{"id":538590,"date":"2021-09-15T09:03:18","date_gmt":"2021-09-15T13:03:18","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/macom-demonstrates-tia-interoperability-with-broadcom-pam-4-dsp-for-data-center-applications\/"},"modified":"2021-09-15T09:03:18","modified_gmt":"2021-09-15T13:03:18","slug":"macom-demonstrates-tia-interoperability-with-broadcom-pam-4-dsp-for-data-center-applications","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/macom-demonstrates-tia-interoperability-with-broadcom-pam-4-dsp-for-data-center-applications\/","title":{"rendered":"MACOM Demonstrates TIA Interoperability with Broadcom PAM-4 DSP for Data Center Applications"},"content":{"rendered":"

<\/p>\n

MACOM Demonstrates TIA Interoperability with Broadcom PAM-4 DSP for Data Center Applications<\/b><\/p>\n

LOWELL, Mass.–(BUSINESS WIRE<\/a>)–
\nMACOM Technology Solutions Inc. (\u201cMACOM\u201d), a leading supplier of semiconductor products, today announced a collaboration that demonstrates interoperability of Broadcom\u2019s PAM-4 DSP and MACOM\u2019s transimpedance amplifiers (TIAs) for 53 Gbps per lane VCSEL based short reach and 100 Gbps per lane EML based long reach data center applications.\n<\/p>\n

\nThe pairing for single-mode long reach solutions includes Broadcom\u2019s 7nm Centenario DSP (BCM874xx) with MACOM\u2019s four-channel 4×106 Gbps PAM-4 linear transimpedance amplifiers (TIAs) optimized for use in 400G and 800G DR4 and FR4 optical modules. The MATA-03819, MATA-03820 and MATA-03821 are available in flip chip and wire bonding options, respectively, for fast, flexible deployment of QSFP-DD and OSFP optical modules.\n<\/p>\n

\nThe pairing for multi-mode short reach solutions includes Broadcom\u2019s 7nm Estoque DSP (BCM875xx) with MACOM\u2019s two-chip analog solution for 200 Gbps and 400 Gbps short reach SR4 and SR8 modules (QSFP, OSFP, QSFP-DD) and Active Optical Cable (AOC) applications in the data center. The MACOM chipset consists of two devices, the MATA-38434 4×53 Gbps PAM-4 TIA and MATA-38435 4×53 Gbps PAM-4 VCSEL driver, that deliver IEEE standard specified performance and are compliant with Open Eye MSA eye mask specifications.\n<\/p>\n

\n\u201cOur customers require high-performance solutions to enable their data center applications,\u201d said Marek Tlalka, Senior Director, High-Performance Analog, MACOM. \u201cThis collaboration offers the industry another proof point towards the interoperability of DSPs to MACOM\u2019s TIA portfolio, and a path to shorter design cycle for 400G and 800G module manufacturers.\u201d\n<\/p>\n

\n\u201cBroadcom’s 7nm DSPs along with MACOM\u2019s TIAs provides industry leading performance at the lowest power for 200G\/400G\/800G optical modules,\u201d said Khushrow Machhi, Senior Director of Marketing, Physical Layer Products Division, Broadcom. \u201cAdditionally these various modules show the interoperability of Broadcom’s DSP with various components needed to develop industry leading optical modules.\u201d\n<\/p>\n

About MACOM<\/b><\/p>\n

\nMACOM designs and manufactures semiconductor products for Telecommunications, Industrial and Defense and Datacenter applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM, MACOM Technology Solutions and related logos are trademarks of MACOM Technology Solutions Holdings, Inc. All other trademarks are the property of their respective owners.\n<\/p>\n

FOR SALES INFORMATION, PLEASE CONTACT:<\/b><\/p>\n

\nNorth Americas \u2013 Phone: +1.800.366.2266
\n
Europe \u2013 Phone: +353.21.244.6400
\n
Japan \u2013 Phone: +81.3.5472.1609
\n
China \u2013 Phone: +86.21.2407.1588\n<\/p>\n

\"\"<\/p>\n

View source version on businesswire.com: <\/span>https:\/\/www.businesswire.com\/news\/home\/20210915005614\/en\/<\/a><\/span><\/p>\n

\nOzzie Billimoria
\n
978-935-6569\n<\/p>\n

KEYWORDS:<\/b> United States North America Massachusetts<\/p>\n

INDUSTRY KEYWORDS:<\/b> Semiconductor Security Satellite Photography Nanotechnology Audio\/Video Other Technology Telecommunications Software Networks Internet Hardware Electronic Design Automation Data Management Consumer Electronics VoIP Technology Mobile\/Wireless<\/p>\n

MEDIA:<\/b><\/p>\n\n","protected":false},"excerpt":{"rendered":"

MACOM Demonstrates TIA Interoperability with Broadcom PAM-4 DSP for Data Center Applications LOWELL, Mass.–(BUSINESS WIRE)– MACOM Technology Solutions Inc. (\u201cMACOM\u201d), a leading supplier of semiconductor products, today announced a collaboration that demonstrates interoperability of Broadcom\u2019s PAM-4 DSP and MACOM\u2019s transimpedance amplifiers (TIAs) for 53 Gbps per lane VCSEL based short reach and 100 Gbps per lane EML based long reach data center applications. The pairing for single-mode long reach solutions includes Broadcom\u2019s 7nm Centenario DSP (BCM874xx) with MACOM\u2019s four-channel 4×106 Gbps PAM-4 linear transimpedance amplifiers (TIAs) optimized for use in 400G and 800G DR4 and FR4 optical modules. The MATA-03819, MATA-03820 and MATA-03821 are available in flip chip and wire bonding options, respectively, for fast, flexible deployment of QSFP-DD and … <\/p>\n

Continue reading “MACOM Demonstrates TIA Interoperability with Broadcom PAM-4 DSP for Data Center Applications”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-538590","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nMACOM Demonstrates TIA Interoperability with Broadcom PAM-4 DSP for Data Center Applications - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/macom-demonstrates-tia-interoperability-with-broadcom-pam-4-dsp-for-data-center-applications\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"MACOM Demonstrates TIA Interoperability with Broadcom PAM-4 DSP for Data Center Applications - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"MACOM Demonstrates TIA Interoperability with Broadcom PAM-4 DSP for Data Center Applications LOWELL, Mass.–(BUSINESS WIRE)– MACOM Technology Solutions Inc. (\u201cMACOM\u201d), a leading supplier of semiconductor products, today announced a collaboration that demonstrates interoperability of Broadcom\u2019s PAM-4 DSP and MACOM\u2019s transimpedance amplifiers (TIAs) for 53 Gbps per lane VCSEL based short reach and 100 Gbps per lane EML based long reach data center applications. The pairing for single-mode long reach solutions includes Broadcom\u2019s 7nm Centenario DSP (BCM874xx) with MACOM\u2019s four-channel 4×106 Gbps PAM-4 linear transimpedance amplifiers (TIAs) optimized for use in 400G and 800G DR4 and FR4 optical modules. 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