{"id":800437,"date":"2025-01-14T07:38:06","date_gmt":"2025-01-14T12:38:06","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/onto-innovation-advances-process-control-suite-for-3d-interconnect-yields\/"},"modified":"2025-01-14T07:38:06","modified_gmt":"2025-01-14T12:38:06","slug":"onto-innovation-advances-process-control-suite-for-3d-interconnect-yields","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/onto-innovation-advances-process-control-suite-for-3d-interconnect-yields\/","title":{"rendered":"Onto Innovation Advances Process Control Suite for 3D Interconnect Yields"},"content":{"rendered":"

<\/p>\n

Onto Innovation Advances Process Control Suite for 3D Interconnect Yields<\/b><\/p>\n

Announces orders for 3Di\u2122<\/sup> technology on Dragonfly\u00ae<\/sup> G3 system and release of EchoScan\u2122<\/sup> void detection system<\/i><\/p>\n

WILMINGTON, Mass.–(BUSINESS WIRE<\/a>)–
\nOnto Innovation Inc. (NYSE: ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di\u2122<\/sup> technology on the Dragonfly\u00ae<\/sup> G3 system<\/a> for bump process control in high bandwidth memory (HBM) and advanced logic applications. Additionally, the EchoScan\u2122<\/sup> system<\/a> is introduced for detecting voids as small as 1\u00b5m in wafer bonding applications, such as advanced hybrid bonding for Cu-Cu interconnects. Initial orders for the 3Di technology include a top HBM manufacturer, a tier one OSAT and a leading manufacturer of bump process equipment. The first EchoScan system will ship in the first quarter, with additional tools planned to ship to customers throughout 2025.<\/p>\n

\nAdvanced packages with 2.5D and 3D integration schemes are projected to grow at a rate of 19% from 2024 through 2028, according to TechInsights. Interconnect bump heights in high volume manufacturing (HVM) are decreasing from 12\u00b5m to 8\u00b5m, and potentially to 4\u00b5m. As bump sizes decrease, metrology and inspection become increasingly critical to ensuring high yields.<\/p>\n

\n\u201cHigh-performance HBM and GPU devices powering AI packages demand smaller line\/space and bump pitch requirements,\u201d says Mike Rosa, Onto\u2019s chief marketing officer and senior vice president of strategy. \u201cOnto designed the 3Di technology to meet customers\u2019 needs for more stable technologies accommodating smaller bump sizes\u2014even below 5\u00b5m in HVM and 2\u00b5m in R&D\u2014in next generation logic and memory devices.\u201d<\/p>\n

\nInterconnect density intensifies with the adoption of hybrid bonding for bond pad interconnects, with planar bump heights and the challenge of inline micro void detection at the Cu-Cu bond pad interface. Undetected voids can lead to wafer cracking and open electrical connections, resulting in yield loss. Current technologies are limited to \u226510\u00b5m void size sensitivity and require water immersion, which adds the risk of bonded wafer contamination, delamination and lack of void traceability for inline process control.<\/p>\n

\n\u201cOnto\u2019s EchoScan system offers die and wafer level, immersion free, non-contact technology for voids down to 1\u00b5m in HVM. This solution is being released to select customers to detect 1\u00b5m voids in atmosphere at the same speed as incumbent technologies limited to ~10\u00b5m,\u201d Rosa continued. \u201cWhether using micro bump or hybrid bonding technologies, Onto Innovation provides the critical process control solution. When paired with our Discover\u00ae<\/sup> analytical software, both solutions enable real-time defect analysis and feedback to process tools for statistical process control, reducing the cycle time of yield loss assessment and helping customers achieve high volume manufacturing goals.\u201d<\/p>\n

\nTo learn more about the 3Di technology on the Dragonfly G3 system<\/a> and the EchoScan void detection system<\/a>, contact us<\/a> or reach out to your local sales team<\/a>.<\/p>\n

About Onto Innovation Inc.<\/b><\/p>\n

\nOnto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that includes un-patterned wafer quality, 3D metrology spanning chip features from nanometer scale transistors to large die interconnects, macro defect inspection of wafers and packages, metal interconnect composition, factory analytics, and lithography for advanced semiconductor packaging.<\/p>\n

\nOur breadth of offerings across the entire semiconductor value chain combined with our connected thinking approach results in a unique perspective to help solve our customers\u2019 most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers\u2019 critical path of progress by making them smarter, faster and more efficient. With headquarters and manufacturing in the U.S., Onto Innovation supports customers with a worldwide sales and service organization.<\/p>\n

\nAdditional information can be found at www.ontoinnovation.com<\/a>.<\/p>\n

Forward Looking Statements<\/b><\/p>\n

\nThis press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the \u201cAct\u201d) which include statements relating to Onto Innovation\u2019s business momentum and future growth; the benefit to customers and the capabilities of Onto Innovation\u2019s products and customer service; Onto Innovation\u2019s ability to both deliver products and services consistent with our customers\u2019 demands and expectations and strengthen its market position, Onto Innovation\u2019s beliefs about market opportunities as well as other matters that are not purely historical data. Onto Innovation wishes to take advantage of the \u201csafe harbor\u201d provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Onto Innovation\u2019s control. Such factors include, but are not limited to, the Company\u2019s ability to leverage its resources to improve its position in its core markets; its ability to weather difficult economic environments; its ability to open new market opportunities and target high-margin markets; the strength\/weakness of the back-end and\/or front-end semiconductor market segments; fluctuations in customer capital spending and any potential impact as a result of the novel coronavirus situation; the Company\u2019s ability to effectively manage its supply chain and adequately source components from suppliers to meet customer demand; its ability to adequately protect its intellectual property rights and maintain data security; its ability to effectively maneuver global trade issues and changes in trade and export license policies; the Company\u2019s ability to maintain relationships with its customers and manage appropriate levels of inventory to meet customer demands; and the Company\u2019s ability to successfully integrate acquired businesses and technologies. Additional information and considerations regarding the risks faced by Onto Innovation are available in Onto Innovation\u2019s Form 10-K report for the year ended December 30, 2023, and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Onto Innovation\u2019s current expectations, the Company cannot guarantee any related future results, levels of activity, performance or achievements. Onto Innovation does not assume any obligation to update the forward-looking information contained in this press release, except as required by law.<\/p>\n

\nSource: Onto Innovation Inc.<\/p>\n

\nONTO-IP<\/p>\n

\"\"<\/p>\n

View source version on businesswire.com: <\/span>https:\/\/www.businesswire.com\/news\/home\/20250114327799\/en\/<\/a><\/span><\/p>\n

\nInvestor Relations:
\n
Sidney Ho, +1 408.376.9163
\n
sidney.ho@ontoinnovation.com<\/a><\/p>\n

KEYWORDS:<\/b> United States North America Massachusetts<\/p>\n

INDUSTRY KEYWORDS:<\/b> Technology Semiconductor Artificial Intelligence<\/p>\n

MEDIA:<\/b><\/p>\n\n\n\n\n
Logo<\/b><\/font><\/td>\n<\/tr>\n
\"Logo\"<\/td>\n<\/tr>\n
<\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Onto Innovation Advances Process Control Suite for 3D Interconnect Yields Announces orders for 3Di\u2122 technology on Dragonfly\u00ae G3 system and release of EchoScan\u2122 void detection system WILMINGTON, Mass.–(BUSINESS WIRE)– Onto Innovation Inc. (NYSE: ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di\u2122 technology on the Dragonfly\u00ae G3 system for bump process control in high bandwidth memory (HBM) and advanced logic applications. Additionally, the EchoScan\u2122 system is introduced for detecting voids as small as 1\u00b5m in wafer bonding applications, such as advanced hybrid bonding for Cu-Cu interconnects. Initial orders for the 3Di technology include a top HBM manufacturer, a tier one OSAT and a leading manufacturer of bump process equipment. The first EchoScan … <\/p>\n

Continue reading “Onto Innovation Advances Process Control Suite for 3D Interconnect Yields”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-800437","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nOnto Innovation Advances Process Control Suite for 3D Interconnect Yields - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/onto-innovation-advances-process-control-suite-for-3d-interconnect-yields\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Onto Innovation Advances Process Control Suite for 3D Interconnect Yields - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Onto Innovation Advances Process Control Suite for 3D Interconnect Yields Announces orders for 3Di\u2122 technology on Dragonfly\u00ae G3 system and release of EchoScan\u2122 void detection system WILMINGTON, Mass.–(BUSINESS WIRE)– Onto Innovation Inc. (NYSE: ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di\u2122 technology on the Dragonfly\u00ae G3 system for bump process control in high bandwidth memory (HBM) and advanced logic applications. Additionally, the EchoScan\u2122 system is introduced for detecting voids as small as 1\u00b5m in wafer bonding applications, such as advanced hybrid bonding for Cu-Cu interconnects. Initial orders for the 3Di technology include a top HBM manufacturer, a tier one OSAT and a leading manufacturer of bump process equipment. 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