{"id":843590,"date":"2025-04-29T13:03:03","date_gmt":"2025-04-29T17:03:03","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\/"},"modified":"2025-04-29T13:03:03","modified_gmt":"2025-04-29T17:03:03","slug":"keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\/","title":{"rendered":"Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions"},"content":{"rendered":"<p>        <!--.bwlistdisc { list-style-type: disc }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p><b>Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions<\/b><\/p>\n<ul class=\"bwlistdisc\">\n<li>\nSupports latest interconnect standards, including Universal Chiplet Interconnect Express\u2122 2.0 and Open Compute Project Bunch of Wires, for improved design flexibility\n<\/li>\n<li>\nEnhances Keysight\u2019s EDA standards-based approach, enabling high-speed digital chiplet design and supporting EMIB-T tailored for AI and data center markets\n<\/li>\n<\/ul>\n<p>SANTA ROSA, Calif.&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.keysight.com&amp;esheet=54245431&amp;newsitemid=20250429400385&amp;lan=en-US&amp;anchor=Keysight+Technologies%2C+Inc.&amp;index=1&amp;md5=80bc6e3945d35108126561cae9e09e4d\">Keysight Technologies, Inc.<\/a> (NYSE: KEYS) announced today a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node.\n<\/p>\n<p id=\"news-body-cta\">This press release features multimedia. View the full release here: <a href=\"https:\/\/www.businesswire.com\/news\/home\/20250429400385\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20250429400385\/en\/<\/a><\/p>\n<div id=\"bwbodyimg\" style=\"width: 480px;float:left;padding-left:0px;padding-right:20px;padding-top:0px;padding-bottom:0px\"><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20250429400385\/en\/2452469\/4\/Intel_Foundry.jpg\" alt=\"Chiplet PHY Designer provides engineers with an intuitive and integrated chiplet system analysis environment.\" \/><\/p>\n<p style=\"font-size:85%\">Chiplet PHY Designer provides engineers with an intuitive and integrated chiplet system analysis environment.<\/p>\n<\/div>\n<p>\nAs the demands of AI and data center workloads continue to grow in complexity, ensuring reliable communication between chiplets and 3DICs is becoming increasingly critical. High-speed data transfer and efficient power delivery are essential to meet the performance demands of next-generation semiconductor applications. The semiconductor industry addresses these challenges through emerging open standards, such as <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.uciexpress.org%2Fwhy-choose-us&amp;esheet=54245431&amp;newsitemid=20250429400385&amp;lan=en-US&amp;anchor=Universal+Chiplet+Interconnect+Express&amp;index=2&amp;md5=2490f3dec1a5e6dbb215b5d24575f933\">Universal Chiplet Interconnect Express<\/a>\u2122 (UCIe\u2122) and <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fopencomputeproject.github.io%2FODSA-BoW%2Fbow_specification.html&amp;esheet=54245431&amp;newsitemid=20250429400385&amp;lan=en-US&amp;anchor=Bunch+of+Wires&amp;index=3&amp;md5=1605836e98a41257105c5bb5dd878a5a\">Bunch of Wires<\/a> (BoW). These standards define interconnect protocols for chiplets and 3DICs within advanced 2.5D\/3D or laminate\/organic packages, enabling consistent, high-quality integration across different design platforms.\n<\/p>\n<p>\nBy adopting these standards and verifying chiplets for compliance and link margin, Keysight EDA and Intel Foundry contribute to a growing chiplet interoperability ecosystem. The collaboration aims to reduce development costs, mitigate risk, and accelerate innovation in semiconductor design.\n<\/p>\n<p>\nKeysight EDA\u2019s <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.keysight.com%2Fus%2Fen%2Flib%2Fresources%2Fsoftware-releases%2Fwhats-new-in-high-speed-digital.html&amp;esheet=54245431&amp;newsitemid=20250429400385&amp;lan=en-US&amp;anchor=Chiplet+PHY+Designer%2C&amp;index=4&amp;md5=cb64fdb3b746ff51d779f270dd73b9ec\">Chiplet PHY Designer,<\/a> the latest solution for high-speed digital chiplet design tailored to AI and data center applications, now offers advanced simulation capabilities for the UCIe\u2122 2.0 standard and introduces support for the Open Computer Project BoW standard. As an advanced, system-level chiplet design and die-to-die (D2D) design solution, Chiplet PHY Designer enables pre-silicon level validation, streamlining the path to tapeout.\n<\/p>\n<p><b>Suk Lee, VP &amp; GM of Ecosystem Technology Office, Intel Foundry, said:<\/b> \u201cOur collaboration with Keysight EDA on EMIB-T silicon bridge technology is a pivotal step in advancing high-performance packaging solutions. By integrating standards like UCIe\u2122 2.0, we enhance chiplet design flexibility for AI and data center applications, accelerating innovation and ensuring our customers meet next-generation demands with precision.\u201d\n<\/p>\n<p><b>Niels Fach\u00e9, Vice President and General Manager, Keysight\u2019s Design Engineering Software, said:<\/b> &#8220;Keysight EDA&#8217;s pioneering Chiplet PHY Designer continues to redefine pre-silicon validation, empowering chiplet designers with rapid, accurate verification. By proactively embracing evolving standards like UCIe 2.0 and BoW, and now with critical support for Intel Foundry\u2019s EMIB-T, we&#8217;re enabling engineers to accelerate innovation and eliminate costly design iterations before manufacturing.&#8221;\n<\/p>\n<p><b>See Keysight EDA EMIB-T Solution at Intel Foundry Direct Connect<\/b><\/p>\n<p>\nKeysight will demonstrate its EMIB-T workflow for system-level link performance and compliance, featuring Intel Foundry\u2019s EMIB-T technology, at Intel Foundry Direct Connect on April 29th in San Jose.\n<\/p>\n<p><b>Resources:<\/b><\/p>\n<ul class=\"bwlistdisc\">\n<li><a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.keysight.com%2Fus%2Fen%2Fproduct%2FW3650B%2Fchiplet-phy-designer.html&amp;esheet=54245431&amp;newsitemid=20250429400385&amp;lan=en-US&amp;anchor=Chiplet+PHY+Designer&amp;index=5&amp;md5=bff5b416350e074be5c15ff54c8d74b6\">Chiplet PHY Designer<\/a><\/li>\n<\/ul>\n<p><b>About Keysight Technologies<\/b><\/p>\n<p>\nAt Keysight (NYSE: KEYS), we inspire and empower innovators to bring world-changing technologies to life. As an S&amp;P 500 company, we deliver market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product life cycle. We\u2019re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world. Learn more at Keysight Newsroom and <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.keysight.com&amp;esheet=54245431&amp;newsitemid=20250429400385&amp;lan=en-US&amp;anchor=www.keysight.com&amp;index=6&amp;md5=62666964a4c882bded64f89dbbf82fe9\">www.keysight.com<\/a>.\n<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20250429400385r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20250429400385\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20250429400385\/en\/<\/a><\/span><\/p>\n<p><b>Keysight Media Contacts<\/b><\/p>\n<p>\nAndrea Mueller<br \/>\n<br \/>Americas<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:Andrea.mueller@keysight.com\">Andrea.mueller@keysight.com<\/a><\/p>\n<p>\nFusako Dohi<br \/>\n<br \/>Asia<br \/>\n<br \/>+81 42 660-2162<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:fusako_dohi@keysight.com\">fusako_dohi@keysight.com<\/a><\/p>\n<p>\nJenny Gallacher<br \/>\n<br \/>Europe<br \/>\n<br \/>+44 (0) 7800 737 982<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:jenny.gallacher@keysight.com\">jenny.gallacher@keysight.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> United States North America California<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Technology Telecommunications Software Networks Internet Hardware Electronic Design Automation Data Management Consumer Electronics Artificial Intelligence<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Photo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20250429400385\/en\/2452469\/3\/Intel_Foundry.jpg\" alt=\"Photo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\">Chiplet PHY Designer provides engineers with an intuitive and integrated chiplet system analysis environment.<\/font><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20250429400385\/en\/1598280\/3\/BrandRefreshKeysightLogo_Business_Wire.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions Supports latest interconnect standards, including Universal Chiplet Interconnect Express\u2122 2.0 and Open Compute Project Bunch of Wires, for improved design flexibility Enhances Keysight\u2019s EDA standards-based approach, enabling high-speed digital chiplet design and supporting EMIB-T tailored for AI and data center markets SANTA ROSA, Calif.&#8211;(BUSINESS WIRE)&#8211;Keysight Technologies, Inc. (NYSE: KEYS) announced today a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20250429400385\/en\/ &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-843590","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions Supports latest interconnect standards, including Universal Chiplet Interconnect Express\u2122 2.0 and Open Compute Project Bunch of Wires, for improved design flexibility Enhances Keysight\u2019s EDA standards-based approach, enabling high-speed digital chiplet design and supporting EMIB-T tailored for AI and data center markets SANTA ROSA, Calif.&#8211;(BUSINESS WIRE)&#8211;Keysight Technologies, Inc. (NYSE: KEYS) announced today a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20250429400385\/en\/ &hellip; Continue reading &quot;Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2025-04-29T17:03:03+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/mms.businesswire.com\/media\/20250429400385\/en\/2452469\/4\/Intel_Foundry.jpg\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions\",\"datePublished\":\"2025-04-29T17:03:03+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\\\/\"},\"wordCount\":683,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/mms.businesswire.com\\\/media\\\/20250429400385\\\/en\\\/2452469\\\/4\\\/Intel_Foundry.jpg\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\\\/\",\"name\":\"Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions - 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Market Newsdesk","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.marketnewsdesk.com\/index.php\/keysight-eda-and-intel-foundry-collaborate-on-emib-t-silicon-bridge-technology-for-next-generation-ai-and-data-center-solutions\/","og_locale":"en_US","og_type":"article","og_title":"Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions - Market Newsdesk","og_description":"Keysight EDA and Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions Supports latest interconnect standards, including Universal Chiplet Interconnect Express\u2122 2.0 and Open Compute Project Bunch of Wires, for improved design flexibility Enhances Keysight\u2019s EDA standards-based approach, enabling high-speed digital chiplet design and supporting EMIB-T tailored for AI and data center markets SANTA ROSA, Calif.&#8211;(BUSINESS WIRE)&#8211;Keysight Technologies, Inc. (NYSE: KEYS) announced today a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node. This press release features multimedia. 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