{"id":535406,"date":"2021-09-08T07:33:14","date_gmt":"2021-09-08T11:33:14","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/new-applied-materials-technologies-help-leading-silicon-carbide-chipmakers-accelerate-the-transition-to-200mm-wafers-and-increase-chip-performance-and-power-efficiency\/"},"modified":"2021-09-08T07:33:14","modified_gmt":"2021-09-08T11:33:14","slug":"new-applied-materials-technologies-help-leading-silicon-carbide-chipmakers-accelerate-the-transition-to-200mm-wafers-and-increase-chip-performance-and-power-efficiency","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/new-applied-materials-technologies-help-leading-silicon-carbide-chipmakers-accelerate-the-transition-to-200mm-wafers-and-increase-chip-performance-and-power-efficiency\/","title":{"rendered":"New Applied Materials Technologies Help Leading Silicon Carbide Chipmakers Accelerate the Transition to 200mm Wafers and Increase Chip Performance and Power Efficiency"},"content":{"rendered":"<div class=\"mw_release\">\n<ul type=\"disc\">\n<li>\n          <em>Key to the world\u2019s best electric vehicle power trains, silicon carbide chips are transitioning to larger, 200mm wafers which boost output to meet growing global demand<\/em>\n        <\/li>\n<li>\n          <em>Applied\u2019s new 200mm CMP system precisely removes silicon carbide material from wafers to help maximize chip performance, reliability and yield<\/em>\n        <\/li>\n<li>\n          <em>Applied\u2019s new \u201chot implant\u201d technology for silicon carbide chips injects ions with minimum damage to crystalline structures, thereby maximizing power generation and device yield<\/em><br \/>\n          \n        <\/li>\n<\/ul>\n<p>SANTA CLARA, Calif., Sept.  08, 2021  (GLOBE NEWSWIRE) &#8212; Applied Materials, Inc. today announced new products that help enable the world\u2019s leading silicon carbide (SiC) chipmakers transition from 150mm wafer production to 200mm production, which approximately doubles die output per wafer, to help satisfy the world\u2019s growing demand for premium electric vehicle powertrains.<\/p>\n<p>SiC power semiconductors are in high demand because they help efficiently convert battery power to torque, thereby increasing vehicle performance and range. Compared to silicon, SiC is inherently\u00a0harder with natural defects that can lead to degradation of electrical performance, power efficiency, reliability and yield. Advanced materials engineering is needed to optimize raw wafers for production and build circuits with minimum damage to the crystal lattice.<\/p>\n<p>\u201cTo fuel the computer revolution, chipmakers moved to ever-larger wafer sizes, dramatically increasing chip output to satisfy burgeoning global demand,\u201d said Sundar Ramamurthy, Group Vice President and General Manager of the ICAPS group at Applied Materials. \u201cToday we are in the early stages of another revolution that will benefit from Applied\u2019s expertise in materials engineering at an industrial scale.\u201d<\/p>\n<p>\u201cElectrification of the transportation industry is a rising trend, and we are accelerating this inflection point by leading the global transition from silicon to silicon carbide with our Wolfspeed technology,\u201d said Gregg Lowe, President and CEO of Cree, Inc. \u201cDelivering the highest-performing silicon carbide power devices on larger 200mm wafers enables us to increase end-customer value and meet growing demand.\u201d<\/p>\n<p>\u201cApplied\u2019s support in helping speed qualification of 200mm processes in Albany and multi-equipment installations at our Mohawk Valley Fab is expediting this transition,\u201d Lowe added. \u201cMoreover, new technologies being developed by Applied\u2019s ICAPS team, such as hot implant, have broadened and deepened our technical collaboration and helped accelerate our power technology roadmap.\u201d<\/p>\n<p>\n        <strong>New 200mm SiC CMP System<\/strong>\n      <\/p>\n<p>SiC wafer surface quality is critically important to SiC device fabrication as any defects on the surface of the wafer will migrate through the subsequent layers. To produce uniform wafers with the highest quality surfaces, Applied has developed the Mirra<sup>\u00ae<\/sup> Durum\u2122 CMP* system which integrates polishing, measurement of material removal, cleaning and drying in a single system. The new system has demonstrated a 50X reduction in finished wafer surface roughness as compared to mechanically grinded SiC wafers and a 3X reduction in roughness compared to batch CMP processing systems.<\/p>\n<p>\n        <strong>Hot Implant Increases SiC Chip Performance and Power Efficiency<\/strong>\n      <\/p>\n<p>During SiC chip fabrication, ion implantation places dopants within the material to help enable and direct the flow of current within the high power producing circuits. The density and hardness of SiC material makes it extremely challenging to inject, accurately place and activate the dopants while minimizing damage to the crystal lattice which reduces performance and power efficiency. Applied has solved this challenge with its new VIISta<sup>\u00ae<\/sup> 900 3D hot ion implant system for 150mm and 200mm SiC wafers. The hot implant technology injects ions with minimal damage to the lattice structure, resulting in a more than 40X reduction in resistivity compared to implant at room temperature.<\/p>\n<p>Applied\u2019s ICAPS (IoT, Communications, Automotive, Power and Sensors) business is developing additional products for the SiC power chip market including in PVD*, CVD*, etch and process control. Additional details on how Applied is enabling advancements in SiC and other specialty semiconductor technologies will be discussed at the company\u2019s <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=A75y13fKXz09HrE2q6xXkR_a82iZmfCQWW7WEqOGe2zOZ3mv_qfXBwjPwcSTzExZM3f30AtL2zfY0b96W0D8cz4Y0R55JQ7e3832G-eirvpgp87vsW9-Jbz0ZUCy-L3CMJ-IoNJ3sy76WdqVIXgtGoUjmRMIJrcmVzZAPgmKoowJ-OmDfoh-XymzQcLvU-5KQXVRnJeVDeZ_wWXh34Jqpw==\" rel=\"nofollow noopener\" target=\"_blank\">2021 ICAPS and Packaging Master Class<\/a> being held today.<\/p>\n<p>\n        <strong>About\u00a0Applied Materials<\/strong><br \/>\n        <br \/>Applied Materials, Inc.\u00a0(Nasdaq: AMAT) is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At\u00a0Applied Materials, our innovations make possible a better future. Learn more at\u00a0<a href=\"https:\/\/www.globenewswire.com\/Tracker?data=dHqz4_dDzborh3wpMJBEl3xOB9CI2F7yOlTnZqJYO3oodRnHbYEdwfI7v5HFOhKAYCmCV7_3v2y_WcAuOHxKjiXn4s_GOO2QQOTpIjB3KRE=\" rel=\"nofollow noopener\" target=\"_blank\">www.appliedmaterials.com<\/a>.<\/p>\n<p>*CMP = chemical mechanical planarization. PVD = physical vapor deposition. CVD = chemical vapor deposition.<\/p>\n<p>\n        <strong>Contact:<\/strong><br \/>\n        <br \/>\n        <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=ATHaG3whRCwQswbP3JkH_iSOqmXekt8z_gYDLqJVuy1Gu6KGkpFQjgOI69dNxADWuqVcdEJkicVk4ZMfJCz13fzQNLrdaxE0txtHUnSMyl0=\" rel=\"nofollow noopener\" target=\"_blank\">Ricky Gradwohl<\/a> (editorial\/media) 408.235.4676<br \/><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=3bAC1RtBVOy0mbr5cPKG1dQnp2p0-Wu3uWXCGfQwE_UK8RRSjLx8CBeawut9qBqzcituMhVEaNOP0cnny5BgRSiJphNqGe73TY2SQltyTJ0=\" rel=\"nofollow noopener\" target=\"_blank\">Michael Sullivan<\/a> (financial community) 408.986.7977<\/p>\n<p>Photos accompanying this announcement\u00a0are available at:<br \/><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=eqsmX731VqK5pTe_CJnEhA3CjMEN5x1MgZfqRnqtoe8ZRFBbNebLEiItQqLw5DjlzzE1FrvIIN4MeqoPeKT6kMzCpk7OaRcKw6iB8FwmnsfNtDNtJtHRZuV4bdtxOyJfey7lHNCw7OUO06MMloyqQvr4cOChJdvM8UaZ8Z_jyK3v81Lk802-ZaLxzpfNqFDlB-Ymlwd6ElnFc6o8G1DmYSKgHsQKkS4HUQ8FbDD_GxOc6ovjAKqzY5cQBCS2JF2sDr1WcfmaxDoeS_CeX_iNSA==\" rel=\"nofollow noopener\" target=\"_blank\">https:\/\/www.globenewswire.com\/NewsRoom\/AttachmentNg\/add820f0-0e08-499b-a903-209ffaede712<\/a><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=Butltsc2xu-xCrF_5a3kcXFOySJQnJpphvmRIUBBKz0aiDHBdGPsPiEGawWa4ayV8ief695fd5dr9aj2c8vdrh_AwofrhkmnkJwtN5B25BFzBz3vY4IeFi0U5AJgCG_UaV46p0QvXCFJ5_UtluQ6XQ==\" rel=\"nofollow noopener\" target=\"_blank\"><br \/><\/a><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=eqsmX731VqK5pTe_CJnEhA3CjMEN5x1MgZfqRnqtoe8ZRFBbNebLEiItQqLw5DjlhzFsxgsPBavChs3Bn1QTXIWL54uOlgNbDx1wng6ZE6tIR0IUutJ2Ghk2_9f6KQVTXOE2az18u_c5LevC8NOK1rmTqfIc5lbGC6GvM3fUhxdLsBMPDloyTEz_dhGWpMu-OOku7LJexWdzAYNHL6UHJ1NoBSqk92M6IpJz6av1NE2tqaslDkgmEZ0f4MFnDgWOiQLC-wsu2CARWUUl5Xtvdw==\" rel=\"nofollow noopener\" target=\"_blank\">https:\/\/www.globenewswire.com\/NewsRoom\/AttachmentNg\/cdcb6c1c-55ed-4247-8b13-8ae2a397d3a6<\/a>\u00a0<\/p>\n<p>These photos\u00a0are also available at Newscom,\u00a0<a href=\"https:\/\/www.globenewswire.com\/Tracker?data=6WiS51PujpLSK2cuZz8TvByZOF26dZw8uITm2TTQxxY_-W2d2QN5VPl_MsESpEfROG_NmM10YQtOU5gmOwYC8Q==\" rel=\"nofollow noopener\" target=\"_blank\">www.newscom.com<\/a>, and via AP PhotoExpress.<\/p>\n<p>      <img decoding=\"async\" class=\"__GNW8366DE3E__IMG\" src=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=ODMyMTg4NiM0MzkzNjEzIzIwMDcxNDQ=\" \/><br \/>\n      <br \/>\n      <img decoding=\"async\" src=\"https:\/\/ml.globenewswire.com\/media\/YmUwNzNhNzItMWE5Ny00MWY5LTkxYzItY2M4NGE2NTk5MDMzLTEwMTg3MTc=\/tiny\/Applied-Materials-Inc-.png\" \/>\n    <\/div>\n<div class=\"mw_contactinfo\"><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Key to the world\u2019s best electric vehicle power trains, silicon carbide chips are transitioning to larger, 200mm wafers which boost output to meet growing global demand Applied\u2019s new 200mm CMP system precisely removes silicon carbide material from wafers to help maximize chip performance, reliability and yield Applied\u2019s new \u201chot implant\u201d technology for silicon carbide chips injects ions with minimum damage to crystalline structures, thereby maximizing power generation and device yield SANTA CLARA, Calif., Sept. 08, 2021 (GLOBE NEWSWIRE) &#8212; Applied Materials, Inc. today announced new products that help enable the world\u2019s leading silicon carbide (SiC) chipmakers transition from 150mm wafer production to 200mm production, which approximately doubles die output per wafer, to help satisfy the world\u2019s growing demand for premium &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/new-applied-materials-technologies-help-leading-silicon-carbide-chipmakers-accelerate-the-transition-to-200mm-wafers-and-increase-chip-performance-and-power-efficiency\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;New Applied Materials Technologies Help Leading Silicon Carbide Chipmakers Accelerate the Transition to 200mm Wafers and Increase Chip Performance and Power Efficiency&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-535406","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with 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