{"id":929246,"date":"2026-01-21T09:04:03","date_gmt":"2026-01-21T14:04:03","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications\/"},"modified":"2026-01-21T09:04:03","modified_gmt":"2026-01-21T14:04:03","slug":"cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications\/","title":{"rendered":"Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }\n.bwlistdisc { list-style-type: disc }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b>Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications<\/b><\/p>\n<p class=\"bwalignc\"><b><i>Sixth-generation HiFi DSP delivers greater performance and energy efficiency for voice-based AI applications and the latest immersive audio formats<\/i><\/b><\/p>\n<p>SAN JOSE, Calif.&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<br \/>\nCadence (Nasdaq: CDNS) today announced the Cadence<sup>\u00ae<\/sup> Tensilica<sup>\u00ae <\/sup>HiFi iQ DSP IP, the sixth generation of its highly successful HiFi DSP family, based on a new architecture purpose-built for next-generation voice AI and emerging immersive audio. As these applications proliferate in the home entertainment, automotive infotainment and smartphone markets, the HiFi iQ DSP delivers the performance and energy efficiency required to meet growing SoC computational demands. Compared to the industry-leading Tensilica HiFi 5s DSP, the HiFi iQ DSP offers 2X greater compute performance, 8X higher AI performance and more than 25% energy savings for most workloads\u2014delivering over 40% performance uplift on numerous audio codecs.<\/p>\n<p id=\"news-body-cta\">This press release features multimedia. View the full release here: <a href=\"https:\/\/www.businesswire.com\/news\/home\/20260121788959\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20260121788959\/en\/<\/a><\/p>\n<div id=\"bwbodyimg\" style=\"width: 480px;float:left;padding-left:0px;padding-right:20px;padding-top:0px;padding-bottom:0px\"><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260121788959\/en\/2696211\/4\/J56158_Tensilica_HiFi_iQ_2026_Press_1667x1667.jpg\" alt=\"As next-generation voice AI and emerging immersive audio applications proliferate in the home entertainment, automotive infotainment and smartphone markets, the Cadence Tensilica HiFi iQ DSP delivers the performance and energy efficiency required to meet growing SoC computational demands.\" \/><\/p>\n<p style=\"font-size:85%\">As next-generation voice AI and emerging immersive audio applications proliferate in the home entertainment, automotive infotainment and smartphone markets, the Cadence Tensilica HiFi iQ DSP delivers the performance and energy efficiency required to meet growing SoC computational demands.<\/p>\n<\/div>\n<p>\n\u201cWith the increased growth of AI across virtually every facet of the industry, audio and language have become critical interfaces for users,\u201d said Anshel Sag, VP and principal analyst, Moor Insights and Strategy. \u201cThe AI performance and energy savings with Cadence\u2019s new flagship Tensilica HiFi iQ DSP position it to enable future AI-enhanced applications and offload processing from other IPs.\u201d<\/p>\n<p>\nA number of factors are driving the need for greater computation, including the need for richer experiences enabled by the latest immersive audio codecs, audio processing at higher sampling rates, object-based rendering, seamless natural language processing (NLP), and automotive road-noise cancellation (RNC). These usages require increased AI\/ML capabilities and enhanced audio\/voice pre- and post-processing functions, which demand more computations performed with low latency and low power for on-device processing in edge AI and physical AI applications. Since most of these designs are power constrained, increasing the core\u2019s operating frequency or integrating multiple cores is often not a viable option.<\/p>\n<p>\nLeveraging more than two decades developing audio solutions and expertise in instruction-set optimization, Cadence has developed a new architecture specifically designed for AI-enhanced, high-performance audio workloads. The Tensilica HiFi iQ DSP addresses the latest audio market trends, delivering significant improvements over the Tensilica HiFi 5s DSP:<\/p>\n<ul class=\"bwlistdisc\">\n<li>\n2X greater raw compute performance and 8X higher AI performance for compute-intensive advanced audio standards<\/p>\n<\/li>\n<li>\nMore than 25% energy savings across various workloads for very energy-efficient on-device AI processing<\/p>\n<\/li>\n<li>\nEnhanced auto-vectorization for easy programming and fast time to market<\/p>\n<\/li>\n<li>\nIntegrated support for FP8, BF16 and other formats to run cutting-edge voice AI models<\/p>\n<\/li>\n<\/ul>\n<p>\nThe Tensilica HiFi iQ DSP\u2019s architectural enhancements and increased computational capability enable sophisticated immersive audio codecs such as Dolby MS12, Eclipsa Audio, Opus HD, Audio Vivid and others to run with higher efficiency than on previous HiFi DSPs. Cadence has already demonstrated more than 40% greater performance than the Tensilica HiFi 5s DSP on multiple codecs. Signal processing algorithms for keyword spotting (KWS), active noise cancellation (ANC), beamforming and automatic speech recognition (ASR) can be performed seamlessly, enabling state-of-the-art NLP functions. Additionally, multi-stream and multi-channel audio playback facilitates rendering of 3D spatial zones and sound bubbles, delivering highly realistic listening experiences.<\/p>\n<p>\n\u201cWith recent advancements in LLMs, SLMs, energy-efficient SoCs and on-device AI, voice input is poised to become the new keyboard. To enable seamless interaction with the latest physical AI applications, SoC providers need energy-efficient and easily programmable IP capable of running SLMs on-device while performing voice and audio processing seamlessly,\u201d said Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence. \u201cAs the market leader in DSPs for audio, voice, speech and AI applications with billions of Tensilica HiFi DSPs in a wide array of embedded products, SoC and system vendors rely on Cadence to continue to push the envelope for performance and energy efficiency.\u201d<\/p>\n<p>\nThe Tensilica HiFi iQ DSP is fully capable of running popular small language models (SLMs) and large language models (LLMs) on the DSP itself, acting as an all-in-one AI processor for voice AI applications. For an additional performance boost, it can be easily paired with Cadence\u2019s Neo<sup>\u2122<\/sup> NPUs or customer-built NPUs to further maximize performance and energy efficiency.<\/p>\n<p>\nThe Tensilica HiFi iQ DSP is compatible with the Cadence NeuroWeave<sup>\u2122<\/sup> Software Development Kit (SDK), TensorFlow Lite for Micro (TFLM), LiteRT and ExecuTorch environments for AI model execution. The Tensilica HiFi iQ DSP also leverages the vast <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.cadence.com%2Fen_US%2Fhome%2Ftools%2Fsilicon-solutions%2Fcompute-ip%2Fpartners.html%23audiosoftware&amp;esheet=54400844&amp;newsitemid=20260121788959&amp;lan=en-US&amp;anchor=ecosystem&amp;index=1&amp;md5=5a20708d489870246d6f84d2672427d0\">ecosystem<\/a> of partners and OEMs that have developed software libraries, compilers, codec packages, frameworks and more to enable easy deployment and fast time to market.<\/p>\n<p><b>Customer and Partner Support<\/b><\/p>\n<p>\nTo see what audio partners and customers are saying about the new Tensilica HiFi iQ DSP, please visit this <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.cadence.com%2Fen_US%2Fhome%2Fcompany%2Fnewsroom%2Fhifi-iq-quote-sheet.html&amp;esheet=54400844&amp;newsitemid=20260121788959&amp;lan=en-US&amp;anchor=quote+sheet&amp;index=2&amp;md5=120a5ddf8635d8a8ccb5cf000e00121a\">quote sheet<\/a>.<\/p>\n<p><b>Availability and Related Resources<\/b><\/p>\n<p>\nThe Tensilica HiFi iQ DSP will be available to lead customers and partners in the first quarter of 2026, with general availability expected in the following quarter. The HiFi iQ DSP is also targeted for ISO 26262 functional safety (FUSA) certification, making it suitable for safety-critical applications. Future HiFi iQ DSP support for cache-coherent multicore configurations is planned.<\/p>\n<ul class=\"bwlistdisc\">\n<li>\nWhite Paper: <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.cadence.com%2Fen_US%2Fhome%2Fresources%2Fwhite-papers%2Fvoice-new-ui-wp.html&amp;esheet=54400844&amp;newsitemid=20260121788959&amp;lan=en-US&amp;anchor=Voice+is+the+New+UI&amp;index=3&amp;md5=a77eabf83557f1124a9a130cfbd1a127\">Voice is the New UI<\/a><\/li>\n<li>\nVideo: <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.cadence.com%2Fen_US%2Fhome%2Fmultimedia.html%2Fcontent%2Fdam%2Fcadence-www%2Fglobal%2Fen_US%2Fvideos%2Fip%2Ftensilica_processor_ip%2Fcadence-tensilica-hifi-iq-dsp.mp4&amp;esheet=54400844&amp;newsitemid=20260121788959&amp;lan=en-US&amp;anchor=Powering+Next-Gen+Voice+AI+and+High-Performance+Audio&amp;index=4&amp;md5=e7d6fb4c04f29b7e80b14f567a472355\">Powering Next-Gen Voice AI and High-Performance Audio<\/a><\/li>\n<li>\nProduct Brief: <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.cadence.com%2Fen_US%2Fhome%2Fresources%2Fproduct-briefs%2Ftensilica-hifi-dsp-family-pb.html&amp;esheet=54400844&amp;newsitemid=20260121788959&amp;lan=en-US&amp;anchor=Tensilica+HiFi+DSP+Family&amp;index=5&amp;md5=2a15b14eb43778d9188849b03c5fed7a\">Tensilica HiFi DSP Family<\/a><\/li>\n<li>\nProduct Webpage: <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.cadence.com%2Fen_US%2Fhome%2Ftools%2Fsilicon-solutions%2Fcompute-ip%2Fhifi-dsps%2Fhifi-iq.html&amp;esheet=54400844&amp;newsitemid=20260121788959&amp;lan=en-US&amp;anchor=HiFi+iQ+DSP&amp;index=6&amp;md5=8a850aa7741b12f6f57f920a4b7b8092\">HiFi iQ DSP<\/a><\/li>\n<\/ul>\n<p><b>About Cadence<\/b><\/p>\n<p>\nCadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence\u2019s Intelligent System Design<sup>\u2122<\/sup> strategy, are essential for the world\u2019s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics. In 2024, Cadence was recognized by the Wall Street Journal as one of the world\u2019s top 100 best-managed companies. Cadence solutions offer limitless opportunities\u2014learn more at <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.cadence.com%2F&amp;esheet=54400844&amp;newsitemid=20260121788959&amp;lan=en-US&amp;anchor=www.cadence.com&amp;index=7&amp;md5=9a83ed0f8ec1a7f7acb22c6c9e96bc06\">www.cadence.com<\/a>.<\/p>\n<p><i>\u00a9 2026 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at <\/i><a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.cadence.com%2Fgo%2Ftrademarks&amp;esheet=54400844&amp;newsitemid=20260121788959&amp;lan=en-US&amp;anchor=www.cadence.com%2Fgo%2Ftrademarks&amp;index=8&amp;md5=3e541ca020efeac1e7570fd27ae4e280\"><i>www.cadence.com\/go\/trademarks <\/i><\/a><i>are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.<\/i><\/p>\n<p>\nCategory: Featured<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20260121788959r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20260121788959\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20260121788959\/en\/<\/a><\/span><\/p>\n<p><b>For more information, please contact:<br \/>\n<\/b><br \/>Cadence Newsroom<br \/>\n<br \/>408-944-7039<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:newsroom@cadence.com\">newsroom@cadence.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> California United States North America<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Software Audio\/Video Hardware Electronic Design Automation Artificial Intelligence Consumer Electronics Technology Semiconductor<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Photo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260121788959\/en\/2696211\/3\/J56158_Tensilica_HiFi_iQ_2026_Press_1667x1667.jpg\" alt=\"Photo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\">As next-generation voice AI and emerging immersive audio applications proliferate in the home entertainment, automotive infotainment and smartphone markets, the Cadence Tensilica HiFi iQ DSP delivers the performance and energy efficiency required to meet growing SoC computational demands.<\/font><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Photo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260121788959\/en\/2696212\/3\/J55753_HiFi_iQ_2026_HiFi_iQ_Diagram_rev1.jpg\" alt=\"Photo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\">The sixth generation of its highly successful HiFi DSP family, Cadence&#8217;s Tensilica HiFi iQ DSP IP is based on a new architecture purpose-built for next-generation voice AI and emerging immersive audio.<\/font><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260121788959\/en\/2132320\/3\/Cadence_logo_400x400.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications Sixth-generation HiFi DSP delivers greater performance and energy efficiency for voice-based AI applications and the latest immersive audio formats SAN JOSE, Calif.&#8211;(BUSINESS WIRE)&#8211; Cadence (Nasdaq: CDNS) today announced the Cadence\u00ae Tensilica\u00ae HiFi iQ DSP IP, the sixth generation of its highly successful HiFi DSP family, based on a new architecture purpose-built for next-generation voice AI and emerging immersive audio. As these applications proliferate in the home entertainment, automotive infotainment and smartphone markets, the HiFi iQ DSP delivers the performance and energy efficiency required to meet growing SoC computational demands. Compared to the industry-leading Tensilica HiFi 5s DSP, the HiFi iQ DSP offers 2X greater compute performance, &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-929246","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.6 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications Sixth-generation HiFi DSP delivers greater performance and energy efficiency for voice-based AI applications and the latest immersive audio formats SAN JOSE, Calif.&#8211;(BUSINESS WIRE)&#8211; Cadence (Nasdaq: CDNS) today announced the Cadence\u00ae Tensilica\u00ae HiFi iQ DSP IP, the sixth generation of its highly successful HiFi DSP family, based on a new architecture purpose-built for next-generation voice AI and emerging immersive audio. As these applications proliferate in the home entertainment, automotive infotainment and smartphone markets, the HiFi iQ DSP delivers the performance and energy efficiency required to meet growing SoC computational demands. Compared to the industry-leading Tensilica HiFi 5s DSP, the HiFi iQ DSP offers 2X greater compute performance, &hellip; Continue reading &quot;Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2026-01-21T14:04:03+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/mms.businesswire.com\/media\/20260121788959\/en\/2696211\/4\/J56158_Tensilica_HiFi_iQ_2026_Press_1667x1667.jpg\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"6 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications\",\"datePublished\":\"2026-01-21T14:04:03+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications\\\/\"},\"wordCount\":1191,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/mms.businesswire.com\\\/media\\\/20260121788959\\\/en\\\/2696211\\\/4\\\/J56158_Tensilica_HiFi_iQ_2026_Press_1667x1667.jpg\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/cadence-unveils-tensilica-hifi-iq-dsp-purpose-built-for-next-generation-voice-ai-and-audio-applications\\\/\",\"name\":\"Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications - 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