{"id":752167,"date":"2023-04-27T11:03:10","date_gmt":"2023-04-27T15:03:10","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemi-ships-one-billionth-inductive-sensor-ic-to-hella\/"},"modified":"2023-04-27T11:03:10","modified_gmt":"2023-04-27T15:03:10","slug":"onsemi-ships-one-billionth-inductive-sensor-ic-to-hella","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/onsemi-ships-one-billionth-inductive-sensor-ic-to-hella\/","title":{"rendered":"onsemi Ships One Billionth Inductive Sensor IC to HELLA"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b>onsemi Ships One Billionth Inductive Sensor IC to HELLA<\/b><\/p>\n<p class=\"bwalignc\"><i>Over two decades of collaboration on sensors for automotive x-by-wire systems culminate in significant milestone<\/i><\/p>\n<p>SCOTTSDALE, Ariz.&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<b>onsemi<\/b> (Nasdaq: <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Finvestor.onsemi.com%2F&amp;esheet=53388799&amp;newsitemid=20230427005390&amp;lan=en-US&amp;anchor=ON&amp;index=1&amp;md5=5b03354c6dcb5cf8f0e4d128f6b7bd4e\">ON<\/a>), a leader in intelligent power and sensing technologies, today announced that the company has shipped its one billionth Inductive Sensor Interface Integrated Circuit (IC) to HELLA, an international automotive supplier operating under the umbrella brand FORVIA. The IC designed by onsemi is being used in HELLA\u2019s Contactless Inductive Position Sensor (CIPOS<sup>\u00ae)<\/sup> technology for automotive x-by-wire systems. Throughout their 25-year collaboration, the companies developed innovative design methods that reduced the size of both the HELLA module and the onsemi IC to better fit the demanding applications of the module\u2019s form factor.<\/p>\n<p>\nCIPOS<sup>\u00ae<\/sup> is an inductive technology used in passenger and commercial vehicles for drive-by-wire systems such as accelerator pedal sensing, steering and torque sensors, as well as actuators for pressure boost and turbos. The IC designed by onsemi is the central element of the HELLA solution and, together with the connected coil structure, forms the inductive position sensor. As the solution is contactless, the accuracy provided by the onsemi IC is guaranteed over the lifetime of the CIPOS<sup>\u00ae<\/sup> system. The CIPOS<sup>\u00ae<\/sup> technology is also completely immune to stray magnetic fields, a key asset for an automotive industry driven towards electrification. This industry-leading technology is widely used by many of the major automotive OEMs, with HELLA being a global market leader in the field of accelerator pedal sensors.<\/p>\n<p>\n\u201cWe have benefitted from onsemi\u2019s technologies and development expertise for many years, which has allowed us to make CIPOS<sup>\u00ae<\/sup> a market-leading sensing solution,\u201d said Marco D\u00f6brich, head of the Sensors business field at HELLA. \u201cThe ICs\u2019 quality levels are outstanding, and our far-sighted capacity planning with onsemi enables us to plan ahead but stay agile in a tough market.\u201d<\/p>\n<p>\nA more than two decades long collaboration led to the successful release of the very first automotive inductive position sensor in 1999. Since then, onsemi has provided HELLA with three generations of inducting positioning interfaces. Each generation has been specifically developed for, and together with, HELLA.<\/p>\n<p>\n\u201cWithout our teams understanding each other\u2019s technologies and processes at such precise levels, we could not have reached this significant milestone with HELLA,\u201d said Sudhir Gopalswamy, senior vice president and general manager, Advanced Solutions Group, onsemi. \u201cBut we won\u2019t stop here and are already working on a fourth generation of inductive positioning sensor technologies. This generation will include system level improvements especially in the areas of Automotive Safety Integrity Levels (ASIL-x) as the industry moves ever closer to fully autonomous driving.\u201d<\/p>\n<p><b>onsemi<\/b> (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. <b>onsemi<\/b> offers a highly differentiated and innovative product portfolio, delivering intelligent power and sensing technologies that solve the world\u2019s most complex challenges and leads the way to creating a safer, cleaner, and smarter world. <b>onsemi <\/b>is recognized as a Fortune 500<sup>\u00ae<\/sup> company and included in the S&amp;P 500<sup>\u00ae<\/sup> index. Learn more about <b>onsemi<\/b> at <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.onsemi.com&amp;esheet=53388799&amp;newsitemid=20230427005390&amp;lan=en-US&amp;anchor=www.onsemi.com&amp;index=2&amp;md5=5ab3d9290a2a19ce7d2859f1cb26d9e4\">www.onsemi.com<\/a>.<\/p>\n<p><i>onsemi and the onsemi logo are trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders.<\/i><\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20230427005390r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20230427005390\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20230427005390\/en\/<\/a><\/span><\/p>\n<p><b>Stefanie Cuene<br \/>\n<\/b><br \/>Public Relations<br \/>\n<br \/>onsemi<br \/>\n<br \/>(602) 315-3778<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:Stefanie.Cuene@onsemi.com\">Stefanie.Cuene@onsemi.com<\/a><\/p>\n<p><b>Parag Agarwal<br \/>\n<br \/><\/b>Vice President &#8211; Investor Relations &amp; Corporate Development<br \/>\n<br \/>onsemi<br \/>\n<br \/>(602) 244-3437<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:investor@onsemi.com\">investor@onsemi.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> Arizona United States North America<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Data Management Semiconductor Automotive General Automotive Technology Software Hardware<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20230427005390\/en\/1169227\/3\/onsemi_logo_no_mark_1920x1080.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>onsemi Ships One Billionth Inductive Sensor IC to HELLA Over two decades of collaboration on sensors for automotive x-by-wire systems culminate in significant milestone SCOTTSDALE, Ariz.&#8211;(BUSINESS WIRE)&#8211;onsemi (Nasdaq: ON), a leader in intelligent power and sensing technologies, today announced that the company has shipped its one billionth Inductive Sensor Interface Integrated Circuit (IC) to HELLA, an international automotive supplier operating under the umbrella brand FORVIA. The IC designed by onsemi is being used in HELLA\u2019s Contactless Inductive Position Sensor (CIPOS\u00ae) technology for automotive x-by-wire systems. Throughout their 25-year collaboration, the companies developed innovative design methods that reduced the size of both the HELLA module and the onsemi IC to better fit the demanding applications of the module\u2019s form factor. CIPOS\u00ae &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/onsemi-ships-one-billionth-inductive-sensor-ic-to-hella\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;onsemi Ships One Billionth Inductive Sensor IC to HELLA&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-752167","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>onsemi Ships One Billionth Inductive Sensor IC to HELLA - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/onsemi-ships-one-billionth-inductive-sensor-ic-to-hella\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"onsemi Ships One Billionth Inductive Sensor IC to HELLA - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"onsemi Ships One Billionth Inductive Sensor IC to HELLA Over two decades of collaboration on sensors for automotive x-by-wire systems culminate in significant milestone SCOTTSDALE, Ariz.&#8211;(BUSINESS WIRE)&#8211;onsemi (Nasdaq: ON), a leader in intelligent power and sensing technologies, today announced that the company has shipped its one billionth Inductive Sensor Interface Integrated Circuit (IC) to HELLA, an international automotive supplier operating under the umbrella brand FORVIA. The IC designed by onsemi is being used in HELLA\u2019s Contactless Inductive Position Sensor (CIPOS\u00ae) technology for automotive x-by-wire systems. Throughout their 25-year collaboration, the companies developed innovative design methods that reduced the size of both the HELLA module and the onsemi IC to better fit the demanding applications of the module\u2019s form factor. 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