{"id":911009,"date":"2025-11-17T16:31:35","date_gmt":"2025-11-17T21:31:35","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-unveils-new-liquid-cooling-and-power-portfolio-at-sc25\/"},"modified":"2025-11-17T16:31:35","modified_gmt":"2025-11-17T21:31:35","slug":"nvent-unveils-new-liquid-cooling-and-power-portfolio-at-sc25","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-unveils-new-liquid-cooling-and-power-portfolio-at-sc25\/","title":{"rendered":"nVent Unveils New Liquid Cooling and Power Portfolio at SC25"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b>nVent Unveils New Liquid Cooling and Power Portfolio at SC25<\/b><\/p>\n<p class=\"bwalignc\"><i>New modular liquid cooling solutions designed to support next-generation AI chips<\/i><\/p>\n<p class=\"bwalignc\"><i>Collaborating with Siemens on joint reference architecture<\/i><\/p>\n<p class=\"bwalignc\"><i>nVent Project Deschutes CDU based on Google OCP specification<\/i><\/p>\n<p class=\"bwalignc\"><i>Highlighting new technology innovations in \u201cWe Do Cool Stuff\u201d campaign<\/i><\/p>\n<p>ST. LOUIS&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<br \/>\nnVent Electric plc (NYSE:NVT) (\u201cnVent\u201d), a global leader in electrical connection and protection solutions, today announced its new, modular data center liquid cooling solutions aligned to chip manufacturers\u2019 current and future cooling requirements. The new solutions include enhanced coolant distribution unit (CDU) offerings with new row and rack-based CDUs alongside advanced technology cooling system manifolds. They also include updated racks based on leading reference designs and a new services program. nVent will showcase these solutions alongside its next-generation intelligent power distribution units (PDUs) at SC25. At the show, nVent will also debut its new \u201cWe Do Cool Stuff\u201d campaign and offer commentary on the evolution of liquid cooling alongside experts from NVIDIA, Lenovo, HPE and AMD.<\/p>\n<p>\n\u201cWe are tapping into our deep technical expertise, and working collaboratively with chip manufacturers and the broader ecosystem, to solve our customers\u2019 unique challenges with these new liquid cooling and power solutions,\u201d said Eric Osborn, GM of nVent Data Solutions. \u201cOur commitment to leading innovation for next-generation AI chips is at the core of the work we have done in the space for more than a decade.\u201d<\/p>\n<p>\nnVent will also showcase its new products in Tech Talks throughout the show and host Data Center Dynamics in its booth to produce educational content for the data center industry.<\/p>\n<p><b>Leadership in Liquid Cooling and Power<\/b><\/p>\n<p>\nnVent\u2019s new cooling and power portfolio includes modular and scalable row-based CDUs, next generation PDUs, AC and DC rack CDUs, and new technology cooling system (TCS) manifolds. Together, these new solutions bring cutting edge cooling infrastructure to data centers to support the AI buildout. nVent\u2019s new CDU and PDU products also include a common control platform that will enhance reliability and improve the user experience for data center operators.<\/p>\n<p>\nThe company will also highlight its data center services offering. Liquid cooling technology brings millions of dollars of IT equipment into close proximity with liquid, making correct installation and maintenance imperative to avoid costly downtime and repairs. nVent\u2019s comprehensive suite of services, including installation, start-up, preventive maintenance, and spare parts and repairs, helps keep data center projects on time and running smoothly.<\/p>\n<p><b>Collaborating with Industry Leaders<\/b><\/p>\n<p>\nWith its deep expertise, including years of experience with global installations and designing for serviceability, nVent is well positioned to deliver infrastructure solutions supporting next-generation reference architectures.<\/p>\n<p>\nModern data centers face increasing rack-level power densities, more compute-intensive workloads, and growing demand for modularity to maintain uptime and scalability. nVent and Siemens are combining their expertise to help data centers prepare cooling and power infrastructure for global deployment and operational resilience. The two companies are collaborating to develop a liquid cooling and power reference architecture, purpose-built for hyperscale AI workloads.<\/p>\n<p>\nnVent is also excited to <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.opencompute.org%2Fproducts%2F733%2Fnvent-project-deschutes-open-cdu&amp;esheet=54359583&amp;newsitemid=20251117098362&amp;lan=en-US&amp;anchor=participate+in+Project+Deschutes&amp;index=1&amp;md5=4993d5c33bc30dde993d6795ae3f3b14\">participate in Project Deschutes<\/a>, and will exhibit its new CDU design based on Google\u2019s specifications at SC25. Project Deschutes 5.0 is a CDU design specification for data centers made available through the Open Compute Project. Project Deschutes is designed to help accelerate the adoption of liquid cooling across the data center industry.<\/p>\n<p><b>Highlighting Industry Experts<\/b><\/p>\n<p>\nnVent experts will be on the ground and on social media at SC25 to share the latest industry insights from the rapidly growing data center space. Representatives from nVent, NVIDIA, Lenovo, HPE and AMD will appear together on a joint panel to discuss the legacy and next generation of liquid cooling in supercomputing. Leaning on decades of research, expertise and experience in the field, these leaders will provide insights into the future of cooling technology for data centers. This presentation will be held in booth 240-241-242 on Friday, November 21 at 8:30 a.m. CT.<\/p>\n<p>\nAdditionally, nVent will present \u201cTech Talks\u201d every day in exhibit hall booth #2638. In these 15-minute presentations, nVent experts will highlight new products and answer critical industry questions to support data center managers working to deploy the latest AI technology.<\/p>\n<p><b>We Do Cool Stuff<\/b><\/p>\n<p>\nTo showcase its leadership in the data center industry, legacy of innovation and how it is advancing the future of computing and IT infrastructure, nVent will debut a new marketing campaign: We Do Cool Stuff. Through campaign materials including video, social media, digital and print collateral, SC25 attendees will be invited to explore how nVent is building the future of data centers.<\/p>\n<p>\nnVent is a leader and innovator in liquid cooling with a strong track record of solving complex cooling challenges for global cloud service providers. nVent\u2019s industry-leading team of experts leverages its broad portfolio to help data center managers achieve their goals. Through collaboration with leading chip manufacturers, OEMs and hyperscalers, nVent delivers reliable, scalable liquid cooling solutions that are ready to meet the future of high-density computing.<\/p>\n<p>\nVisit nVent at booth #3604, and learn more about nVent\u2019s latest data center solutions: <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nvent.com%2Fdata-centers&amp;esheet=54359583&amp;newsitemid=20251117098362&amp;lan=en-US&amp;anchor=https%3A%2F%2Fwww.nvent.com%2Fdata-centers&amp;index=2&amp;md5=7818160231e335ada67aa0c4478c93d4\">https:\/\/www.nvent.com\/data-centers<\/a><\/p>\n<p><b>About nVent<\/b><\/p>\n<p>\nnVent is a leading global provider of electrical connection and protection solutions. We believe our inventive electrical solutions enable safer systems and ensure a more secure world. We design, manufacture, market, install and service high performance products and solutions that connect and protect some of the world&#8217;s most sensitive equipment, buildings, and critical processes. We offer a comprehensive range of systems protection and electrical connections solutions across industry-leading brands that are recognized globally for quality, reliability, and innovation. Our principal office is in London and our management office in the United States is in Minneapolis. Our robust portfolio of leading electrical product brands dates back more than 100 years and includes nVent CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE. Learn more at <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nvent.com%2Fen-us%2Fabout-nvent%2Foverview&amp;esheet=54359583&amp;newsitemid=20251117098362&amp;lan=en-US&amp;anchor=www.nvent.com&amp;index=3&amp;md5=3d496a583d2b4c525d6bebde8715601c\">www.nvent.com<\/a>.<\/p>\n<p>\nnVent, CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE are trademarks owned or licensed by nVent Services GmbH or its affiliates.<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20251117098362r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20251117098362\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20251117098362\/en\/<\/a><\/span><\/p>\n<p><b>Media Contact<\/b><\/p>\n<p>\nKevin H. King<br \/>\n<br \/>Vice President, Global Communications<br \/>\n<br \/>nVent<br \/>\n<br \/>763.291.0526<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:kevin.king@nvent.com\">kevin.king@nvent.com<\/a><\/p>\n<p>\nJulian Andrews<br \/>\n<br \/>Sr. External Communications Specialist<br \/>\n<br \/>nVent<br \/>\n<br \/>651.200.1840<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:julian.andrews@nvent.com\">julian.andrews@nvent.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> Missouri United States North America<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Data Management Other Manufacturing Technology Steel Engineering Chemicals\/Plastics Automotive Manufacturing Aerospace Manufacturing Nuclear Mobile\/Wireless Building Systems Construction &amp; Property Utilities Oil\/Gas Coal Energy Telecommunications Internet Hardware Electronic Design Automation<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\" \/>\n","protected":false},"excerpt":{"rendered":"<p>nVent Unveils New Liquid Cooling and Power Portfolio at SC25 New modular liquid cooling solutions designed to support next-generation AI chips Collaborating with Siemens on joint reference architecture nVent Project Deschutes CDU based on Google OCP specification Highlighting new technology innovations in \u201cWe Do Cool Stuff\u201d campaign ST. LOUIS&#8211;(BUSINESS WIRE)&#8211; nVent Electric plc (NYSE:NVT) (\u201cnVent\u201d), a global leader in electrical connection and protection solutions, today announced its new, modular data center liquid cooling solutions aligned to chip manufacturers\u2019 current and future cooling requirements. The new solutions include enhanced coolant distribution unit (CDU) offerings with new row and rack-based CDUs alongside advanced technology cooling system manifolds. They also include updated racks based on leading reference designs and a new services program. &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-unveils-new-liquid-cooling-and-power-portfolio-at-sc25\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;nVent Unveils New Liquid Cooling and Power Portfolio at SC25&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-911009","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>nVent Unveils New Liquid Cooling and Power Portfolio at SC25 - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-unveils-new-liquid-cooling-and-power-portfolio-at-sc25\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"nVent Unveils New Liquid Cooling and Power Portfolio at SC25 - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"nVent Unveils New Liquid Cooling and Power Portfolio at SC25 New modular liquid cooling solutions designed to support next-generation AI chips Collaborating with Siemens on joint reference architecture nVent Project Deschutes CDU based on Google OCP specification Highlighting new technology innovations in \u201cWe Do Cool Stuff\u201d campaign ST. LOUIS&#8211;(BUSINESS WIRE)&#8211; nVent Electric plc (NYSE:NVT) (\u201cnVent\u201d), a global leader in electrical connection and protection solutions, today announced its new, modular data center liquid cooling solutions aligned to chip manufacturers\u2019 current and future cooling requirements. The new solutions include enhanced coolant distribution unit (CDU) offerings with new row and rack-based CDUs alongside advanced technology cooling system manifolds. 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LOUIS&#8211;(BUSINESS WIRE)&#8211; nVent Electric plc (NYSE:NVT) (\u201cnVent\u201d), a global leader in electrical connection and protection solutions, today announced its new, modular data center liquid cooling solutions aligned to chip manufacturers\u2019 current and future cooling requirements. The new solutions include enhanced coolant distribution unit (CDU) offerings with new row and rack-based CDUs alongside advanced technology cooling system manifolds. 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