{"id":835945,"date":"2025-04-10T07:44:41","date_gmt":"2025-04-10T11:44:41","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/"},"modified":"2025-04-10T07:44:41","modified_gmt":"2025-04-10T11:44:41","slug":"accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/","title":{"rendered":"Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }\n.bwlistdisc { list-style-type: disc }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b>Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing<\/b><\/p>\n<ul class=\"bwlistdisc\">\n<li>\nSuccessfully tested NeuCool technology at 4,500W per GPU socket\u2014the highest in the industry for direct-to-chip liquid cooling\n<\/li>\n<li>\nDemonstrated the highest cooling capacity two-phase CDU on the market, supporting a full 250kW AI server rack while maintaining GPU temperatures below thermal limits even with 40\u00b0C facility water\n<\/li>\n<li>\nAccelsius will showcase these capabilities at Data Center World in Washington, DC (Booth #524), and present innovative cold-plate research for vertically oriented servers at the OCP EMEA Summit in Dublin\n<\/li>\n<\/ul>\n<p>AUSTIN, Texas&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Faccelsius.com%2F&amp;esheet=54236181&amp;newsitemid=20250410459051&amp;lan=en-US&amp;anchor=Accelsius&amp;index=1&amp;md5=ed258ebcf9d6427976dc1804f8b6c8db\">Accelsius<\/a>, a leader in advanced liquid cooling technologies, announced two major thermal testing milestones today, demonstrating the unmatched performance and scalability of its proprietary two-phase, direct-to-chip NeuCool\u2122 solution. These breakthroughs address critical cooling challenges for next-generation AI infrastructure and support sustainability goals through significant energy efficiency improvements.\n<\/p>\n<p>\nIn preparation for the next wave of ultra-high-power GPUs, Accelsius tested a thermal test vehicle representative of a GPU socket. In the experiment, the cold plate was heated to 4,500W before reaching the power limit of the test infrastructure, not the cooling system. Cold-plate temperatures remained stable and within operational limits even at these unprecedented loads. This represents the highest cooling capacity achieved in the industry for direct-to-chip liquid cooling, proving NeuCool has the thermal headroom to support multiple upcoming generations of processors.\n<\/p>\n<p>\nIn a second test, Accelsius successfully demonstrated the ability of its in-row two-phase CDU to cool a full 250kW rack of AI servers. A four-way H100 server was retrofitted with two-phase cold plates directly contacting the switches, CPUs and GPUs, and then installed in a densely configured 250kW rack.\n<\/p>\n<p>\nThe CDU was subjected to facility water (PG25) at 20\u00b0C, 30\u00b0C and 40\u00b0C, and 375 liters per minute of flow. Even under maximum rack load and using 40\u00b0C inlet temperatures, the junction temperature of the hottest GPU remained below NVIDIA\u2019s thermal throttle limit (~87\u00b0C), highlighting the flexibility and efficiency of two-phase cooling even in warm-water environments.\n<\/p>\n<p>\nThe ability to operate with facility water 6-8\u00b0C higher than competing solutions can translate to over 25% cooling energy savings while enabling more free cooling hours, depending on the local climate. An extensive thermal margin was observed at lower facility water temperatures, signaling the solution&#8217;s scalability to future chip, server and rack architectures.\n<\/p>\n<p>\n\u201cWe\u2019re showing customers that we can easily meet current performance requirements and scale our performance to meet the needs of the recently announced 600kW racks,\u201d said Dr. Richard Bonner, chief technical officer at Accelsius. \u201cOur R&amp;D team has also prepared us for rapidly evolving chip and server architectures, such as 4,500W TDP sockets and vertically oriented blade servers.\u201d\n<\/p>\n<p>\nAccelsius will be on the show floor at Data Center World in Washington, DC, from April 15\u201317 (Booth #524), where team members will share additional insights from these test campaigns and help data center operators evaluate the path forward for AI, HPC and sustainable thermal management.\n<\/p>\n<p>\nAccelsius will also present innovative cold-plate research at the OCP EMEA Summit\u2019s Future Technologies Symposium in Dublin, Ireland, on April 29. The research demonstrates the ability to cool vertically oriented servers, critical to the requirements of next-generation NVIDIA Kyber racks.\n<\/p>\n<p>\nTo learn more about Accelsius\u2019 NeuCool two-phase direct-to-chip in-rack liquid cooling solution, email <a rel=\"nofollow\" href=\"mailto:info@accelsius.com\">info@accelsius.com<\/a> or visit <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Faccelsius.com&amp;esheet=54236181&amp;newsitemid=20250410459051&amp;lan=en-US&amp;anchor=accelsius.com&amp;index=2&amp;md5=220dc63b8ec23e024d49e2b768dcdeaf\">accelsius.com<\/a>.\n<\/p>\n<p><b>About Accelsius<\/b><\/p>\n<p>\nFounded by Innventure, Inc. (NASDAQ:INV), Accelsius empowers data center and edge operators to achieve their business, financial and sustainability goals through advanced cooling solutions. The proprietary NeuCool platform provides best-in-class thermal efficiencies through a safe, two-phase liquid cooling system that scales from single racks to entire data centers. For more information, visit <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.accelsius.com%2F&amp;esheet=54236181&amp;newsitemid=20250410459051&amp;lan=en-US&amp;anchor=accelsius.com&amp;index=3&amp;md5=9bcf78658026025c4acc33db9d20d97b\">accelsius.com<\/a> or follow us on <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.linkedin.com%2Fcompany%2Faccelsius%2F&amp;esheet=54236181&amp;newsitemid=20250410459051&amp;lan=en-US&amp;anchor=LinkedIn&amp;index=4&amp;md5=91e5761c06e6784bf0d2e78ce01ca2ae\">LinkedIn<\/a>.\n<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20250410459051r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20250410459051\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20250410459051\/en\/<\/a><\/span><\/p>\n<p><b>Media Contact<br \/>\n<\/b><br \/><a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Ftreblepr.com%2F&amp;esheet=54236181&amp;newsitemid=20250410459051&amp;lan=en-US&amp;anchor=Treble&amp;index=5&amp;md5=2f4c9d9d5d12f14b8ab0bdebac183d8b\">Treble<br \/>\n<\/a><br \/>McKenzie Covell<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:accelsius@treblepr.com\">accelsius@treblepr.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> United States North America Texas<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Software Networks Machinery Hardware Electronic Design Automation Data Management Consumer Electronics Technology Artificial Intelligence Semiconductor Engineering Telecommunications Manufacturing<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20250410459051\/en\/2434905\/3\/Accelsius_logo_-_gray_logotype_1600px.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing Successfully tested NeuCool technology at 4,500W per GPU socket\u2014the highest in the industry for direct-to-chip liquid cooling Demonstrated the highest cooling capacity two-phase CDU on the market, supporting a full 250kW AI server rack while maintaining GPU temperatures below thermal limits even with 40\u00b0C facility water Accelsius will showcase these capabilities at Data Center World in Washington, DC (Booth #524), and present innovative cold-plate research for vertically oriented servers at the OCP EMEA Summit in Dublin AUSTIN, Texas&#8211;(BUSINESS WIRE)&#8211;Accelsius, a leader in advanced liquid cooling technologies, announced two major thermal testing milestones today, demonstrating the unmatched performance and scalability of its proprietary two-phase, direct-to-chip NeuCool\u2122 solution. These breakthroughs address critical cooling &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-835945","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing Successfully tested NeuCool technology at 4,500W per GPU socket\u2014the highest in the industry for direct-to-chip liquid cooling Demonstrated the highest cooling capacity two-phase CDU on the market, supporting a full 250kW AI server rack while maintaining GPU temperatures below thermal limits even with 40\u00b0C facility water Accelsius will showcase these capabilities at Data Center World in Washington, DC (Booth #524), and present innovative cold-plate research for vertically oriented servers at the OCP EMEA Summit in Dublin AUSTIN, Texas&#8211;(BUSINESS WIRE)&#8211;Accelsius, a leader in advanced liquid cooling technologies, announced two major thermal testing milestones today, demonstrating the unmatched performance and scalability of its proprietary two-phase, direct-to-chip NeuCool\u2122 solution. 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Market Newsdesk","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/","og_locale":"en_US","og_type":"article","og_title":"Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing - Market Newsdesk","og_description":"Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing Successfully tested NeuCool technology at 4,500W per GPU socket\u2014the highest in the industry for direct-to-chip liquid cooling Demonstrated the highest cooling capacity two-phase CDU on the market, supporting a full 250kW AI server rack while maintaining GPU temperatures below thermal limits even with 40\u00b0C facility water Accelsius will showcase these capabilities at Data Center World in Washington, DC (Booth #524), and present innovative cold-plate research for vertically oriented servers at the OCP EMEA Summit in Dublin AUSTIN, Texas&#8211;(BUSINESS WIRE)&#8211;Accelsius, a leader in advanced liquid cooling technologies, announced two major thermal testing milestones today, demonstrating the unmatched performance and scalability of its proprietary two-phase, direct-to-chip NeuCool\u2122 solution. These breakthroughs address critical cooling &hellip; Continue reading \"Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/","og_site_name":"Market Newsdesk","article_published_time":"2025-04-10T11:44:41+00:00","og_image":[{"url":"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20250410459051r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing","datePublished":"2025-04-10T11:44:41+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/"},"wordCount":662,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/#primaryimage"},"thumbnailUrl":"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20250410459051r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/accelsius-achieves-industry-leading-thermal-milestones-for-next-generation-ai-computing\/","name":"Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing - 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