{"id":860254,"date":"2025-06-12T16:38:10","date_gmt":"2025-06-12T20:38:10","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/"},"modified":"2025-06-12T16:38:10","modified_gmt":"2025-06-12T20:38:10","slug":"coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/","title":{"rendered":"Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing"},"content":{"rendered":"<div class=\"mw_release\">\n<p>SAXONBURG, Pa., June  12, 2025  (GLOBE NEWSWIRE) &#8212; Coherent Corp. (NYSE: COHR), a global leader in engineered materials, today announces the release of a groundbreaking diamond-loaded silicon carbide (SiC) ceramic composite, designed to tackle the thermal challenges of advanced AI datacenters and high-performance computing (HPC) systems.<\/p>\n<p>The patented diamond-silicon carbide material from Coherent achieves isotropic thermal conductivity exceeding 800 W\/m-K, and delivers twice the performance of copper, the current industry benchmark. It also closely matches the coefficient of thermal expansion (CTE) of silicon, making it ideal for direct integration with semiconductor devices.<\/p>\n<p>\u201cDiamond remains unmatched in its ability to manage extreme thermal loads in electronics,\u201d said Steve Rummel, Senior Vice President of Engineered Materials at Coherent. \u201cOur patented diamond-SiC outperforms traditional materials by a wide margin, enabling more reliable operation, longer component lifetimes, and significantly lower cooling costs. With cooling accounting for up to 50% of a datacenter\u2019s energy consumption, thermal efficiency is more critical than ever.\u201d<\/p>\n<p>Engineered for durability and versatility, this composite is corrosion-resistant, electrically insulating, and mechanically robust across a broad temperature range. It is fully compatible with direct liquid cooling (DLC) systems and integrates easily into modern server architectures and embedded cooling designs. Key applications include direct to chip heat spreading, microchannel cold plates (single- and two-phase), semiconductor device substrates, and other advanced solutions where copper-based materials fall short.<\/p>\n<p>This innovation from Coherent marks a major step forward in thermal management, addressing the growing performance and energy-efficiency needs of AI infrastructure and HPC platforms. For more information on Diamond Heat Spreaders by Coherent, please visit:\u00a0<a href=\"https:\/\/www.globenewswire.com\/Tracker?data=GvzwIEKegwkEK53fFAe2jGAS258P2tyWe5OQ96d2Ke_7BUoPBAfoKBpZXeISJiaro8imXSMF6plHSyl8u17FmHVi8-n1-Q3U220O6DQI9kHMV54SnTsGysek2bygEu2OxY2JE2VEBA3r9W59GY8tIJVvHdHY9jRKtzMzgSNhSZWZ6Se9J_M6yoHxD2o-85LwcrVib2KNpYLRfGELT73GFA==\" rel=\"nofollow\" target=\"_blank\">Cooling Solutions for Overworked Datacenters | Coherent<\/a><\/p>\n<p>\n        <strong>About Coherent<\/strong>\u00a0<\/p>\n<p>Coherent empowers market innovators to define the future through breakthrough technologies, from materials to systems. We deliver innovations that resonate with our customers in diversified applications for the industrial, communications, electronics, and instrumentation markets. Coherent has research and development, manufacturing, sales, service, and distribution facilities worldwide. For more information, please visit us at coherent.com.<\/p>\n<p>\n        <strong><br \/>\n          <u>Media Contact<\/u><br \/>\n        <\/strong><br \/>\n        <strong>:<\/strong>\u00a0<br \/><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=Nghj6iHDw1-hgJ6SWNj3Uuq_ckvnd3r0LW5e0JZ_ChruVYrCN_3BCqfZhWvXWAvR5UQIuWsQZE3cKE78VCAtCszYTaRKfO7Ptvu2EpRMYt6XTtXno4GziET2vu7F_IKI\" rel=\"nofollow\" target=\"_blank\">innovations@coherent.com<\/a>\u00a0<\/p>\n<p>      <img decoding=\"async\" alt=\"\" class=\"__GNW8366DE3E__IMG\" src=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTQ2ODExNiM2OTg5MzI2IzIwMTY2NjY=\" \/><br \/>\n      <br \/>\n      <img decoding=\"async\" alt=\"\" src=\"https:\/\/ml.globenewswire.com\/media\/MzdhMzFhZDktZjg4YS00MWVkLThlYjUtYThlMDk5ZjhiOWI5LTEwMjgyMzktMjAyNS0wNi0xMi1lbg==\/tiny\/Coherent-Corp-.png\" \/>\n    <\/div>\n<div class=\"mw_contactinfo\"><\/div>\n","protected":false},"excerpt":{"rendered":"<p>SAXONBURG, Pa., June 12, 2025 (GLOBE NEWSWIRE) &#8212; Coherent Corp. (NYSE: COHR), a global leader in engineered materials, today announces the release of a groundbreaking diamond-loaded silicon carbide (SiC) ceramic composite, designed to tackle the thermal challenges of advanced AI datacenters and high-performance computing (HPC) systems. The patented diamond-silicon carbide material from Coherent achieves isotropic thermal conductivity exceeding 800 W\/m-K, and delivers twice the performance of copper, the current industry benchmark. It also closely matches the coefficient of thermal expansion (CTE) of silicon, making it ideal for direct integration with semiconductor devices. \u201cDiamond remains unmatched in its ability to manage extreme thermal loads in electronics,\u201d said Steve Rummel, Senior Vice President of Engineered Materials at Coherent. \u201cOur patented diamond-SiC outperforms &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-860254","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"SAXONBURG, Pa., June 12, 2025 (GLOBE NEWSWIRE) &#8212; Coherent Corp. (NYSE: COHR), a global leader in engineered materials, today announces the release of a groundbreaking diamond-loaded silicon carbide (SiC) ceramic composite, designed to tackle the thermal challenges of advanced AI datacenters and high-performance computing (HPC) systems. The patented diamond-silicon carbide material from Coherent achieves isotropic thermal conductivity exceeding 800 W\/m-K, and delivers twice the performance of copper, the current industry benchmark. It also closely matches the coefficient of thermal expansion (CTE) of silicon, making it ideal for direct integration with semiconductor devices. \u201cDiamond remains unmatched in its ability to manage extreme thermal loads in electronics,\u201d said Steve Rummel, Senior Vice President of Engineered Materials at Coherent. \u201cOur patented diamond-SiC outperforms &hellip; Continue reading &quot;Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2025-06-12T20:38:10+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTQ2ODExNiM2OTg5MzI2IzIwMTY2NjY=\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing\",\"datePublished\":\"2025-06-12T20:38:10+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\\\/\"},\"wordCount\":341,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTQ2ODExNiM2OTg5MzI2IzIwMTY2NjY=\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\\\/\",\"name\":\"Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing - 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(NYSE: COHR), a global leader in engineered materials, today announces the release of a groundbreaking diamond-loaded silicon carbide (SiC) ceramic composite, designed to tackle the thermal challenges of advanced AI datacenters and high-performance computing (HPC) systems. The patented diamond-silicon carbide material from Coherent achieves isotropic thermal conductivity exceeding 800 W\/m-K, and delivers twice the performance of copper, the current industry benchmark. It also closely matches the coefficient of thermal expansion (CTE) of silicon, making it ideal for direct integration with semiconductor devices. \u201cDiamond remains unmatched in its ability to manage extreme thermal loads in electronics,\u201d said Steve Rummel, Senior Vice President of Engineered Materials at Coherent. \u201cOur patented diamond-SiC outperforms &hellip; Continue reading \"Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/","og_site_name":"Market Newsdesk","article_published_time":"2025-06-12T20:38:10+00:00","og_image":[{"url":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTQ2ODExNiM2OTg5MzI2IzIwMTY2NjY=","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing","datePublished":"2025-06-12T20:38:10+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/"},"wordCount":341,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/#primaryimage"},"thumbnailUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTQ2ODExNiM2OTg5MzI2IzIwMTY2NjY=","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/coherent-introduces-breakthrough-diamond-silicon-carbide-material-for-next-generation-thermal-management-in-ai-and-high-performance-computing\/","name":"Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing - 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