{"id":876425,"date":"2025-08-18T00:10:03","date_gmt":"2025-08-18T04:10:03","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025\/"},"modified":"2025-08-18T00:10:03","modified_gmt":"2025-08-18T04:10:03","slug":"nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025\/","title":{"rendered":"Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025"},"content":{"rendered":"<p>        <!--.bwlistdisc { list-style-type: disc }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p><b>Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025<\/b><\/p>\n<ul class=\"bwlistdisc\">\n<li><b>Visit booth #i2326 to connect with our experts on automated fluid dispensing and plasma treatment for semiconductor advanced packaging<\/b><\/li>\n<\/ul>\n<p>CARLSBAD, Calif.&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions&amp;esheet=54309158&amp;newsitemid=20250817149251&amp;lan=en-US&amp;anchor=Nordson+Electronics+Solutions&amp;index=1&amp;md5=2fa3ae1df493d65743120c2242b1d934\">Nordson Electronics Solutions<\/a>, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions%2Fyour-process%2Findustries%2Fsemiconductor-packaging&amp;esheet=54309158&amp;newsitemid=20250817149251&amp;lan=en-US&amp;anchor=semiconductor+manufacturing&amp;index=2&amp;md5=8d3455a48ef0b705f0d822e72d95a44e\">semiconductor manufacturing<\/a> at <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fsemicontaiwan.org%2Fen&amp;esheet=54309158&amp;newsitemid=20250817149251&amp;lan=en-US&amp;anchor=SEMICON+Taiwan+2025&amp;index=3&amp;md5=19dfa56fa99951656eed3c6d45707ae4\">SEMICON Taiwan 2025<\/a>, September 10-12, booth i2326.<\/p>\n<p id=\"news-body-cta\">This press release features multimedia. View the full release here: <a href=\"https:\/\/www.businesswire.com\/news\/home\/20250817149251\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20250817149251\/en\/<\/a><\/p>\n<div id=\"bwbodyimg\" style=\"width: 480px;float:left;padding-left:0px;padding-right:20px;padding-top:0px;padding-bottom:0px\"><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20250817149251\/en\/2554217\/4\/Nordson-Electronics-Vantage-for-Panel-Level.jpg\" alt=\"Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results. The ASYMTEK Vantage system offers several new and innovative configurations to meet the demands of today\u2019s evolving technologies, like panel-level packaging. The Vantage system is already a popular dispenser in wafer-level packaging operations including high-volume underfill, dispense gap fill, and sealing lines for fan-out\/fan-in, strips, and module assembly.\" \/><\/p>\n<p style=\"font-size:85%\">Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results. The ASYMTEK Vantage system offers several new and innovative configurations to meet the demands of today\u2019s evolving technologies, like panel-level packaging. The Vantage system is already a popular dispenser in wafer-level packaging operations including high-volume underfill, dispense gap fill, and sealing lines for fan-out\/fan-in, strips, and module assembly.<\/p>\n<\/div>\n<p>\nOn display will be the <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2FProducts%2FElectronics-Solutions-Products%2FASYMTEK-Vantage-Series-Next-Generation-Fluid-Dispensing-Capabilities&amp;esheet=54309158&amp;newsitemid=20250817149251&amp;lan=en-US&amp;anchor=ASYMTEK%26%23174%3B+Vantage%26%23174%3B+dispensing+system&amp;index=4&amp;md5=bf5ea0b57b6b8a756f9f3beb9a231ae7\">ASYMTEK<sup>\u00ae<\/sup> Vantage<sup>\u00ae<\/sup> dispensing system<\/a>, configured with two <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2FProducts%2FElectronics-Solutions-Products%2FASYMTEK-IntelliJet-Jetting-System-with-ReadiSet-Jet-Cartridge&amp;esheet=54309158&amp;newsitemid=20250817149251&amp;lan=en-US&amp;anchor=ASYMTEK+IntelliJet%26%23174%3B+jet+valves&amp;index=5&amp;md5=0a781389455e2976849e8941555c7606\">ASYMTEK IntelliJet<sup>\u00ae<\/sup> jet valves<\/a> for high productivity and accuracy for semiconductor packaging and microelectronics manufacturing. The Vantage system offers several new and innovative configurations to meet the demands of today\u2019s evolving technologies, like panel-level packaging, The Vantage system is already a popular dispenser in wafer-level packaging operations, including high-volume underfill, dispense gap fill, and sealing lines for fan-out\/fan-in, strips, and module assembly.<\/p>\n<p>\nPlasma treatment removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Nordson experts in plasma treatment will be available to discuss how customers can use this technology for successful advanced packaging operations.<\/p>\n<p>\nThe theme for SEMICON Taiwan 2025, \u201cLeading with Collaboration. Innovating with the World,\u201d will showcase how the semiconductor community is navigating supply chain shifts and how the industry is developing solutions for today and the future.<\/p>\n<p><strong>About Nordson Electronics Solutions<\/strong><\/p>\n<p><a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions&amp;esheet=54309158&amp;newsitemid=20250817149251&amp;lan=en-US&amp;anchor=Nordson+Electronics+Solutions&amp;index=6&amp;md5=c49ac4e5e6ba69b554bcf39f70af6813\">Nordson Electronics Solutions<\/a> makes reliable electronics a reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world&#8217;s semiconductor, electronics, and precision assembly manufacturers with the innovative <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions%2Ffluid-dispensing&amp;esheet=54309158&amp;newsitemid=20250817149251&amp;lan=en-US&amp;anchor=fluid+dispensing&amp;index=7&amp;md5=f88a76dd7aab7dfb5b5cd5ecccc939bd\">fluid dispensing<\/a>, <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions%2Fconformal-coating&amp;esheet=54309158&amp;newsitemid=20250817149251&amp;lan=en-US&amp;anchor=conformal+coating&amp;index=8&amp;md5=518b2d2548e7855ffb32757913b045ef\">conformal coating<\/a>, <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions%2Fplasma-applications&amp;esheet=54309158&amp;newsitemid=20250817149251&amp;lan=en-US&amp;anchor=plasma+treatment&amp;index=9&amp;md5=13b96b17309cb69521e0c94ebe75c37f\">plasma treatment<\/a>, and <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions%2Fselect-soldering&amp;esheet=54309158&amp;newsitemid=20250817149251&amp;lan=en-US&amp;anchor=selective+soldering&amp;index=10&amp;md5=030f40c149d274b5441dfce8d01fb435\">selective soldering<\/a> solutions their products need to protect sensitive electronics and deliver a lifespan of reliability. Day after day, year after year, across the globe, for over 40 years, we&#8217;ve provided engineering and applications excellence to help our customers succeed.<\/p>\n<p><b>About Nordson Corporation<\/b><\/p>\n<p>\nNordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company\u2019s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end-market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.nordson.com&amp;esheet=54309158&amp;newsitemid=20250817149251&amp;lan=en-US&amp;anchor=www.nordson.com&amp;index=11&amp;md5=a30ad95af647bc9e6b73e870449dd142\">www.nordson.com<\/a>.<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20250817149251r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20250817149251\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20250817149251\/en\/<\/a><\/span><\/p>\n<p>\nFor information:<br \/>\n<br \/>MAIN OFFICE:<br \/>\n<br \/>Roberta Foster-Smith<br \/>\n<br \/>Nordson Electronics Solutions<br \/>\n<br \/>2762 Loker Ave West<br \/>\n<br \/>Carlsbad, CA, USA 92010<br \/>\n<br \/>Tel: +1.760.431.1919<br \/>\n<br \/>Email: <a rel=\"nofollow\" href=\"mailto:roberta.foster-smith@nordson.com\">roberta.foster-smith@nordson.com<\/a><\/p>\n<p>\nFor information in Taiwan:<br \/>\n<br \/>Alex Wu<br \/>\n<br \/>Sales Director, ASYMTEK and SELECT<br \/>\n<br \/>Nordson Advanced Technology LLC, Taiwan Branch<br \/>\n<br \/>Tel: +886.932.227.770<br \/>\n<br \/>Email: <a rel=\"nofollow\" href=\"mailto:alex.wu@nordson.com\">alex.wu@nordson.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> California United States Taiwan North America Asia Pacific<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Hardware Chemicals\/Plastics Electronic Design Automation Semiconductor Automotive Manufacturing Aerospace Manufacturing Technology Nanotechnology Other Technology Other Manufacturing Machinery Packaging Mobile\/Wireless Engineering<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Photo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20250817149251\/en\/2554217\/3\/Nordson-Electronics-Vantage-for-Panel-Level.jpg\" alt=\"Photo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\">Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results. The ASYMTEK Vantage system offers several new and innovative configurations to meet the demands of today\u2019s evolving technologies, like panel-level packaging. The Vantage system is already a popular dispenser in wafer-level packaging operations including high-volume underfill, dispense gap fill, and sealing lines for fan-out\/fan-in, strips, and module assembly.<\/font><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20250817149251\/en\/2491239\/3\/Nordson_ElectronicsSolutions_ComboHorizontalLogo_rgb.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025 Visit booth #i2326 to connect with our experts on automated fluid dispensing and plasma treatment for semiconductor advanced packaging CARLSBAD, Calif.&#8211;(BUSINESS WIRE)&#8211;Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20250817149251\/en\/ Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results. The ASYMTEK Vantage system offers several new and innovative configurations to meet the demands of today\u2019s evolving technologies, like &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-876425","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025 - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025 - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025 Visit booth #i2326 to connect with our experts on automated fluid dispensing and plasma treatment for semiconductor advanced packaging CARLSBAD, Calif.&#8211;(BUSINESS WIRE)&#8211;Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20250817149251\/en\/ Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results. The ASYMTEK Vantage system offers several new and innovative configurations to meet the demands of today\u2019s evolving technologies, like &hellip; Continue reading &quot;Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2025-08-18T04:10:03+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/mms.businesswire.com\/media\/20250817149251\/en\/2554217\/4\/Nordson-Electronics-Vantage-for-Panel-Level.jpg\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025\",\"datePublished\":\"2025-08-18T04:10:03+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025\\\/\"},\"wordCount\":661,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/mms.businesswire.com\\\/media\\\/20250817149251\\\/en\\\/2554217\\\/4\\\/Nordson-Electronics-Vantage-for-Panel-Level.jpg\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-to-exhibit-high-yield-fluid-dispensing-technologies-for-panel-level-and-wafer-level-packaging-at-semicon-taiwan-2025\\\/\",\"name\":\"Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025 - 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