{"id":900891,"date":"2025-10-28T07:02:35","date_gmt":"2025-10-28T11:02:35","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/"},"modified":"2025-10-28T07:02:35","modified_gmt":"2025-10-28T11:02:35","slug":"onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/","title":{"rendered":"onsemi\u2019s Treo Platform Selected by Teledyne    for Advanced Infrared Imaging Design"},"content":{"rendered":"<h2>\nTreo\u2019s ROIC process technology leverages high-density, low-power architecture for mission-critical aerospace, defense, security, and scientific applications<br \/>\n<\/h2>\n<div class=\"mw_release\">\n<p>SCOTTSDALE, Ariz., Oct.  28, 2025  (GLOBE NEWSWIRE) &#8212; onsemi today announced that Teledyne Technologies has selected its Treo platform to develop next-generation readout integrated circuit (ROIC) application-specific integrated circuits (ASICs) for infrared imaging systems. As the industry\u2019s most advanced analog and mixed-signal platform, Treo can be combined with specialized ROIC modules to meet the demands of infrared focal plane array (FPA) systems, which are essential to a wide range of aerospace, defense, security, and scientific applications.\u00a0<\/p>\n<p>Built on an advanced 65nm node, the Treo platform features a modular architecture and a rich set of IP building blocks that help speed up development and reduce time-to-market. Its ROIC process technology combines onsemi\u2019s established ROIC offering with Treo\u2019s precision analog, advanced digital, and low-voltage power features to deliver a powerful, differentiated solution.\u00a0<\/p>\n<p>\n        <strong>Key Features<\/strong>\n      <\/p>\n<ul type=\"disc\">\n<li>Higher gate density to allow for more functionality in a smaller footprint, improving performance while reducing size\u00a0<\/li>\n<\/ul>\n<ul type=\"disc\">\n<li>Lower power dissipation to improve power efficiency and enable longer mission life\u00a0<\/li>\n<\/ul>\n<ul type=\"disc\">\n<li>Dense on-chip energy storage to improve signal integrity and support large detector arrays without increasing die size\u00a0<\/li>\n<\/ul>\n<ul type=\"disc\">\n<li>Low resistivity substrates for greater resilience against radiation in space and defense applications\u00a0<\/li>\n<\/ul>\n<ul type=\"disc\">\n<li>Wide temperature range for consistent performance in extreme conditions, from cryogenic to automotive temperature grades\u00a0<\/li>\n<\/ul>\n<ul type=\"disc\">\n<li>Die stitching to support large-format sensor designs for advanced imaging systems\u00a0<\/li>\n<\/ul>\n<p>Together, these advanced features enable Teledyne to build smaller, faster, and more reliable imaging systems with mission-critical capabilities that operate efficiently in extreme environments.\u00a0<\/p>\n<p>\u201cThe ability to deliver high-performance imaging sensors that operate reliably in the harshest environments is critical for our space products. The onsemi Treo platform provides the advanced capabilities we need to add more functionality in a smaller footprint, with lower power for thermal management. These are key to our ability to design next-generation infrared imaging systems.\u201d\u00a0 \u2014 Anders Petersen, Teledyne Imaging Sensors Chief Engineer and Fellow\u00a0<\/p>\n<p>\u201consemi\u2019s Treo platform is designed to accelerate innovation and reduce time to market by combining a modular architecture with a comprehensive library of proven IP building blocks. This enables the rapid development of custom ROICs, while the full compatibility of our Treo low-voltage devices within the ROIC flow ensures seamless integration of precision analog and digital functions. This makes Treo the ideal foundation for Teledyne\u2019s next-generation infrared imaging designs.\u201d \u2014 Michel De Mey, Vice President, Sensor Interface Division, onsemi.\u00a0<\/p>\n<p>The Treo platform is manufactured in onsemi\u2019s East Fishkill, NY facility. With the facility\u2019s Category 1A Trusted Supplier accreditation, onsemi is positioned to address the U.S. government\u2019s need for domestic chip manufacturing in support of national security.\u00a0\u00a0<\/p>\n<p>###\u00a0<\/p>\n<p>\n        <strong>About onsemi\u00a0<\/strong>\n      <\/p>\n<p>onsemi\u202f(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.\u202fonsemi\u202foffers a highly differentiated and innovative product portfolio, delivering intelligent power and sensing technologies that solve the world\u2019s most complex challenges and leads the way to creating a safer, cleaner and smarter world.\u202fonsemi\u202fis included in the Nasdaq-100 Index\u00ae\u202fand S&amp;P 500\u00ae\u202findex. Learn more about\u202fonsemi\u202fat\u202f<a href=\"https:\/\/www.globenewswire.com\/Tracker?data=Zim8AUFM8XDo_m4RdBxdAYBOPlpPPbD-h_i0FNFMQ4caU6EV_jUqA3l6YBuTt7eX8mVCN31bwbWGgCIck39agRXLePDONoMdn1oQX7snqz8=\" rel=\"nofollow\" target=\"_blank\">www.onsemi.com<\/a>.\u00a0<\/p>\n<p>onsemi\u202fand the\u202fonsemi\u202flogo are trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the Company references its website in this news release, information on the website is not to be incorporated herein. <\/p>\n<p>Contact Info<\/p>\n<p>Michael Mullaney<br \/><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=kQpIeWnBElnEj-EwAYkpvwXgfh-bkOD7OUuKwoOhOoCKeWVnkhcSdMWFPeerMEDGibfg2fT0b-SWI6NnkwNdzHcTUK6v0r-RPFmohSIdhwRf4IdA-kZs4y1wNKYM-2xZ\" rel=\"nofollow\" target=\"_blank\">michael.mullaney@onsemi.com<\/a><br \/>+1 838-289-7314<\/p>\n<p>      <img decoding=\"async\" alt=\"\" class=\"__GNW8366DE3E__IMG\" src=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTU2MzIzOSM3MjI4Mjc2IzUwMDE0OTE2Mw==\" \/><br \/>\n      <br \/>\n      <img decoding=\"async\" alt=\"\" src=\"https:\/\/ml.globenewswire.com\/media\/N2VmYTc4ZmEtNmM5MC00ZTVlLWFhZTktMTZhYTkxZjU1MjVjLTUwMDE0OTE2My0yMDI1LTEwLTI4LWVu\/tiny\/onsemi-.png\" \/>\n    <\/div>\n<div class=\"mw_contactinfo\"><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Treo\u2019s ROIC process technology leverages high-density, low-power architecture for mission-critical aerospace, defense, security, and scientific applications SCOTTSDALE, Ariz., Oct. 28, 2025 (GLOBE NEWSWIRE) &#8212; onsemi today announced that Teledyne Technologies has selected its Treo platform to develop next-generation readout integrated circuit (ROIC) application-specific integrated circuits (ASICs) for infrared imaging systems. As the industry\u2019s most advanced analog and mixed-signal platform, Treo can be combined with specialized ROIC modules to meet the demands of infrared focal plane array (FPA) systems, which are essential to a wide range of aerospace, defense, security, and scientific applications.\u00a0 Built on an advanced 65nm node, the Treo platform features a modular architecture and a rich set of IP building blocks that help speed up development and reduce &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;onsemi\u2019s Treo Platform Selected by Teledyne    for Advanced Infrared Imaging Design&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-900891","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>onsemi\u2019s Treo Platform Selected by Teledyne  for Advanced Infrared Imaging Design - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"onsemi\u2019s Treo Platform Selected by Teledyne  for Advanced Infrared Imaging Design - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Treo\u2019s ROIC process technology leverages high-density, low-power architecture for mission-critical aerospace, defense, security, and scientific applications SCOTTSDALE, Ariz., Oct. 28, 2025 (GLOBE NEWSWIRE) &#8212; onsemi today announced that Teledyne Technologies has selected its Treo platform to develop next-generation readout integrated circuit (ROIC) application-specific integrated circuits (ASICs) for infrared imaging systems. As the industry\u2019s most advanced analog and mixed-signal platform, Treo can be combined with specialized ROIC modules to meet the demands of infrared focal plane array (FPA) systems, which are essential to a wide range of aerospace, defense, security, and scientific applications.\u00a0 Built on an advanced 65nm node, the Treo platform features a modular architecture and a rich set of IP building blocks that help speed up development and reduce &hellip; Continue reading &quot;onsemi\u2019s Treo Platform Selected by Teledyne  for Advanced Infrared Imaging Design&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2025-10-28T11:02:35+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTU2MzIzOSM3MjI4Mjc2IzUwMDE0OTE2Mw==\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"onsemi\u2019s Treo Platform Selected by Teledyne for Advanced Infrared Imaging Design\",\"datePublished\":\"2025-10-28T11:02:35+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\\\/\"},\"wordCount\":619,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTU2MzIzOSM3MjI4Mjc2IzUwMDE0OTE2Mw==\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\\\/\",\"name\":\"onsemi\u2019s Treo Platform Selected by Teledyne for Advanced Infrared Imaging Design - 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Market Newsdesk","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/","og_locale":"en_US","og_type":"article","og_title":"onsemi\u2019s Treo Platform Selected by Teledyne  for Advanced Infrared Imaging Design - Market Newsdesk","og_description":"Treo\u2019s ROIC process technology leverages high-density, low-power architecture for mission-critical aerospace, defense, security, and scientific applications SCOTTSDALE, Ariz., Oct. 28, 2025 (GLOBE NEWSWIRE) &#8212; onsemi today announced that Teledyne Technologies has selected its Treo platform to develop next-generation readout integrated circuit (ROIC) application-specific integrated circuits (ASICs) for infrared imaging systems. As the industry\u2019s most advanced analog and mixed-signal platform, Treo can be combined with specialized ROIC modules to meet the demands of infrared focal plane array (FPA) systems, which are essential to a wide range of aerospace, defense, security, and scientific applications.\u00a0 Built on an advanced 65nm node, the Treo platform features a modular architecture and a rich set of IP building blocks that help speed up development and reduce &hellip; Continue reading \"onsemi\u2019s Treo Platform Selected by Teledyne  for Advanced Infrared Imaging Design\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/","og_site_name":"Market Newsdesk","article_published_time":"2025-10-28T11:02:35+00:00","og_image":[{"url":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTU2MzIzOSM3MjI4Mjc2IzUwMDE0OTE2Mw==","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"onsemi\u2019s Treo Platform Selected by Teledyne for Advanced Infrared Imaging Design","datePublished":"2025-10-28T11:02:35+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/"},"wordCount":619,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/#primaryimage"},"thumbnailUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTU2MzIzOSM3MjI4Mjc2IzUwMDE0OTE2Mw==","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/","name":"onsemi\u2019s Treo Platform Selected by Teledyne for Advanced Infrared Imaging Design - Market Newsdesk","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/#primaryimage"},"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/#primaryimage"},"thumbnailUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTU2MzIzOSM3MjI4Mjc2IzUwMDE0OTE2Mw==","datePublished":"2025-10-28T11:02:35+00:00","author":{"@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"breadcrumb":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/#primaryimage","url":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTU2MzIzOSM3MjI4Mjc2IzUwMDE0OTE2Mw==","contentUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTU2MzIzOSM3MjI4Mjc2IzUwMDE0OTE2Mw=="},{"@type":"BreadcrumbList","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.marketnewsdesk.com\/"},{"@type":"ListItem","position":2,"name":"onsemi\u2019s Treo Platform Selected by Teledyne for Advanced Infrared Imaging Design"}]},{"@type":"WebSite","@id":"https:\/\/www.marketnewsdesk.com\/#website","url":"https:\/\/www.marketnewsdesk.com\/","name":"Market Newsdesk","description":"Latest Business News in Real Time","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.marketnewsdesk.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Person","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979","name":"Newsdesk","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","caption":"Newsdesk"},"url":"https:\/\/www.marketnewsdesk.com\/index.php\/author\/newsdesk\/"}]}},"_links":{"self":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts\/900891","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/comments?post=900891"}],"version-history":[{"count":0,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts\/900891\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/media?parent=900891"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/categories?post=900891"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/tags?post=900891"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}