{"id":837169,"date":"2025-04-14T16:49:34","date_gmt":"2025-04-14T20:49:34","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-announces-a-strategic-investment-in-be-semiconductor-industries\/"},"modified":"2025-04-14T16:49:34","modified_gmt":"2025-04-14T20:49:34","slug":"applied-materials-announces-a-strategic-investment-in-be-semiconductor-industries","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-announces-a-strategic-investment-in-be-semiconductor-industries\/","title":{"rendered":"Applied Materials Announces a Strategic Investment in BE Semiconductor Industries"},"content":{"rendered":"<h2>\nPurchased 9 percent of outstanding shares to build upon four years of successful collaboration on hybrid bonding technology for advanced packaging<br \/>\n<\/h2>\n<div class=\"mw_release\">\n<p align=\"left\">SANTA CLARA, Calif., April  14, 2025  (GLOBE NEWSWIRE) &#8212; Applied Materials, Inc. today announced it has purchased 9 percent of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry.<\/p>\n<p>Applied and Besi have been successfully collaborating since 2020, and recently extended their agreement, to co-develop the industry\u2019s first fully integrated equipment solution for die-based hybrid bonding. Hybrid bonding is becoming a critical technology for advanced packaging of semiconductors as designers and manufacturers race to develop more energy-efficient chips. Hybrid bonding connects chips using direct copper-to-copper bonds, which increases density and shortens the lengths of interconnect wiring between chiplets, resulting in improved overall performance, power consumption and cost.<\/p>\n<p>\u201cWe view this as a strategic, long-term investment that demonstrates Applied Materials\u2019 commitment to co-developing the industry\u2019s most capable hybrid bonding solution, a technology that is becoming increasingly important to the advanced logic and memory chips at the foundation of AI,\u201d said Terry Lee, Corporate Vice President and General Manager, Heterogeneous Integration and Packaging at Applied Materials. \u201cWe look forward to furthering our collaboration with Besi and delivering innovative technology to our customers.\u201d<\/p>\n<p>Applied Materials and Besi have co-developed an integrated hybrid bonding system, which has the full capabilities chipmakers need to take the technology to very high-volume manufacturing over the next several years. The system brings together Applied\u2019s expertise in front-end wafer and chip processing with high levels of bonding accuracy and speed from Besi\u2019s leading die placement, interconnect and assembly solutions.<\/p>\n<p>The investment was made through market-based transactions and is not subject to regulatory approvals. Applied does not intend to seek board representation at Besi, nor does it have plans to purchase additional shares of Besi common stock.<\/p>\n<p>\n        <strong>About Applied Materials<\/strong><br \/>\n        <br \/>Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible a better future. Learn more at <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=J5u3HK67E0ovvH-8hLspoEjnBy0vw5FW2UIyIXuN34gWLLDe4qLGsAXoqTItIMmVNeXyDx3EI1kpZtx2XdbUe_Zuzq6cAqlPYXfgMy1dAyJ6lP1Zn4lY4WayrChgqepd\" rel=\"nofollow\" target=\"_blank\">www.appliedmaterials.com<\/a>.<\/p>\n<p>\n        <strong>Applied Materials Contact:<\/strong><br \/>\n        <br \/>\n        <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=4eqIQHHbbNhdHsmQrxfOaIY9XoyauciPvPiKPWLaW5nGxNVg5EOmQA0nkdEje7tlcFaK0K4N0jmPkghZtDDQ2hSGqcBM3DamXz9v1hQ5mrk=\" rel=\"nofollow\" target=\"_blank\">Ricky Gradwohl<\/a> (editorial\/media) 408.235.4676<br \/><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=4Y-pLZE9M2Q5Wz8vGVG7TjVgEqBPJ8a21eAzT7LeeiZa2xaABrKnfH9lv2hz3O7y_w14GU_uRXCwcYESA2zmJVkD6mtW5_fjoAJekQo3fUI=\" rel=\"nofollow\" target=\"_blank\">Liz Morali<\/a> (financial community) 408.986.7977<\/p>\n<p>      <img decoding=\"async\" alt=\"\" class=\"__GNW8366DE3E__IMG\" src=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTQyMjI2MiM2ODY1ODA5IzIwMDcxNDQ=\" \/><br \/>\n      <br \/>\n      <img decoding=\"async\" alt=\"\" src=\"https:\/\/ml.globenewswire.com\/media\/Y2U4NWM1MzAtNWRmNi00NTVlLWJiMTktNTBiMWRiYzg4YmJhLTEwMTg3MTctMjAyNS0wNC0xNC1lbg==\/tiny\/Applied-Materials-Inc-.png\" \/>\n    <\/div>\n<div class=\"mw_contactinfo\"><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Purchased 9 percent of outstanding shares to build upon four years of successful collaboration on hybrid bonding technology for advanced packaging SANTA CLARA, Calif., April 14, 2025 (GLOBE NEWSWIRE) &#8212; Applied Materials, Inc. today announced it has purchased 9 percent of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry. Applied and Besi have been successfully collaborating since 2020, and recently extended their agreement, to co-develop the industry\u2019s first fully integrated equipment solution for die-based hybrid bonding. Hybrid bonding is becoming a critical technology for advanced packaging of semiconductors as designers and manufacturers race to develop more energy-efficient chips. Hybrid bonding connects chips using direct copper-to-copper &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-announces-a-strategic-investment-in-be-semiconductor-industries\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Applied Materials Announces a Strategic Investment in BE Semiconductor Industries&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-837169","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.6 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Applied Materials Announces a Strategic Investment in BE Semiconductor Industries - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/applied-materials-announces-a-strategic-investment-in-be-semiconductor-industries\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Applied Materials Announces a Strategic Investment in BE Semiconductor Industries - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Purchased 9 percent of outstanding shares to build upon four years of successful collaboration on hybrid bonding technology for advanced packaging SANTA CLARA, Calif., April 14, 2025 (GLOBE NEWSWIRE) &#8212; Applied Materials, Inc. today announced it has purchased 9 percent of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry. Applied and Besi have been successfully collaborating since 2020, and recently extended their agreement, to co-develop the industry\u2019s first fully integrated equipment solution for die-based hybrid bonding. Hybrid bonding is becoming a critical technology for advanced packaging of semiconductors as designers and manufacturers race to develop more energy-efficient chips. 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