{"id":739695,"date":"2023-03-14T05:03:08","date_gmt":"2023-03-14T09:03:08","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-introduces-new-open-q-family-of-sip-modules-that-deliver-high-performance-for-mass-market-robotics-and-iot-projects\/"},"modified":"2023-03-14T05:03:08","modified_gmt":"2023-03-14T09:03:08","slug":"lantronix-introduces-new-open-q-family-of-sip-modules-that-deliver-high-performance-for-mass-market-robotics-and-iot-projects","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-introduces-new-open-q-family-of-sip-modules-that-deliver-high-performance-for-mass-market-robotics-and-iot-projects\/","title":{"rendered":"Lantronix Introduces New Open-Q Family of SIP Modules That Deliver High-Performance for Mass Market Robotics and IoT Projects"},"content":{"rendered":"

\nNow available, the new Open-Q chipset modules use Qualcomm System-on-Chip products for a comprehensive, cost-effective solution for everyday robotics and IoT products
\n<\/h2>\n
\n

IRVINE, Calif., March 14, 2023 (GLOBE NEWSWIRE) — Lantronix Inc.<\/a> (NASDAQ: LTRX), a global provider of secure turnkey solutions for the Industrial Internet of Things (IoT) and the Intelligent IT market, today announced the expansion of its Open-Q\u2122 family with its new entry-level Open-Q 2210RB and mid-tier Open-Q 4210RB System-in-Package (SIP) chipset modules as well as the companion Open-Q RB1 and RB2 Development Kits. The two SIP modules are footprint compatible, allowing for flexibility in hardware design choice, and is offered in a Yocto Project environment suitable for developers to build an operating system based on the Linux kernel for their embedded and IoT devices.<\/p>\n

The SIP modules are powered by the Qualcomm\u00ae QRB2210 and Qualcomm\u00ae QRB4210 System-on-Chip (SoC) from Qualcomm Technologies Inc. Utilizing heterogeneous compute capabilities with multiple specialized processing cores, they deliver high-performance computing with lower power consumption.<\/p>\n

\u201cAs part of our leading robotics portfolio, the Qualcomm QRB2210 and Qualcomm QRB4210 provide a comprehensive, cost-effective solution to quickly deploy everyday robotics and IoT projects,\u201d stated Dev Singh, vice president of Business Development and head of Building, Enterprise and Industrial Automation at Qualcomm Technologies Inc. \u201cWe are pleased to work with Lantronix and support its industrial-grade System-in-Package modules to simplify product design and enable customers to further improve time-to-market of their solutions.\u201d<\/p>\n

By 2026, Berg Insights forecasts that roughly 260 million services robots will be active throughout the world, growing at a CAGR of 24 percent per year. Berg Insights forecasts that the three largest volume segments are floor-cleaning robots, UAVs and robot lawn mowers.<\/p>\n

\u201cQualcomm Technologies\u2019 low-power capabilities improve battery life in these applications by integrating powerful heterogeneous compute capabilities and connectivity,\u201d said Brian Jaroszewski, director of Product Line Management at Lantronix.<\/p>\n

\u201cOur long-standing relationship with Qualcomm Technologies enables us to deliver a wide variety of development solutions and support the quick and cost-effective delivery of innovative IoT and robotic solutions to market,\u201d said Paul Pickle, CEO of Lantronix.<\/p>\n

\n Lantronix Open-Q 2210RB and 4210RB SIP Modules and Open-Q RB1\/RB2 Development Kits <\/strong>\n <\/p>\n

An entry-tier solution, the Open-Q 2210RB SIP compact (35mm x 35mm) module is ideal for the development of industrial IoT applications with improved power performance and increased graphic capabilities. The Open-Q 4210RB is an affordable, compact (36mm x 36mm), production-ready SIP chipset module that can power applications requiring AI intelligence, vivid graphics and dynamic camera capabilities. The Open-Q RB1 and RB2 Development Kits support the SIP modules for rapid prototyping of innovative new products. The Open-Q RB2 development kit will be displayed at Embedded World 2023 in Nuremberg, Germany, from March 14-16, 2023, in both Lantronix\u2019s booth (Hall 3, Booth 627) and the Arrow Electronics booth (Hall 3. Booth 135\/138) at Qualcomm Technologies\u2019 pod.<\/p>\n

\n Maximize Application Development with Lantronix Engineering Services<\/strong>\n <\/p>\n

To assist in Intelligent IoT product design, Lantronix Engineering Services<\/a> provides IoT product development that delivers unparalleled expertise and proven product development best practices to help its customers meet their technical goals and quickly get products to prototype and market. It offers a full range of production-ready Edge AI computing solutions, including multi-disciplinary engineering services.<\/p>\n

\n About Lantronix <\/strong>\n <\/p>\n

Lantronix Inc. is a global provider of secure turnkey solutions for the Internet of Things (IoT) and Remote Environment Management (REM), offering Software as a Service (SaaS), connectivity services, engineering services and intelligent hardware.<\/p>\n

Lantronix enables its customers to accelerate time to market and increase operational up-time and efficiency by providing reliable, secure and connected Intelligent Edge IoT and Remote Management Gateway solutions.<\/p>\n

Lantronix\u2019s products and services dramatically simplify the creation, development, deployment and management of IoT and IT projects across Robotics, Automotive, Wearables, Video Conferencing, Industrial, Medical, Logistics, Smart Cities, Security, Retail, Branch Office, Server Room and Datacenter applications. For more information, visit the Lantronix website<\/u><\/a>.<\/p>\n

Learn more at the Lantronix blog<\/u><\/a>, which features industry discussion and updates. Follow Lantronix on Twitter<\/u><\/a>, view our YouTube video library<\/u><\/a> or connect with us on LinkedIn<\/u><\/a>.<\/p>\n

\u201cSafe Harbor\u201d Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to our solutions, technologies and products. These forward-looking statements are based on our current expectations and are subject to substantial risks and uncertainties that could cause our actual results, future business, financial condition, or performance to differ materially from our historical results or those expressed or implied in any forward-looking statement contained in this news release. The potential risks and uncertainties include, but are not limited to, such factors as the effects of negative or worsening regional and worldwide economic conditions or market instability on our business, including effects on purchasing decisions by our customers; the impact of the COVID-19 outbreak on our employees, supply and distribution chains, and the global economy; cybersecurity risks; changes in applicable U.S. and foreign government laws, regulations, and tariffs; our ability to successfully implement our acquisitions strategy or integrate acquired companies; difficulties and costs of protecting patents and other proprietary rights; the level of our indebtedness, our ability to service our indebtedness and the restrictions in our debt agreements; and any additional factors included in our Annual Report on Form 10-K for the fiscal year ended June 30, 2022, filed with the Securities and Exchange Commission (the \u201cSEC\u201d) on Aug. 29, 2022, including in the section entitled \u201cRisk Factors\u201d in Item 1A of Part I of such report, as well as in our other public filings with the SEC. Additional risk factors may be identified from time to time in our future filings. The forward-looking statements included in this release speak only as of the date hereof, and we do not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.<\/p>\n

\u00a9 2023 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.<\/p>\n

\n Lantronix Media Contact:<\/strong>
\n
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
media@lantronix.com<\/a>
949-212-0960<\/p>\n

\n Lantronix Analyst and Investor Contact:<\/strong>
\n
Jeremy Whitaker
Chief Financial Officer
investors@lantronix.com<\/a>
949-450-7241<\/p>\n

\n Lantronix Sales: <\/strong>
\n
\n sales@lantronix.com<\/a>
\n
Americas +1 (800) 422-7055 (US and Canada) or +1 949-453-3990
Europe, Middle East and Africa +31 (0)76 52 36 744
Asia Pacific + 852 3428-2338
China + 86 21-6237-8868
Japan +81 (0) 50-1354-6201
India +91 994-551-2488<\/p>\n

\n Qualcomm branded products are products of Qualcomm Technologies, Inc. and\/or its subsidiaries. Qualcomm patented technologies are licensed by Qualcomm Incorporated.<\/em>\n <\/p>\n

\n Qualcomm is a trademark or registered trademark of Qualcomm Incorporated.<\/em>\n <\/p>\n


\n
\n \n <\/div>\n

<\/div>\n","protected":false},"excerpt":{"rendered":"

Now available, the new Open-Q chipset modules use Qualcomm System-on-Chip products for a comprehensive, cost-effective solution for everyday robotics and IoT products IRVINE, Calif., March 14, 2023 (GLOBE NEWSWIRE) — Lantronix Inc. (NASDAQ: LTRX), a global provider of secure turnkey solutions for the Industrial Internet of Things (IoT) and the Intelligent IT market, today announced the expansion of its Open-Q\u2122 family with its new entry-level Open-Q 2210RB and mid-tier Open-Q 4210RB System-in-Package (SIP) chipset modules as well as the companion Open-Q RB1 and RB2 Development Kits. The two SIP modules are footprint compatible, allowing for flexibility in hardware design choice, and is offered in a Yocto Project environment suitable for developers to build an operating system based on the Linux … <\/p>\n

Continue reading “Lantronix Introduces New Open-Q Family of SIP Modules That Deliver High-Performance for Mass Market Robotics and IoT Projects”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-739695","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nLantronix Introduces New Open-Q Family of SIP Modules That Deliver High-Performance for Mass Market Robotics and IoT Projects - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-introduces-new-open-q-family-of-sip-modules-that-deliver-high-performance-for-mass-market-robotics-and-iot-projects\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Lantronix Introduces New Open-Q Family of SIP Modules That Deliver High-Performance for Mass Market Robotics and IoT Projects - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Now available, the new Open-Q chipset modules use Qualcomm System-on-Chip products for a comprehensive, cost-effective solution for everyday robotics and IoT products IRVINE, Calif., March 14, 2023 (GLOBE NEWSWIRE) — Lantronix Inc. (NASDAQ: LTRX), a global provider of secure turnkey solutions for the Industrial Internet of Things (IoT) and the Intelligent IT market, today announced the expansion of its Open-Q\u2122 family with its new entry-level Open-Q 2210RB and mid-tier Open-Q 4210RB System-in-Package (SIP) chipset modules as well as the companion Open-Q RB1 and RB2 Development Kits. 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(NASDAQ: LTRX), a global provider of secure turnkey solutions for the Industrial Internet of Things (IoT) and the Intelligent IT market, today announced the expansion of its Open-Q\u2122 family with its new entry-level Open-Q 2210RB and mid-tier Open-Q 4210RB System-in-Package (SIP) chipset modules as well as the companion Open-Q RB1 and RB2 Development Kits. The two SIP modules are footprint compatible, allowing for flexibility in hardware design choice, and is offered in a Yocto Project environment suitable for developers to build an operating system based on the Linux … Continue reading \"Lantronix Introduces New Open-Q Family of SIP Modules That Deliver High-Performance for Mass Market Robotics and IoT Projects\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-introduces-new-open-q-family-of-sip-modules-that-deliver-high-performance-for-mass-market-robotics-and-iot-projects\/","og_site_name":"Market Newsdesk","article_published_time":"2023-03-14T09:03:08+00:00","og_image":[{"url":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=ODc4NjQzMSM1NDU2MjA1IzIwMDc3NTk=","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"5 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-introduces-new-open-q-family-of-sip-modules-that-deliver-high-performance-for-mass-market-robotics-and-iot-projects\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-introduces-new-open-q-family-of-sip-modules-that-deliver-high-performance-for-mass-market-robotics-and-iot-projects\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Lantronix Introduces New Open-Q Family of SIP Modules That Deliver High-Performance for Mass Market Robotics and IoT Projects","datePublished":"2023-03-14T09:03:08+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-introduces-new-open-q-family-of-sip-modules-that-deliver-high-performance-for-mass-market-robotics-and-iot-projects\/"},"wordCount":1089,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-introduces-new-open-q-family-of-sip-modules-that-deliver-high-performance-for-mass-market-robotics-and-iot-projects\/#primaryimage"},"thumbnailUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=ODc4NjQzMSM1NDU2MjA1IzIwMDc3NTk=","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-introduces-new-open-q-family-of-sip-modules-that-deliver-high-performance-for-mass-market-robotics-and-iot-projects\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/lantronix-introduces-new-open-q-family-of-sip-modules-that-deliver-high-performance-for-mass-market-robotics-and-iot-projects\/","name":"Lantronix Introduces New Open-Q Family of SIP Modules That Deliver High-Performance for Mass Market Robotics and IoT Projects - 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