{"id":915926,"date":"2025-12-03T16:09:23","date_gmt":"2025-12-03T21:09:23","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-expands-silicon-carbide-platform-with-300mm-capability-to-support-growing-demand-of-ai-and-datacenters\/"},"modified":"2025-12-03T16:09:23","modified_gmt":"2025-12-03T21:09:23","slug":"coherent-expands-silicon-carbide-platform-with-300mm-capability-to-support-growing-demand-of-ai-and-datacenters","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-expands-silicon-carbide-platform-with-300mm-capability-to-support-growing-demand-of-ai-and-datacenters\/","title":{"rendered":"Coherent Expands Silicon Carbide Platform with 300mm Capability to Support Growing Demand of AI and Datacenters"},"content":{"rendered":"
\n

SAXONBURG, Pa., Dec. 03, 2025 (GLOBE NEWSWIRE) — Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced a major milestone in its next-generation 300mm silicon carbide (SiC) platform to address increasing thermal efficiency demands in AI datacenter infrastructure.<\/p>\n

Coherent, a pioneer in large-diameter SiC substrates, has leveraged its proven 200mm platform expertise to develop a next-generation 300mm solution, engineered to manage rising thermal loads, that meets the accelerating performance and scalability needs of modern datacenters. As these systems demand higher power density, faster switching, and superior thermal management, the transition to larger diameter SiC wafers unlock major gains in energy efficiency and thermal performance.<\/p>\n

While datacenter thermal management applications are the primary focus of the platform, Coherent is also advancing its SiC technology for AR\/VR devices and power electronics through continued materials innovation and expanded manufacturing capacity.<\/p>\n

\u201cAI is transforming the thermal-management landscape in datacenters, and silicon carbide is emerging as one of the foundational materials enabling this scalability,\u201d said Gary Ruland, Senior Vice President and General Manager at Coherent. \u201cOur 300mm platform, which we plan to ramp in high volumes, delivers new levels of thermal efficiency that translate directly into faster, more power-efficient AI datacenters.\u201d<\/p>\n

The platform\u2019s conductive SiC substrates provide low resistivity, low defect density, and high homogeneity, enabling low-dissipation, high-frequency, and good thermal stability. In AI and data infrastructure, their superior properties boost energy efficiency and thermal performance in next-generation datacenter systems. The same technology enables thinner and more efficient waveguides for AR smart glasses and VR headsets, improving reliability in compact immersive display modules. In power electronics, the transition to 300mm allows more devices per wafer and reduces cost per chip, supporting applications such as electric vehicles, renewable energy systems and industrial automation.<\/p>\n

The 300mm platform reinforces Coherent\u2019s leadership in wide-bandgap semiconductor materials, enabling innovation across datacenters, optics and power applications.<\/p>\n

For more info, please visit: https:\/\/www.coherent.com\/materials\/wide-bandgap-electronics\/sic-substrates-epitaxy<\/a><\/p>\n

\n About Coherent<\/strong>\u00a0<\/p>\n

Coherent is the global photonics leader. We harness photons to drive innovation. Industry leaders in the datacenter, communications, and industrial markets rely on Coherent\u2019s world-leading technology to fuel their own innovation and growth.<\/p>\n

Founded in 1971 and operating in more than 20 countries, Coherent brings the industry\u2019s broadest, deepest technology stack; unmatched supply chain resilience; and global scale to help its customers solve their toughest technology challenges. Visit us at coherent.com<\/a>.<\/p>\n

\n
\n Media Contact<\/u>
\n <\/strong>
\n :<\/strong>\u00a0<\/p>\n

\n innovations@coherent.com<\/a>\u00a0<\/p>\n

\"\"
\n
\n \"\"\n <\/div>\n

<\/div>\n","protected":false},"excerpt":{"rendered":"

SAXONBURG, Pa., Dec. 03, 2025 (GLOBE NEWSWIRE) — Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced a major milestone in its next-generation 300mm silicon carbide (SiC) platform to address increasing thermal efficiency demands in AI datacenter infrastructure. Coherent, a pioneer in large-diameter SiC substrates, has leveraged its proven 200mm platform expertise to develop a next-generation 300mm solution, engineered to manage rising thermal loads, that meets the accelerating performance and scalability needs of modern datacenters. As these systems demand higher power density, faster switching, and superior thermal management, the transition to larger diameter SiC wafers unlock major gains in energy efficiency and thermal performance. While datacenter thermal management applications are the primary focus of the platform, Coherent is … <\/p>\n

Continue reading “Coherent Expands Silicon Carbide Platform with 300mm Capability to Support Growing Demand of AI and Datacenters”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-915926","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nCoherent Expands Silicon Carbide Platform with 300mm Capability to Support Growing Demand of AI and Datacenters - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-expands-silicon-carbide-platform-with-300mm-capability-to-support-growing-demand-of-ai-and-datacenters\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Coherent Expands Silicon Carbide Platform with 300mm Capability to Support Growing Demand of AI and Datacenters - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"SAXONBURG, Pa., Dec. 03, 2025 (GLOBE NEWSWIRE) — Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced a major milestone in its next-generation 300mm silicon carbide (SiC) platform to address increasing thermal efficiency demands in AI datacenter infrastructure. Coherent, a pioneer in large-diameter SiC substrates, has leveraged its proven 200mm platform expertise to develop a next-generation 300mm solution, engineered to manage rising thermal loads, that meets the accelerating performance and scalability needs of modern datacenters. As these systems demand higher power density, faster switching, and superior thermal management, the transition to larger diameter SiC wafers unlock major gains in energy efficiency and thermal performance. 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