{"id":702588,"date":"2022-10-28T09:17:00","date_gmt":"2022-10-28T13:17:00","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\/"},"modified":"2022-10-28T09:17:00","modified_gmt":"2022-10-28T13:17:00","slug":"ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\/","title":{"rendered":"Ansys Multiphysics Solutions Achieve Certification for TSMC N4 Process and TSMC FINFLEX\u2122 Architecture"},"content":{"rendered":"<div class=\"xn-newslines\">\n<p class=\"xn-distributor\">PR Newswire<\/p>\n<\/p><\/div>\n<div class=\"xn-content\">\n<p>\n        <b><br \/>\n          <i>Ansys is certified for TSMC&#8217;s innovative <\/i><br \/>\n        <\/b><br \/>\n        <b>FINFLEX<\/b><br \/>\n        <b><br \/>\n          <i>\u2122 architecture on N3E for flexible power\/performance tradeoffs <\/i><br \/>\n        <\/b>\n      <\/p>\n<p>\/ Key Highlights<\/p>\n<ul type=\"disc\">\n<li>\n          <a href=\"https:\/\/c212.net\/c\/link\/?t=0&amp;l=en&amp;o=3691892-1&amp;h=1173134576&amp;u=https%3A%2F%2Fupl.inc%2FdSzPvR&amp;a=Ansys%C2%AE+Redhawk-SC%E2%84%A2\" target=\"_blank\" rel=\"nofollow noopener\">Ansys\u00ae Redhawk-SC\u2122<\/a> and <a href=\"https:\/\/c212.net\/c\/link\/?t=0&amp;l=en&amp;o=3691892-1&amp;h=3594163989&amp;u=https%3A%2F%2Fupl.inc%2FtZurry&amp;a=Ansys%C2%AE+Totem%E2%84%A2\" target=\"_blank\" rel=\"nofollow noopener\">Ansys\u00ae Totem\u2122<\/a> power integrity platforms are certified for TSMC&#8217;s FINFLEX\u2122 architecture on N3E<\/li>\n<li>The certification also extends to the TSMC N4 process technology<\/li>\n<\/ul>\n<p>\n        <span class=\"legendSpanClass\"><br \/>\n          <span class=\"xn-location\">PITTSBURGH<\/span><br \/>\n        <\/span>, <span class=\"legendSpanClass\"><span class=\"xn-chron\">Oct. 28, 2022<\/span><\/span> \/PRNewswire\/ &#8212; <a href=\"https:\/\/c212.net\/c\/link\/?t=0&amp;l=en&amp;o=3691892-1&amp;h=2820216862&amp;u=https%3A%2F%2Fupl.inc%2F8MN8WU&amp;a=Ansys\" target=\"_blank\" rel=\"nofollow noopener\">Ansys<\/a>\u00a0(NASDAQ: ANSS) and TSMC continued their long-standing technology collaboration to announce certification of Ansys&#8217; power integrity software for TSMC&#8217;s FINFLEX\u2122 innovation as well as the TSMC <a href=\"https:\/\/c212.net\/c\/link\/?t=0&amp;l=en&amp;o=3691892-1&amp;h=3265585120&amp;u=https%3A%2F%2Fpr.tsmc.com%2Fenglish%2Fnews%2F2895&amp;a=N4\" target=\"_blank\" rel=\"nofollow noopener\">N4<\/a> process. TSMC&#8217;s FINFLEX\u2122 architecture allows Ansys RedHawk-SC and Totem customers to make fine-grained speed-power tradeoffs which reduce a chip&#8217;s power footprint without sacrificing performance. This is important for lowering the environmental impact of many semiconductor applications, including machine learning, 5G mobile, and high-performance computing (HPC). This latest collaboration builds on the recent certification of the Ansys platform for TSMC&#8217;s <a href=\"https:\/\/c212.net\/c\/link\/?t=0&amp;l=en&amp;o=3691892-1&amp;h=613544102&amp;u=https%3A%2F%2Fupl.inc%2FGc9H4d&amp;a=N3E\" target=\"_blank\" rel=\"nofollow noopener\">N3E<\/a> process.<\/p>\n<div class=\"PRN_ImbeddedAssetReference\" id=\"DivAssetPlaceHolder1\">\n<p>\n          <a href=\"https:\/\/mma.prnewswire.com\/media\/1931979\/Ansys_RedHawk_SC.html\" target=\"_blank\" rel=\"nofollow noopener\"><br \/>\n            <img decoding=\"async\" src=\"https:\/\/mma.prnewswire.com\/media\/1931979\/Ansys_RedHawk_SC.jpg\" title=\"TSMC\u2019s FINFLEX\u2122 architecture allows Ansys RedHawk-SC and Totem customers to make fine-grained speed-power tradeoffs, reducing a chip\u2019s power footprint without sacrificing performance\" alt=\"TSMC\u2019s FINFLEX\u2122 architecture allows Ansys RedHawk-SC and Totem customers to make fine-grained speed-power tradeoffs, reducing a chip\u2019s power footprint without sacrificing performance\" \/><br \/>\n          <\/a>\n        <\/p>\n<\/p><\/div>\n<p>&#8220;The unparalleled flexibility of our FINFLEX\u2122 innovation provides tremendous chip design advantage and flexibility to optimize for high performance, low power, or a balance between the two,&#8221; said Dan Kochpatcharin, head of Design Infrastructure Management Division at TSMC. &#8220;Our latest collaboration with Ansys on TSMC&#8217;s 3nm technology makes it easy for our mutual customers to take advantage of FINFLEX&#8217;s benefits with full confidence in the power integrity and reliability signoff verification results from RedHawk-SC and Totem.&#8221;<\/p>\n<p>Based on TSMC&#8217;s N3E process technology, TSMC FINFLEX\u00a0architecture allows chip designers to choose from three options of FIN configurations for each standard cell implementation: One for highest performance and fastest clock frequencies, one for balanced efficient performance, and an ultra-power efficiency for the lowest leakage and highest density. This combination of characteristics enables chip designers to choose the best speed-performance option for each of the key functional blocks on a chip using the same design toolset.<\/p>\n<p>&#8220;Ansys has developed an integrated software platform of multiphysics simulation and analysis tools with an emphasis on power management to minimize the design and operating costs of semiconductors,&#8221; said <span class=\"xn-person\">John Lee<\/span>, vice president and general manager of the electronics, semiconductor and optics business unit at Ansys. &#8220;Our ongoing collaboration with TSMC aligns with our efforts to enable a sustainable technology future, enabling mutual customers to improve chip performance while reducing power consumption.&#8221;<\/p>\n<p>\n        <b>\/ About Ansys<\/b>\n      <\/p>\n<p>When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.<\/p>\n<p>Take a leap of certainty \u2026 with Ansys.<\/p>\n<p>Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in <span class=\"xn-location\">the United States<\/span> or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.<\/p>\n<p>ANSS\u2013T<\/p>\n<p>\n        <b>\/ Contacts<\/b>\n      <\/p>\n<div>\n<table border=\"1\" cellspacing=\"0\" cellpadding=\"0\" class=\"prnbcc\">\n<tr>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n<p class=\"prnml4\">\n                <span class=\"prnews_span\">Media<\/span>\n              <\/p>\n<\/td>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n<p class=\"prnml4\">\n                <span class=\"prnews_span\">Mary Kate Joyce<\/span>\n              <\/p>\n<\/td>\n<\/tr>\n<tr>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n              \n            <\/td>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n<p class=\"prnml4\">\n                <span class=\"prnews_span\">724.820.4368<\/span>\n              <\/p>\n<\/td>\n<\/tr>\n<tr>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n              \n            <\/td>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n<p class=\"prnml4\">\n                <span class=\"prnews_span\"><br \/>\n                  <a href=\"mailto:marykate.joyce@ansys.com\" target=\"_blank\" class=\"prnews_a\" rel=\"nofollow noopener\">marykate.joyce@ansys.com<\/a><br \/>\n                <\/span>\n              <\/p>\n<\/td>\n<\/tr>\n<tr>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n              \n            <\/td>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n              \n            <\/td>\n<\/tr>\n<tr>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n<p class=\"prnml4\">\n                <span class=\"prnews_span\">Investors<\/span>\n              <\/p>\n<\/td>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n<p class=\"prnml4\">\n                <span class=\"prnews_span\">Kelsey DeBriyn<\/span>\n              <\/p>\n<\/td>\n<\/tr>\n<tr>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n              \n            <\/td>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n<p class=\"prnml4\">\n                <span class=\"prnews_span\">724.820.3927<\/span>\n              <\/p>\n<\/td>\n<\/tr>\n<tr>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n              \n            <\/td>\n<td class=\"prngen2\" colspan=\"1\" rowspan=\"1\">\n<p class=\"prnml4\">\n                <span class=\"prnews_span\"><br \/>\n                  <a href=\"mailto:kelsey.debriyn@ansys.com\" target=\"_blank\" class=\"prnews_a\" rel=\"nofollow noopener\">kelsey.debriyn@ansys.com<\/a>\u00a0<\/span>\n              <\/p>\n<\/td>\n<\/tr>\n<\/table><\/div>\n<p>\u00a0<\/p>\n<div class=\"PRN_ImbeddedAssetReference\" id=\"DivAssetPlaceHolder2\">\n<p>\n          <a href=\"https:\/\/mma.prnewswire.com\/media\/338688\/ansys__inc__logo.html\" target=\"_blank\" rel=\"nofollow noopener\"><br \/>\n            <img decoding=\"async\" src=\"https:\/\/mma.prnewswire.com\/media\/338688\/ansys__inc__logo.jpg\" title=\"Ansys logo. (PRNewsFoto\/ANSYS, Inc.)\" alt=\"Ansys logo. (PRNewsFoto\/ANSYS, Inc.)\" \/><br \/>\n          <\/a>\n        <\/p>\n<\/p><\/div>\n<p id=\"PURL\">\n        <img loading=\"lazy\" decoding=\"async\" title=\"Cision\" width=\"12\" height=\"12\" alt=\"Cision\" src=\"https:\/\/c212.net\/c\/img\/favicon.png?sn=NE18038&amp;sd=2022-10-28\" \/> View original content to download multimedia:<a id=\"PRNURL\" rel=\"nofollow noopener\" href=\"https:\/\/www.prnewswire.com\/news-releases\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture-301662310.html\" target=\"_blank\">https:\/\/www.prnewswire.com\/news-releases\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture-301662310.html<\/a><\/p>\n<p>SOURCE  Ansys<\/p>\n<\/p><\/div>\n<p>    <img decoding=\"async\" alt=\"\" src=\"https:\/\/rt.prnewswire.com\/rt.gif?NewsItemId=NE18038&amp;Transmission_Id=202210280900PR_NEWS_USPR_____NE18038&amp;DateId=20221028\" style=\"border:0px;width:1px;height:1px\" \/><\/p>\n","protected":false},"excerpt":{"rendered":"<p>PR Newswire Ansys is certified for TSMC&#8217;s innovative FINFLEX \u2122 architecture on N3E for flexible power\/performance tradeoffs \/ Key Highlights Ansys\u00ae Redhawk-SC\u2122 and Ansys\u00ae Totem\u2122 power integrity platforms are certified for TSMC&#8217;s FINFLEX\u2122 architecture on N3E The certification also extends to the TSMC N4 process technology PITTSBURGH , Oct. 28, 2022 \/PRNewswire\/ &#8212; Ansys\u00a0(NASDAQ: ANSS) and TSMC continued their long-standing technology collaboration to announce certification of Ansys&#8217; power integrity software for TSMC&#8217;s FINFLEX\u2122 innovation as well as the TSMC N4 process. TSMC&#8217;s FINFLEX\u2122 architecture allows Ansys RedHawk-SC and Totem customers to make fine-grained speed-power tradeoffs which reduce a chip&#8217;s power footprint without sacrificing performance. This is important for lowering the environmental impact of many semiconductor applications, including machine learning, 5G &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Ansys Multiphysics Solutions Achieve Certification for TSMC N4 Process and TSMC FINFLEX\u2122 Architecture&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-702588","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Ansys Multiphysics Solutions Achieve Certification for TSMC N4 Process and TSMC FINFLEX\u2122 Architecture - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Ansys Multiphysics Solutions Achieve Certification for TSMC N4 Process and TSMC FINFLEX\u2122 Architecture - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"PR Newswire Ansys is certified for TSMC&#8217;s innovative FINFLEX \u2122 architecture on N3E for flexible power\/performance tradeoffs \/ Key Highlights Ansys\u00ae Redhawk-SC\u2122 and Ansys\u00ae Totem\u2122 power integrity platforms are certified for TSMC&#8217;s FINFLEX\u2122 architecture on N3E The certification also extends to the TSMC N4 process technology PITTSBURGH , Oct. 28, 2022 \/PRNewswire\/ &#8212; Ansys\u00a0(NASDAQ: ANSS) and TSMC continued their long-standing technology collaboration to announce certification of Ansys&#8217; power integrity software for TSMC&#8217;s FINFLEX\u2122 innovation as well as the TSMC N4 process. TSMC&#8217;s FINFLEX\u2122 architecture allows Ansys RedHawk-SC and Totem customers to make fine-grained speed-power tradeoffs which reduce a chip&#8217;s power footprint without sacrificing performance. This is important for lowering the environmental impact of many semiconductor applications, including machine learning, 5G &hellip; Continue reading &quot;Ansys Multiphysics Solutions Achieve Certification for TSMC N4 Process and TSMC FINFLEX\u2122 Architecture&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2022-10-28T13:17:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/mma.prnewswire.com\/media\/1931979\/Ansys_RedHawk_SC.jpg\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Ansys Multiphysics Solutions Achieve Certification for TSMC N4 Process and TSMC FINFLEX\u2122 Architecture\",\"datePublished\":\"2022-10-28T13:17:00+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\\\/\"},\"wordCount\":543,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/mma.prnewswire.com\\\/media\\\/1931979\\\/Ansys_RedHawk_SC.jpg\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\\\/\",\"name\":\"Ansys Multiphysics Solutions Achieve Certification for TSMC N4 Process and TSMC FINFLEX\u2122 Architecture - 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Market Newsdesk","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.marketnewsdesk.com\/index.php\/ansys-multiphysics-solutions-achieve-certification-for-tsmc-n4-process-and-tsmc-finflex-architecture\/","og_locale":"en_US","og_type":"article","og_title":"Ansys Multiphysics Solutions Achieve Certification for TSMC N4 Process and TSMC FINFLEX\u2122 Architecture - Market Newsdesk","og_description":"PR Newswire Ansys is certified for TSMC&#8217;s innovative FINFLEX \u2122 architecture on N3E for flexible power\/performance tradeoffs \/ Key Highlights Ansys\u00ae Redhawk-SC\u2122 and Ansys\u00ae Totem\u2122 power integrity platforms are certified for TSMC&#8217;s FINFLEX\u2122 architecture on N3E The certification also extends to the TSMC N4 process technology PITTSBURGH , Oct. 28, 2022 \/PRNewswire\/ &#8212; Ansys\u00a0(NASDAQ: ANSS) and TSMC continued their long-standing technology collaboration to announce certification of Ansys&#8217; power integrity software for TSMC&#8217;s FINFLEX\u2122 innovation as well as the TSMC N4 process. TSMC&#8217;s FINFLEX\u2122 architecture allows Ansys RedHawk-SC and Totem customers to make fine-grained speed-power tradeoffs which reduce a chip&#8217;s power footprint without sacrificing performance. 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