{"id":853614,"date":"2025-05-22T07:04:02","date_gmt":"2025-05-22T11:04:02","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-joins-arpa-e-coolerchips-project-to-advance-hybrid-cooling-technologies-for-the-data-center-of-the-future\/"},"modified":"2025-05-22T07:04:02","modified_gmt":"2025-05-22T11:04:02","slug":"accelsius-joins-arpa-e-coolerchips-project-to-advance-hybrid-cooling-technologies-for-the-data-center-of-the-future","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-joins-arpa-e-coolerchips-project-to-advance-hybrid-cooling-technologies-for-the-data-center-of-the-future\/","title":{"rendered":"Accelsius Joins ARPA-E COOLERCHIPS Project to Advance Hybrid Cooling Technologies for the Data Center of the Future"},"content":{"rendered":"

<\/p>\n

Accelsius Joins ARPA-E COOLERCHIPS Project to Advance Hybrid Cooling Technologies for the Data Center of the Future<\/b><\/p>\n

AUSTIN, Texas–(BUSINESS WIRE<\/a>)–Accelsius<\/a>, a leader in two-phase, direct-to-chip liquid cooling, has been selected as a key contributor to a U.S. Department of Energy (DOE) ARPA-E COOLERCHIPS project led by Professor Dereje Agonafer, a Presidential Distinguished Professor and Member of the National Academy of Engineering, at The University of Texas at Arlington. The project, \u201cHolistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future,\u201d<\/i> will develop a next-generation hybrid architecture that combines direct-to-chip evaporative cooling with air-based solutions such as rear door heat exchangers.\n<\/p>\n

\nAccelsius will support system-level testing by providing its proprietary MR250, a multi-rack, in-row, 250kW two-phase Coolant Distribution Unit (2P CDU), along with comprehensive integration support. The MR250 will be incorporated into the project\u2019s test infrastructure at the UT Arlington campus, with general availability planned for late 2025.\n<\/p>\n

\n\u201cThe addition of Accelsius technology to our lab and project will improve our understanding and benchmarking of two-phase, direct-to-chip cooling as a practical and scalable option for growing rack densities,\u201d said Professor Agonafer. \u201cWe invite anyone attending the upcoming ITherm event to join us at the lab for an in-person tour and deeper understanding of the project and technologies involved.\u201d\n<\/p>\n

\nThe COOLERCHIPS (Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems<\/i>) program aims to transform how high-density data centers are cooled. The goal is to reduce total cooling energy consumption to less than 5% of a data center\u2019s IT load\u2014while maintaining reliability and enabling next-generation high-density compute.\n<\/p>\n

\n\u201cIt\u2019s great to see leaders like Dereje Agonafer and Richard Bonner working together to shape the future of two-phase cooling technology,\u201d said Peter de Bock, program director at ARPA-E. \u201cAccelsius and The University of Texas at Arlington are advancing important work under the COOLERCHIPS program, and I\u2019m excited to see the impact this collaboration will have on US leadership in next-generation data center efficiency.\u201d\n<\/p>\n

\n\u201cIt\u2019s an exciting opportunity to collaborate with fellow thermal experts from across the industry,\u201d said Dr. Richard Bonner, chief technology officer at Accelsius. \u201cThis project provides a bigger stage to showcase the meaningful advancements we\u2019ve made in two-phase cooling and to push the envelope on what\u2019s possible for future data center efficiency.\u201d\n<\/p>\n

For information on touring the UT Arlington lab during ITherm, please contact: lcruz@accelsius.com<\/a><\/b><\/p>\n

About Accelsius<\/b><\/p>\n

\nFounded by Innventure, Inc. (NASDAQ:INV), Accelsius empowers data center and edge operators to achieve their business, financial and sustainability goals through advanced cooling solutions. The proprietary NeuCool platform provides best-in-class thermal efficiencies through a safe, two-phase liquid cooling system that scales from single racks to entire data centers. For more information, visit accelsius.com<\/a> or follow us on LinkedIn<\/a>.\n<\/p>\n

\"\"<\/p>\n

View source version on businesswire.com: <\/span>https:\/\/www.businesswire.com\/news\/home\/20250522828213\/en\/<\/a><\/span><\/p>\n

Media Contact
\n
<\/b>Treble
\n
<\/a>McKenzie Covell
\n
accelsius@treblepr.com<\/a><\/p>\n

KEYWORDS:<\/b> United States North America Texas<\/p>\n

INDUSTRY KEYWORDS:<\/b> Networks Internet Machinery Hardware Electronic Design Automation Data Management Consumer Electronics Technology HVAC Engineering Other Technology Manufacturing<\/p>\n

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Accelsius Joins ARPA-E COOLERCHIPS Project to Advance Hybrid Cooling Technologies for the Data Center of the Future AUSTIN, Texas–(BUSINESS WIRE)–Accelsius, a leader in two-phase, direct-to-chip liquid cooling, has been selected as a key contributor to a U.S. Department of Energy (DOE) ARPA-E COOLERCHIPS project led by Professor Dereje Agonafer, a Presidential Distinguished Professor and Member of the National Academy of Engineering, at The University of Texas at Arlington. The project, \u201cHolistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future,\u201d will develop a next-generation hybrid architecture that combines direct-to-chip evaporative cooling with air-based solutions such as rear door heat exchangers. Accelsius will support system-level testing by providing its proprietary MR250, a multi-rack, in-row, 250kW two-phase Coolant … <\/p>\n

Continue reading “Accelsius Joins ARPA-E COOLERCHIPS Project to Advance Hybrid Cooling Technologies for the Data Center of the Future”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-853614","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nAccelsius Joins ARPA-E COOLERCHIPS Project to Advance Hybrid Cooling Technologies for the Data Center of the Future - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-joins-arpa-e-coolerchips-project-to-advance-hybrid-cooling-technologies-for-the-data-center-of-the-future\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Accelsius Joins ARPA-E COOLERCHIPS Project to Advance Hybrid Cooling Technologies for the Data Center of the Future - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Accelsius Joins ARPA-E COOLERCHIPS Project to Advance Hybrid Cooling Technologies for the Data Center of the Future AUSTIN, Texas–(BUSINESS WIRE)–Accelsius, a leader in two-phase, direct-to-chip liquid cooling, has been selected as a key contributor to a U.S. Department of Energy (DOE) ARPA-E COOLERCHIPS project led by Professor Dereje Agonafer, a Presidential Distinguished Professor and Member of the National Academy of Engineering, at The University of Texas at Arlington. 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