{"id":859330,"date":"2025-06-10T23:28:01","date_gmt":"2025-06-11T03:28:01","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/"},"modified":"2025-06-10T23:28:01","modified_gmt":"2025-06-11T03:28:01","slug":"nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/","title":{"rendered":"Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing"},"content":{"rendered":"<p>        <!--.bwlistdisc { list-style-type: disc }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p><b>Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing<\/b><\/p>\n<ul class=\"bwlistdisc\">\n<li><b>The ASYMTEK Vantage\u00ae Dispensing system<\/b><b>equipped with IntelliJet\u00ae Jetting system reduced underfill voids and decreased cycle time by almost 30%.<\/b><\/li>\n<\/ul>\n<p>CARLSBAD, Calif.&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=Nordson+Electronics+Solutions&amp;index=1&amp;md5=f1bed8c96c328682f70da635d9cc08b5\">Nordson Electronics Solutions<\/a>, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2FAbout-Us%2FNordson-Blog%2FElectronics-Solutions-Blogs%2FCustomer-Success-Scaling-Up-with-Panel-Level-Packaging&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=one+particular+case&amp;index=2&amp;md5=6f79924a234d98d1ca33d7a689cb2240\">one particular case<\/a>, Nordson\u2019s customer, <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.pti.com.tw%2F&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=Powertech+Technology%2C+Inc.+%28PTI%29&amp;index=3&amp;md5=e820e5c9e6d13cd59514abd93fc013e2\">Powertech Technology, Inc. (PTI)<\/a> saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2FAbout-Us%2FNordson-Blog%2FElectronics-Solutions-Blogs%2FCustomer-Success-Scaling-Up-with-Panel-Level-Packaging&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=Customer+Success%3A+Powertech+Technology+Inc.+%28PTI%29+Advances+Panel+Level+Packaging+with+Nordson&amp;index=4&amp;md5=4e97ee0454f1f562319cb594e957df87\">Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson<\/a>.<\/p>\n<p id=\"news-body-cta\">This press release features multimedia. View the full release here: <a href=\"https:\/\/www.businesswire.com\/news\/home\/20250610268999\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20250610268999\/en\/<\/a><\/p>\n<div id=\"bwbodyimg\" style=\"width: 480px;float:left;padding-left:0px;padding-right:20px;padding-top:0px;padding-bottom:0px\"><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20250610268999\/en\/2491231\/4\/Nordson-ASYMTEK-Vantage-System-PLP.jpg\" alt=\"Nordson\u2019s industry-leading ASYMTEK Vantage\u00ae Series fluid dispensing system equipped with the ASYMTEK IntelliJet\u00ae Jetting system is driving innovations for underfilling during semiconductor advanced packaging. Nordson worked with Powertech Technology, Inc. (PTI) to develop a panel-level packaging (PLP) solution that achieves yields greater than 99% for underfilling during semiconductor manufacturing. PTI is enabling PLP applications that are designed to meet the semiconductor industry\u2019s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures. PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency in the transition from 300-mm wafers to panels.\" \/><\/p>\n<p style=\"font-size:85%\">Nordson\u2019s industry-leading ASYMTEK Vantage\u00ae Series fluid dispensing system equipped with the ASYMTEK IntelliJet\u00ae Jetting system is driving innovations for underfilling during semiconductor advanced packaging. Nordson worked with Powertech Technology, Inc. (PTI) to develop a panel-level packaging (PLP) solution that achieves yields greater than 99% for underfilling during semiconductor manufacturing. PTI is enabling PLP applications that are designed to meet the semiconductor industry\u2019s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures. PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency in the transition from 300-mm wafers to panels.<\/p>\n<\/div>\n<p>\nPTI, one of the world\u2019s top OSAT (Outsourced Semiconductor Assembly and Test) companies, worked with the Nordson applications team to set up a comprehensive PLP demonstration that achieved high-quality, void-free underfill results at scale, using the industry-leading ASYMTEK <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2FProducts%2FElectronics-Solutions-Products%2FASYMTEK-Vantage-Series-Next-Generation-Fluid-Dispensing-Capabilities&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=Vantage%26%23174%3B+Series&amp;index=5&amp;md5=44b4568d11dae864e50f9c72fcd842b8\">Vantage\u00ae Series<\/a> fluid dispensing system, equipped with the ASYMTEK <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fproducts%2Felectronics-solutions-products%2Fasymtek-intellijet-jetting-system-with-readiset-jet-cartridge&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=IntelliJet%26%23174%3B+Jetting+system&amp;index=6&amp;md5=f0cb49886432126130a6f373fe3f869d\">IntelliJet\u00ae Jetting system<\/a>. Nordson\u2019s precision technology mitigated warpage and optimized fluid flow while decreasing cycle time by almost 30%.<\/p>\n<p>\nPLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency as the semiconductor industry transitions from 300-mm wafers to panels. PTI is enabling PLP applications that are designed to meet the semiconductor industry\u2019s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures.<\/p>\n<p>\nUnderfill has been pivotal in <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions%2Fyour-process%2Findustries%2Fsemiconductor-packaging&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=semiconductor+packaging&amp;index=7&amp;md5=dcee253e2452c6221c5def99699ccd82\">semiconductor packaging<\/a> since the adoption of flip-chips in the 1990s. As applications have become more demanding, particularly in high-performance CPUs, GPUs, and advanced architectures like flip-chip and 2.5D\/3D ICs, the importance of underfilling to enhance mechanical reliability and thermal performance has grown. Since the beginning, Nordson developed innovations for underfill processes as the industry evolved from PC board, substrate, wafer, and now panel applications.<\/p>\n<p>\nNordson\u2019s distributor, Jetinn Global Equipment Ltd., supported the advancements discussed in this case study by investing in demonstration equipment and providing expert technical support.<\/p>\n<p><strong>About Nordson Electronics Solutions<\/strong><\/p>\n<p><a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=Nordson+Electronics+Solutions&amp;index=8&amp;md5=15c926faa9127152400afd3cc7387f3c\">Nordson Electronics Solutions<\/a> makes reliable electronics a reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world&#8217;s semiconductor, electronics, and precision assembly manufacturers with the innovative <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions%2Ffluid-dispensing&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=fluid+dispensing&amp;index=9&amp;md5=5746ca8c602bb3f5e746b2d2b8e20c12\">fluid dispensing<\/a>, <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions%2Fconformal-coating&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=conformal+coating&amp;index=10&amp;md5=c5a30e4ea29e7906a9fa7f75ca547a97\">conformal coating<\/a>, <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions%2Fplasma-applications&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=plasma+treatment&amp;index=11&amp;md5=c3ea632077cc75b0d24c85452aeeb9c2\">plasma treatment<\/a>, and <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.nordson.com%2Fen%2Fdivisions%2Felectronics-solutions%2Fselect-soldering&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=selective+soldering&amp;index=12&amp;md5=58afd5e4520e40c5763f9a5328d56374\">selective soldering<\/a> solutions their products need to protect sensitive electronics and deliver a lifespan of reliability. Day after day, year after year, across the globe, for over 40 years, we&#8217;ve provided engineering and applications excellence to help our customers succeed.<\/p>\n<p><b>About Nordson Corporation<\/b><\/p>\n<p>\nNordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company\u2019s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end-market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.nordson.com&amp;esheet=54270140&amp;newsitemid=20250610268999&amp;lan=en-US&amp;anchor=www.nordson.com&amp;index=13&amp;md5=ca8688c25e5a4c7e6865eab96eae008d\">www.nordson.com<\/a>.<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20250610268999r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20250610268999\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20250610268999\/en\/<\/a><\/span><\/p>\n<p>\nFor information:<br \/>\n<br \/>MAIN OFFICE:<br \/>\n<br \/>Roberta Foster-Smith<br \/>\n<br \/>Nordson Electronics Solutions<br \/>\n<br \/>2762 Loker Ave West<br \/>\n<br \/>Carlsbad, CA, USA 92010<br \/>\n<br \/>Tel: +1.760.431.1919<br \/>\n<br \/>Email: <a rel=\"nofollow\" href=\"mailto:roberta.foster-smith@nordson.com\">roberta.foster-smith@nordson.com<\/a><\/p>\n<p>\nIN CHINA:<br \/>\n<br \/>Izzie Liu<br \/>\n<br \/>Nordson Electronics Solutions \u2013 China<br \/>\n<br \/># 137 Guoshoujing Road<br \/>\n<br \/>Zhangjiang Hi-Tech Park<br \/>\n<br \/>Pudong, Shanghai China 201203<br \/>\n<br \/>Tel: +86.21.3866.9166<br \/>\n<br \/>Email: <a rel=\"nofollow\" href=\"mailto:Info-electronics@nordson.com\">Info-electronics@nordson.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> California China United States North America Asia Pacific<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Hardware Machinery Packaging Engineering Consumer Electronics Technology Semiconductor Manufacturing<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Photo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20250610268999\/en\/2491231\/3\/Nordson-ASYMTEK-Vantage-System-PLP.jpg\" alt=\"Photo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\">Nordson\u2019s industry-leading ASYMTEK Vantage\u00ae Series fluid dispensing system equipped with the ASYMTEK IntelliJet\u00ae Jetting system is driving innovations for underfilling during semiconductor advanced packaging. Nordson worked with Powertech Technology, Inc. (PTI) to develop a panel-level packaging (PLP) solution that achieves yields greater than 99% for underfilling during semiconductor manufacturing. PTI is enabling PLP applications that are designed to meet the semiconductor industry\u2019s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures. PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency in the transition from 300-mm wafers to panels.<\/font><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20250610268999\/en\/2491239\/3\/Nordson_ElectronicsSolutions_ComboHorizontalLogo_rgb.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing The ASYMTEK Vantage\u00ae Dispensing systemequipped with IntelliJet\u00ae Jetting system reduced underfill voids and decreased cycle time by almost 30%. CARLSBAD, Calif.&#8211;(BUSINESS WIRE)&#8211;Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson\u2019s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-859330","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing The ASYMTEK Vantage\u00ae Dispensing systemequipped with IntelliJet\u00ae Jetting system reduced underfill voids and decreased cycle time by almost 30%. CARLSBAD, Calif.&#8211;(BUSINESS WIRE)&#8211;Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson\u2019s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. 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Market Newsdesk\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/mms.businesswire.com\\\/media\\\/20250610268999\\\/en\\\/2491231\\\/4\\\/Nordson-ASYMTEK-Vantage-System-PLP.jpg\",\"datePublished\":\"2025-06-11T03:28:01+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\\\/#primaryimage\",\"url\":\"https:\\\/\\\/mms.businesswire.com\\\/media\\\/20250610268999\\\/en\\\/2491231\\\/4\\\/Nordson-ASYMTEK-Vantage-System-PLP.jpg\",\"contentUrl\":\"https:\\\/\\\/mms.businesswire.com\\\/media\\\/20250610268999\\\/en\\\/2491231\\\/4\\\/Nordson-ASYMTEK-Vantage-System-PLP.jpg\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#website\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/\",\"name\":\"Market Newsdesk\",\"description\":\"Latest Business News in Real Time\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\",\"name\":\"Newsdesk\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g\",\"caption\":\"Newsdesk\"},\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/author\\\/newsdesk\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing - Market Newsdesk","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/","og_locale":"en_US","og_type":"article","og_title":"Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing - Market Newsdesk","og_description":"Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing The ASYMTEK Vantage\u00ae Dispensing systemequipped with IntelliJet\u00ae Jetting system reduced underfill voids and decreased cycle time by almost 30%. CARLSBAD, Calif.&#8211;(BUSINESS WIRE)&#8211;Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson\u2019s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel &hellip; Continue reading \"Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/","og_site_name":"Market Newsdesk","article_published_time":"2025-06-11T03:28:01+00:00","og_image":[{"url":"https:\/\/mms.businesswire.com\/media\/20250610268999\/en\/2491231\/4\/Nordson-ASYMTEK-Vantage-System-PLP.jpg","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"4 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing","datePublished":"2025-06-11T03:28:01+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/"},"wordCount":834,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/#primaryimage"},"thumbnailUrl":"https:\/\/mms.businesswire.com\/media\/20250610268999\/en\/2491231\/4\/Nordson-ASYMTEK-Vantage-System-PLP.jpg","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/","name":"Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing - Market Newsdesk","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/#primaryimage"},"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/#primaryimage"},"thumbnailUrl":"https:\/\/mms.businesswire.com\/media\/20250610268999\/en\/2491231\/4\/Nordson-ASYMTEK-Vantage-System-PLP.jpg","datePublished":"2025-06-11T03:28:01+00:00","author":{"@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"breadcrumb":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/#primaryimage","url":"https:\/\/mms.businesswire.com\/media\/20250610268999\/en\/2491231\/4\/Nordson-ASYMTEK-Vantage-System-PLP.jpg","contentUrl":"https:\/\/mms.businesswire.com\/media\/20250610268999\/en\/2491231\/4\/Nordson-ASYMTEK-Vantage-System-PLP.jpg"},{"@type":"BreadcrumbList","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nordson-electronics-solutions-develops-panel-level-packaging-solution-for-powertech-technology-inc-that-achieves-yields-greater-than-99-for-underfilling-during-semiconductor-manufacturing\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.marketnewsdesk.com\/"},{"@type":"ListItem","position":2,"name":"Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing"}]},{"@type":"WebSite","@id":"https:\/\/www.marketnewsdesk.com\/#website","url":"https:\/\/www.marketnewsdesk.com\/","name":"Market Newsdesk","description":"Latest Business News in Real Time","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.marketnewsdesk.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Person","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979","name":"Newsdesk","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/a0d0bd5b0f0ca12a265a459b13169dac35f33776d8501eda5e68844a366f2f46?s=96&d=mm&r=g","caption":"Newsdesk"},"url":"https:\/\/www.marketnewsdesk.com\/index.php\/author\/newsdesk\/"}]}},"_links":{"self":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts\/859330","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/comments?post=859330"}],"version-history":[{"count":0,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/posts\/859330\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/media?parent=859330"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/categories?post=859330"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.marketnewsdesk.com\/index.php\/wp-json\/wp\/v2\/tags?post=859330"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}