{"id":780486,"date":"2023-08-28T17:52:39","date_gmt":"2023-08-28T21:52:39","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/onto-innovation-announces-over-100-million-in-orders-for-systems-supporting-advanced-packagingfor-ai\/"},"modified":"2023-08-28T17:52:39","modified_gmt":"2023-08-28T21:52:39","slug":"onto-innovation-announces-over-100-million-in-orders-for-systems-supporting-advanced-packagingfor-ai","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/onto-innovation-announces-over-100-million-in-orders-for-systems-supporting-advanced-packagingfor-ai\/","title":{"rendered":"Onto Innovation Announces Over $100 Million in Orders for Systems Supporting Advanced Packagingfor AI"},"content":{"rendered":"

<\/p>\n

Onto Innovation Announces Over $100 Million in Orders for Systems Supporting Advanced Packagingfor AI<\/b><\/p>\n

Dragonfly\u00ae<\/sup> G3 sub-micron inspection and metrology system supports production of AI chiplet packages<\/i><\/p>\n

WILMINGTON, Mass.–(BUSINESS WIRE<\/a>)–
\nOnto Innovation Inc. (NYSE: ONTO) (\u201cOnto Innovation,\u201d \u201cOnto,\u201d or the \u201cCompany\u201d) today announced finalizing over $100 million in orders for the Dragonfly\u00ae<\/sup> G3 inspection system<\/a> with deliveries scheduled through the first quarter of 2024, plus new orders now extending into the second half of 2024. This represents an increase from the previously estimated customer demand reflecting the critical role the Dragonfly G3 system plays in support of advanced packaging for the expanding AI device market. The orders are from leading logic and memory manufacturers for heterogeneous integrated (HI) packages that combine a graphics processor (GPU) and numerous high bandwidth memory (HBM) devices to create an AI GPU in a single package. The Company expects additional orders in 2024 to support expansions in the AI GPU market, which is estimated to grow at an annual average rate of 40% over the next four years, according to International Data Corporation and JP Morgan.<\/p>\n

\nThis year, several companies have announced accelerated demand for AI GPUs to supply both hyperscalers and corporate enterprises with specialized parallel computing platforms to meet the growing demand for large language model applications. \u201cThe Dragonfly G3 system is a versatile integrated inspection and metrology solution that supports manufacturers with their goal of using only known good die to create both HBM and chip-on-wafer GPU packages,\u201d says Mayson Brooks, vice president and general manager of Onto\u2019s inspection business. \u201cThe system\u2019s range of high-performance optical capabilities enables it to monitor multiple parameters at high throughput. Specifically, our unique Clearfind\u00ae<\/sup> technology is in demand by several customers to detect non-visual organic residue on chip-to-chip connections to ensure long-term package reliability and to maintain integrity of the power and data lines.\u201d<\/p>\n

\nIn addition to Clearfind technology, the Dragonfly G3 system offers sub-micron 2D defect detection and metrology, measuring the depth of through silicon vias and height of redistribution layers with a visible thickness and shape sensor while infrared (IR) technology detects edge cracks that also can adversely affect device reliability. The system is tightly integrated with control and leading automated defect classification<\/a> software for real-time analysis and review.<\/p>\n

\nOnto Innovation offers heterogeneous integration customers flexibility in addressing their specific process control challenges as part of a broader portfolio of metrology, inspection and enterprise software products in this rapidly growing space. To learn more about the Dragonfly G3 system, visit Onto Innovation at SEMICON\u00ae<\/sup> Taiwan<\/a> September 6-8 in Booth M0656-4F or send us a message<\/a>.<\/p>\n

About Onto Innovation Inc.<\/b><\/p>\n

\nOnto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain combined with our connected thinking approach results in a unique perspective to help solve our customers\u2019 most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers\u2019 critical path of progress by making them smarter, faster and more efficient. With headquarters and manufacturing in the U.S., Onto Innovation supports customers with a worldwide sales and service organization. Additional information can be found at www.ontoinnovation.com<\/a>.<\/p>\n

Forward Looking Statements<\/b><\/p>\n

\nThis press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the \u201cAct\u201d) which include statements relating to Onto Innovation\u2019s business momentum and future growth; the benefit to customers and the capabilities of Onto Innovation\u2019s products and customer service; Onto Innovation\u2019s ability to both deliver products and services consistent with our customers\u2019 demands and expectations and strengthen its market position, Onto Innovation\u2019s beliefs about market opportunities as well as other matters that are not purely historical data. Onto Innovation wishes to take advantage of the \u201csafe harbor\u201d provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Onto Innovation\u2019s control. Such factors include, but are not limited to, the Company\u2019s ability to leverage its resources to improve its position in its core markets; its ability to weather difficult economic environments; its ability to open new market opportunities and target high-margin markets; the strength\/weakness of the back-end and\/or front-end semiconductor market segments; fluctuations in customer capital spending; the Company\u2019s ability to effectively manage its supply chain and adequately source components from suppliers to meet customer demand; the effects of political, economic, legal, and regulatory changes or conflicts on the Company’s global operations; its ability to adequately protect its intellectual property rights and maintain data security; the effects of natural disasters or public health emergencies, such as the current COVID-19 pandemic, on the global economy and on the Company\u2019s customers, suppliers, employees, and business; its ability to effectively maneuver global trade issues and changes in trade and export license policies; the Company\u2019s ability to maintain relationships with its customers and manage appropriate levels of inventory to meet customer demands; and the Company\u2019s ability to successfully integrate acquired businesses and technologies. Additional information and considerations regarding the risks faced by Onto Innovation are available in Onto Innovation\u2019s Form 10-K report for the year ended December 31, 2022 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Onto Innovation\u2019s current expectations, the Company cannot guarantee any related future results, levels of activity, performance or achievements. Onto Innovation does not assume any obligation to update the forward-looking information contained in this press release, whether as a result of new information, future events or otherwise, except as required by law.<\/p>\n

\nSource: Onto Innovation Inc.
\n
ONTO-IP<\/p>\n

\"\"<\/p>\n

View source version on businesswire.com: <\/span>https:\/\/www.businesswire.com\/news\/home\/20230828504354\/en\/<\/a><\/span><\/p>\n

\nInvestor Relations:
\n
Michael Sheaffer, +1 978.253.6273
\n
mike.sheaffer@ontoInnovation.com<\/a><\/p>\n

KEYWORDS:<\/b> Massachusetts United States North America<\/p>\n

INDUSTRY KEYWORDS:<\/b> Technology Semiconductor Artificial Intelligence<\/p>\n

MEDIA:<\/b><\/p>\n\n\n\n\n
Logo<\/b><\/font><\/td>\n<\/tr>\n
\"Logo\"<\/td>\n<\/tr>\n
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Onto Innovation Announces Over $100 Million in Orders for Systems Supporting Advanced Packagingfor AI Dragonfly\u00ae G3 sub-micron inspection and metrology system supports production of AI chiplet packages WILMINGTON, Mass.–(BUSINESS WIRE)– Onto Innovation Inc. (NYSE: ONTO) (\u201cOnto Innovation,\u201d \u201cOnto,\u201d or the \u201cCompany\u201d) today announced finalizing over $100 million in orders for the Dragonfly\u00ae G3 inspection system with deliveries scheduled through the first quarter of 2024, plus new orders now extending into the second half of 2024. This represents an increase from the previously estimated customer demand reflecting the critical role the Dragonfly G3 system plays in support of advanced packaging for the expanding AI device market. The orders are from leading logic and memory manufacturers for heterogeneous integrated (HI) packages that … <\/p>\n

Continue reading “Onto Innovation Announces Over $100 Million in Orders for Systems Supporting Advanced Packagingfor AI”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-780486","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nOnto Innovation Announces Over $100 Million in Orders for Systems Supporting Advanced Packagingfor AI - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/onto-innovation-announces-over-100-million-in-orders-for-systems-supporting-advanced-packagingfor-ai\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Onto Innovation Announces Over $100 Million in Orders for Systems Supporting Advanced Packagingfor AI - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Onto Innovation Announces Over $100 Million in Orders for Systems Supporting Advanced Packagingfor AI Dragonfly\u00ae G3 sub-micron inspection and metrology system supports production of AI chiplet packages WILMINGTON, Mass.–(BUSINESS WIRE)– Onto Innovation Inc. (NYSE: ONTO) (\u201cOnto Innovation,\u201d \u201cOnto,\u201d or the \u201cCompany\u201d) today announced finalizing over $100 million in orders for the Dragonfly\u00ae G3 inspection system with deliveries scheduled through the first quarter of 2024, plus new orders now extending into the second half of 2024. This represents an increase from the previously estimated customer demand reflecting the critical role the Dragonfly G3 system plays in support of advanced packaging for the expanding AI device market. 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