{"id":821106,"date":"2025-03-04T07:06:00","date_gmt":"2025-03-04T12:06:00","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration\/"},"modified":"2025-03-04T07:06:00","modified_gmt":"2025-03-04T12:06:00","slug":"lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration\/","title":{"rendered":"Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration"},"content":{"rendered":"<h2>\nAdvanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications<br \/>\n<\/h2>\n<div class=\"mw_release\">\n<p align=\"left\">IRVINE, Calif., March  04, 2025  (GLOBE NEWSWIRE) &#8212; <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=nmu4gXFdomzf7KqjUxsfeAsBAcnaMrDGQUQrAgENE6yhEwqgsGW_sAq8neUKBJQohl_wB7gIn4axyElTnl4xeZUPoIFn54ua6ZDxbXh_KWrImSUgtlM5FiQzEX7MTXtyTrsifM8LZYx6O7wIOTeuE61Q7seJcjAn4pn8-IA0mL8zhoTGrMovyRknNQ0mEg3N\" rel=\"nofollow\" target=\"_blank\">Lantronix Inc.<\/a>\u00a0 (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q\u2122 System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR\u2019s thermal infrared (IR) camera modules and <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=6XSTN0NkEhvV61pi6YpiaQA_T6f-wPE66pWWdmy7cYBL956iITtt-uN0XlBfa4qDq10IAMvwbpUE6XrlzZrFGA==\" rel=\"nofollow\" target=\"_blank\">Prism\u2122<\/a> embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation\/drones, surveillance and robotics.<\/p>\n<p>Powered by Lantronix\u2019s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing\u2122 QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix\u2019s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.<\/p>\n<p>\n        <strong>Lantronix at the Forefront of AI Edge Intelligence<\/strong>\n      <\/p>\n<p>\u201cWith Lantronix\u2019s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,\u201d said Mathi Gurusamy, Chief Strategy Officer at Lantronix. \u201cBy integrating with Teledyne FLIR\u2019s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,\u201d he added.<\/p>\n<p>\n        <strong>Advanced AI and Thermal Processing<\/strong>\n      <\/p>\n<p>Lantronix\u2019s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:<\/p>\n<ul type=\"disc\">\n<li>Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.<\/li>\n<li>Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.<\/li>\n<\/ul>\n<p>Lantronix\u2019s Open-Q SoMs fully support Teledyne FLIR Hadron\u2122 dual visible-thermal and Boson\u00ae thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:<\/p>\n<ul type=\"disc\">\n<li>Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android\u2122.<\/li>\n<li>Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux\u00ae.<\/li>\n<\/ul>\n<p>\n        <strong>Teledyne FLIR on the Lantronix Collaboration<\/strong>\n      <\/p>\n<p>\u201cOur collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,\u201d said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. \u201cOur SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.\u201d<\/p>\n<p>\n        <strong>Lantronix Open-Q 5165: Optimized for AI and Edge Computing<\/strong>\n      <\/p>\n<p>Lantronix\u2019s <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=jjHVlv_nNE0KDPSAScnnb_g0gukxfGmI86sln2bnJRu4MLKZmo7P7qh1LhuyJyt-x0wYIz2V2Lo58L7JJBop-0QsiAy_U0aceEIRNsw_IBmgwv2auxsHvTG1zFUa-M2Vk53aI5BH3WyPhMRwo82BuxfX2CO1eOBaNqrd1wa0n0G8NbZb7jFX11bGyD_9bSRMpp27u0WtpzQCW7wpKKOHew==\" rel=\"nofollow\" target=\"_blank\">Open-Q 5165<\/a> is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:<\/p>\n<ul type=\"disc\">\n<li>Qualcomm Spectra\u2122 ISP, Qualcomm\u00ae Adreno\u2122 GPU, and Qualcomm\u00ae Hexagon\u2122 DSP<\/li>\n<li>5<sup>th<\/sup> generation Qualcomm\u00ae AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second<\/li>\n<li>Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces<\/li>\n<\/ul>\n<p>Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5\/5-161 at Embedded World, March 13\u201315, 2025, in Nuremberg, Germany.<\/p>\n<p>\n        <strong>About Lantronix <\/strong>\n      <\/p>\n<p>Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets,\u00a0including Smart Cities, Enterprise and Transportation. Lantronix\u2019s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix\u2019s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.<\/p>\n<p>For more information, visit the <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=nmu4gXFdomzf7KqjUxsfeOKGCGuWvJhE99YRXNEpx3TOxdVebJcttsPGI0_1BuUW6GH5FIjv6PAO5f_6xMP7xr_EvMMQeOnxt8Vr3zi1At05iauUjNP6fPI3HsqFGnQDp9Cp1kA3fK9S_ORbrbZLR6qWlg6n5n8jC3AyMUOwp49UWQNzY-2Z9hzxev4RAOkc\" rel=\"nofollow\" target=\"_blank\"><u>Lantronix website<\/u><\/a>.<\/p>\n<p align=\"justify\">\n        <strong>Lantronix Media Contact:<\/strong>\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0<br \/>Gail Kathryn Miller<br \/>Corporate Marketing &amp;<br \/>Communications Manager<br \/><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=SkP9jf2xMeqtWiiDHuWuJZPNX4j64Qc_0JTF57aFVf9QaECuLH4a5rRpabfPjLzE1r5YJgxBahihBuudfzZBFYn8hnbWJc_jepLMkQtmxGM=\" rel=\"nofollow\" target=\"_blank\">media@lantronix.com<\/a><\/p>\n<p align=\"justify\">\n        <strong>Lantronix Analyst and Investor Contact:<\/strong>\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0<br \/><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=6DV1kFSuiqGegfTlKUSVkSMzTPVIckNYgyFx6SatYPNHCk6M4aodC56byCvEEqKebKhhnOpFnoGszoue876-JNiuX8kXoZ_OsSc0artZG-4=\" rel=\"nofollow\" target=\"_blank\">investors@lantronix.com<\/a><\/p>\n<p align=\"justify\">\u00a92025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.<\/p>\n<p align=\"justify\">Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and\/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.<\/p>\n<p>      <img decoding=\"async\" alt=\"\" class=\"__GNW8366DE3E__IMG\" src=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTM4NzQ2OCM2Nzg2NDczIzIwMDc3NTk=\" \/><br \/>\n      <br \/>\n      <img decoding=\"async\" alt=\"\" src=\"https:\/\/ml.globenewswire.com\/media\/MzA3ZmMzNmEtZjgzNS00ZGQ1LThmMTAtYWUyMGEzNDg2ZjJlLTEwMTkzMzI=\/tiny\/Lantronix-Inc-.png\" \/>\n    <\/div>\n<div class=\"mw_contactinfo\"><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) &#8212; Lantronix Inc.\u00a0 (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q\u2122 System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR\u2019s thermal infrared (IR) camera modules and Prism\u2122 embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation\/drones, surveillance and robotics. Powered by Lantronix\u2019s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing\u2122 QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-821106","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) &#8212; Lantronix Inc.\u00a0 (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q\u2122 System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR\u2019s thermal infrared (IR) camera modules and Prism\u2122 embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation\/drones, surveillance and robotics. Powered by Lantronix\u2019s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing\u2122 QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and &hellip; Continue reading &quot;Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2025-03-04T12:06:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTM4NzQ2OCM2Nzg2NDczIzIwMDc3NTk=\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration\",\"datePublished\":\"2025-03-04T12:06:00+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration\\\/\"},\"wordCount\":657,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTM4NzQ2OCM2Nzg2NDczIzIwMDc3NTk=\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/lantronix-powers-next-generation-ai-enabled-camera-solutions-with-seamless-teledyne-flir-thermal-integration\\\/\",\"name\":\"Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration - 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This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation\/drones, surveillance and robotics. 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