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTY1MjI5MCM3NDE3NjA1IzIwMDcxNDQ=","contentUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTY1MjI5MCM3NDE3NjA1IzIwMDcxNDQ="},{"@type":"BreadcrumbList","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-unveils-transistor-and-wiring-innovations-for-faster-ai-chips\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.marketnewsdesk.com\/"},{"@type":"ListItem","position":2,"name":"Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips"}]},{"@type":"WebSite","@id":"https:\/\/www.marketnewsdesk.com\/#website","url":"https:\/\/www.marketnewsdesk.com\/","name":"Market Newsdesk","description":"Latest Business News in Real Time","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.marketnewsdesk.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Person","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979","name":"Newsdesk","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","caption":"Newsdesk"},"url":"https:\/\/www.marketnewsdesk.com\/index.php\/author\/newsdesk\/"}]}},"_links":{"self":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts\/935726","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/comments?post=935726"}],"version-history":[{"count":0,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts\/935726\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/media?parent=935726"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/categories?post=935726"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/tags?post=935726"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}