{"id":753736,"date":"2023-05-02T11:03:08","date_gmt":"2023-05-02T15:03:08","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/ase-wins-device-technology-of-the-year-award-for-vipack\/"},"modified":"2023-05-02T11:03:08","modified_gmt":"2023-05-02T15:03:08","slug":"ase-wins-device-technology-of-the-year-award-for-vipack","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/ase-wins-device-technology-of-the-year-award-for-vipack\/","title":{"rendered":"ASE wins Device Technology of the Year award for VIPack\u2122"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b>ASE wins Device Technology of the Year award for VIPack\u2122<\/b><\/p>\n<p>SUNNYVALE, Calif.&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<br \/>\nAdvanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced that its VIPack\u2122 has received the \u2018Device Technology of the Year Award\u2019 in the 2023 3D InCites Awards program. This accolade recognizes industry-wide contributions in the development of heterogeneous integration technologies including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration.<\/p>\n<p id=\"news-body-cta\">This press release features multimedia. View the full release here: <a href=\"https:\/\/www.businesswire.com\/news\/home\/20230502005061\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20230502005061\/en\/<\/a><\/p>\n<p>\nIntroduced in 2022, VIPack\u2122 is an advanced packaging platform designed to enable vertically integrated package solutions. VIPack\u2122 represents ASE\u2019s next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.<\/p>\n<p>\nASE\u2019s VIPack\u2122 is comprised of six core packaging technology pillars supported by a comprehensive and integrated co-design ecosystem. These include ASE\u2019s high density RDL-based Fanout Package-on Package (FOPoP), Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP) as well as Through Silicon Via (TSV)-based 2.5D and 3D IC and Co-Packaged Optics processing capabilities. The VIPack\u2122 platform provides the capabilities necessary to enable trailblazing highly integrated silicon packaging solutions required to optimize clock speed, bandwidth, and power delivery, and to reduce co-design time, product development, and time to market.<\/p>\n<p>\nCo-Founder of 3D InCites, Fran\u00e7oise von Trapp, conveyed, \u201cASE has been making a splash over the past year with VIPack\u2122 and it caught the judges\u2019 attention for its core technology pillars supported by a comprehensive and integrated co-design ecosystem.\u201d She continued, \u201cVIPack\u2122 is being recognized for its innovative solutions that support complex applications across high-performance computing (HPC), artificial intelligence (AI), machine learning (ML) and network applications, as well as optical interconnects. On behalf of the 3D InCites community, I\u2019d like to extend sincere congratulations to ASE.\u201d<\/p>\n<p>\n\u201cThis prestigious award acknowledges the tremendous impact of the VIPack\u2122 platform as it continues to scale, and also brings home the outstanding efforts of our global teams that are dedicated to helping customers achieve product differentiation and competitive advantage,\u201d said Dr. C.P. Hung, Vice President of R&amp;D, ASE. \u201cThe rising adoption of chiplet-based co-designs is further fueling demand for multi-chip integration into a single package, and ASE\u2019s VIPack\u2122 delivers a collaborative platform for exceptional interconnect solutions where 3D heterogeneous integration has become critical.\u201d<\/p>\n<p>\n\u201cWe feel honored and absolutely thrilled to receive the Device Technology of the Year award from 3DInCites, as it is not only testament to the value of VIPack\u2122, but the exemplary creativity of our teams to advance system capability and propel our industry forward,\u201d said Yin Chang, ASE\u2019s Senior Vice President of Sales &amp; Marketing. He continued, \u201cAs we move further into the chiplets era, ASE\u2019s VIPack\u2122 is evolving, and delivering the technology advancements that enable us to be innovative, original, and imaginative.\u201d<\/p>\n<p>\nThe award was presented to Mark Gerber, Sr. Director of Engineering and Technical Marketing, at the IMAPS Device Packaging Conference 2023 in Fountain Hills, Arizona.<\/p>\n<p>\nAvailable now, ASE\u2019s VIPack\u2122 is a scalable platform that will expand in alignment with industry roadmaps. For more: <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fase.aseglobal.com%2Fen%2Fvipack&amp;esheet=53389476&amp;newsitemid=20230502005061&amp;lan=en-US&amp;anchor=https%3A%2F%2Fase.aseglobal.com%2Fen%2Fvipack&amp;index=1&amp;md5=988794e2126cc4a8a635b09bec3507f7\">https:\/\/ase.aseglobal.com\/en\/vipack<\/a><\/p>\n<p><b>About ASE, Inc.<\/b><\/p>\n<p>\nASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS &amp; Sensor, Flip Chip, and 2.5D, 3D &amp; TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on LinkedIn and Twitter: @aseglobal.<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20230502005061r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20230502005061\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20230502005061\/en\/<\/a><\/span><\/p>\n<p>\nNorth America &amp; Europe: Patricia MacLeod +1.408.314.9740 <a rel=\"nofollow\" href=\"mailto:patricia.macleod@aseus.com\">patricia.macleod@aseus.com<br \/>\n<\/a><br \/>Asia Pacific: Jennifer Yuen +65 97501975 <a rel=\"nofollow\" href=\"mailto:jennifer.yuen@aseus.com\">jennifer.yuen@aseus.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> California United States North America<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Packaging Data Management Semiconductor Technology Manufacturing Software Hardware<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20230502005061\/en\/1777629\/3\/ASE_LOGOTYPE_Horizontal-EN.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20230502005061\/en\/1777630\/3\/logo-01.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>ASE wins Device Technology of the Year award for VIPack\u2122 SUNNYVALE, Calif.&#8211;(BUSINESS WIRE)&#8211; Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced that its VIPack\u2122 has received the \u2018Device Technology of the Year Award\u2019 in the 2023 3D InCites Awards program. This accolade recognizes industry-wide contributions in the development of heterogeneous integration technologies including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20230502005061\/en\/ Introduced in 2022, VIPack\u2122 is an advanced packaging platform designed to enable vertically integrated package solutions. VIPack\u2122 represents ASE\u2019s next generation of 3D heterogeneous integration architecture that extends design rules &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/ase-wins-device-technology-of-the-year-award-for-vipack\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;ASE wins Device Technology of the Year award for VIPack\u2122&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-753736","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>ASE wins Device Technology of the Year award for VIPack\u2122 - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/ase-wins-device-technology-of-the-year-award-for-vipack\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"ASE wins Device Technology of the Year award for VIPack\u2122 - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"ASE wins Device Technology of the Year award for VIPack\u2122 SUNNYVALE, Calif.&#8211;(BUSINESS WIRE)&#8211; Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced that its VIPack\u2122 has received the \u2018Device Technology of the Year Award\u2019 in the 2023 3D InCites Awards program. This accolade recognizes industry-wide contributions in the development of heterogeneous integration technologies including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20230502005061\/en\/ Introduced in 2022, VIPack\u2122 is an advanced packaging platform designed to enable vertically integrated package solutions. 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(ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced that its VIPack\u2122 has received the \u2018Device Technology of the Year Award\u2019 in the 2023 3D InCites Awards program. This accolade recognizes industry-wide contributions in the development of heterogeneous integration technologies including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20230502005061\/en\/ Introduced in 2022, VIPack\u2122 is an advanced packaging platform designed to enable vertically integrated package solutions. VIPack\u2122 represents ASE\u2019s next generation of 3D heterogeneous integration architecture that extends design rules &hellip; Continue reading \"ASE wins Device Technology of the Year award for VIPack\u2122\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/ase-wins-device-technology-of-the-year-award-for-vipack\/","og_site_name":"Market Newsdesk","article_published_time":"2023-05-02T15:03:08+00:00","og_image":[{"url":"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20230502005061r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"4 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/ase-wins-device-technology-of-the-year-award-for-vipack\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/ase-wins-device-technology-of-the-year-award-for-vipack\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"ASE wins Device Technology of the Year award for VIPack\u2122","datePublished":"2023-05-02T15:03:08+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/ase-wins-device-technology-of-the-year-award-for-vipack\/"},"wordCount":721,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/ase-wins-device-technology-of-the-year-award-for-vipack\/#primaryimage"},"thumbnailUrl":"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20230502005061r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/ase-wins-device-technology-of-the-year-award-for-vipack\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/ase-wins-device-technology-of-the-year-award-for-vipack\/","name":"ASE wins Device Technology of the Year award for VIPack\u2122 - 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