{"id":526112,"date":"2021-08-10T12:16:01","date_gmt":"2021-08-10T16:16:01","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip\/"},"modified":"2021-08-10T12:16:01","modified_gmt":"2021-08-10T16:16:01","slug":"amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip\/","title":{"rendered":"Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }\n.bwlistdisc { list-style-type: disc }\n.bwuline { text-decoration: underline }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b><i>Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP<\/i><\/b><\/p>\n<p><b>Highlights<\/b><\/p>\n<ul class=\"bwlistdisc\">\n<li>\nAmkor is advancing the evolution of 5G RF module design\n<\/li>\n<li>\nAmkor DSMBGA enables integration of more components\n<\/li>\n<li>\nThe advanced packaging market for 5G RF Front End Module (FEM) projected to reach US $2.3B by 2026\n<\/li>\n<li>\nAmkor continues to innovate in advanced SiP technologies\n<\/li>\n<\/ul>\n<p>TEMPE, Ariz.&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<br \/>\nAmkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module design, characterization and packaging technology.\n<\/p>\n<p>\nWith the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other 5G-enabled devices. Amkor\u2019s double-sided, molded ball grid array (DSMBGA) is a prime example of such solutions. Expanding on years of experience in delivering world-class, advanced System in Package (SiP) technology, Amkor was the first OSAT to offer DSMBGA and continues to pave the way for further breakthroughs.\n<\/p>\n<p>\n\u201cWith our DSMBGA platform, we\u2019ve established a preferred advanced packaging solution for this domain,\u201d said Giel Rutten, Amkor President and Chief Executive Officer. \u201cApplying leading-edge design rules for 3D component placement and double-sided molding\u2014together with conformal and compartmental shielding and in-line RF testing\u2014delivers best-in-class integration levels in a small form factor in a high yield manufacturing process.\u201d\n<\/p>\n<p>\nThe advanced packaging market for 5G RF FEM is projected to reach US $2.3 billion by 2026, representing a 30% compound annual growth rate (CAGR) according to Yole D\u00e9veloppement (Yole), SA, an industry consulting firm<sup>1<\/sup>.\n<\/p>\n<p>\n\u201cThere has been a change in frequencies with the arrival of 5G, adding frequency bands above 3 GHz in FR1, and mmWave in FR2,\u201d according to Antoine Bonnabel, Technology &amp; Market Analyst, RF Devices and Technology at Yole. \u201cThis and the system-level trend have had a profound impact on both the number of components, and the technology platforms on which they are built.\u201d<sup>2<\/sup><\/p>\n<p>\nThis growing number of new frequencies, combined with the variety of multiplexing methods, significantly increases the complexity of the RF front end. Integration using SiP allows customers to design, tune and test RF sub-systems, allowing for a reduction in design iterations and an accelerated time-to-market.\n<\/p>\n<p>\nAmkor\u2019s double-sided packaging technology has vastly increased the level of integration for RF front-end modules used in smartphones and other mobile devices. Common RF front-end modules consist of an LNA (low noise amplifier), power amp, an RF switch, RF filters and duplexers.\n<\/p>\n<p>\nAmkor\u2019s advanced SiP design rules and innovative DSMBGA technology enable the integration of additional components\u2014such as antenna tuners and passive components\u2014where device motherboard real estate is at a premium. This creates the most advanced and compact RF front-end module on the market today.\n<\/p>\n<p>\nWith additional power amplification and filtering circuitry, DSMBGA improves signal integrity and reduces losses, resulting in improved Rx\/Tx amplification\u2014which translates into reduced system power requirements.\n<\/p>\n<p>\nAmkor also applies state-of-the-art conformal and compartmental shielding for EMI isolation and attenuation and implements in-line RF testing to deliver the most robust and cost-effective assembly technology in the industry.\n<\/p>\n<p>\nIn addition to its formidable SiP capacity and DSMBGA technology, Amkor has developed an extensive toolset to maximize performance and to address the sophisticated packaging formats required to productize 5G applications. Some of these tools include Antenna in Package (AiP), substrate-embedded die, wafer-level SiP and a variety of RF shielding options.\n<\/p>\n<p>\nThis toolset, combined with the company\u2019s expertise in RF module design, characterization and bench test, uniquely positions Amkor to serve customers who want to outsource the challenges (including substantial investment) associated with combining multiple ICs with advanced package assembly and test technologies for 5G networks.\n<\/p>\n<p>\nAs demand for packages that support 5G increases, Amkor supports this growth with the successful implementation of DSMBGA technology. Amkor has been in high-volume markets with DSMBGA for more than a year and is a leader in RF package design, integration and test. Amkor continues to innovate in DSMBGA and other advanced SiP technologies to capture opportunities in the RF market. To learn more about Amkor\u2019s capabilities in SiP and DSMBGA, visit <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Famkor.com%2Fdsmbga&amp;esheet=52474324&amp;newsitemid=20210810005796&amp;lan=en-US&amp;anchor=https%3A%2F%2Famkor.com%2Fdsmbga&amp;index=1&amp;md5=6376b28a96915acec9f21dd8f41131ae\">https:\/\/amkor.com\/dsmbga<\/a>.\n<\/p>\n<p><b>About Amkor Technology, Inc.<\/b><\/p>\n<p>\nAmkor Technology, Inc. is one of the world\u2019s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world\u2019s leading semiconductor companies, foundries and electronics OEMs. Amkor\u2019s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. For more information, <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.amkor.com&amp;esheet=52474324&amp;newsitemid=20210810005796&amp;lan=en-US&amp;anchor=www.amkor.com&amp;index=2&amp;md5=cb38c495b78f3a2114b0d526a3f0e157\">www.amkor.com<\/a>.\n<\/p>\n<p>\n____________________________________________\n<\/p>\n<p><sup>1<\/sup> Source: <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.i-micronews.com%2Fproducts%2F5g-packaging-trends-for-smartphones%2F&amp;esheet=52474324&amp;newsitemid=20210810005796&amp;lan=en-US&amp;anchor=5G+Packaging+Trends+for+Smartphones+2021+report&amp;index=3&amp;md5=f62367c8e68c530ba76fa95b24f02cad\">5G Packaging Trends for Smartphones 2021 report<\/a>, Yole D\u00e9veloppement, 2021<br \/>\n<br \/><sup>2<\/sup> Source: <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.i-micronews.com%2Fproducts%2Fcellular-rf-front-end-technologies-for-mobile-handset-2021%2F&amp;esheet=52474324&amp;newsitemid=20210810005796&amp;lan=en-US&amp;anchor=Cellular+RF+Front-End+Technologies+for+Mobile+Handset+2021+report&amp;index=4&amp;md5=79a581eb4175414b034807fb7cf61f4b\">Cellular RF Front-End Technologies for Mobile Handset 2021 report<\/a>, Yole D\u00e9veloppement, 2021\n<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20210810005796r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20210810005796\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20210810005796\/en\/<\/a><\/span><\/p>\n<p><span class=\"bwuline\">Investor Relations<br \/>\n<\/span><br \/>Jennifer Jue<br \/>\n<br \/>Senior Director, Investor Relations and Finance<br \/>\n<br \/>480-786-7594\n<\/p>\n<p><span class=\"bwuline\">Media Relations<br \/>\n<\/span><br \/>Debi Polo<br \/>\n<br \/>Director, Marketing Communications<br \/>\n<br \/>480-786-7653\n<\/p>\n<p><b>Social Media: <\/b>@amkortechnology\n<\/p>\n<p><b>KEYWORDS:<\/b> United States North America Arizona<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Semiconductor Hardware Consumer Electronics Other Technology Technology<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20210810005796\/en\/1118403\/3\/Amkor_logo_-_CMYK.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP Highlights Amkor is advancing the evolution of 5G RF module design Amkor DSMBGA enables integration of more components The advanced packaging market for 5G RF Front End Module (FEM) projected to reach US $2.3B by 2026 Amkor continues to innovate in advanced SiP technologies TEMPE, Ariz.&#8211;(BUSINESS WIRE)&#8211; Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module design, characterization and packaging technology. With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other 5G-enabled devices. Amkor\u2019s double-sided, molded ball grid array (DSMBGA) is &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-526112","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP Highlights Amkor is advancing the evolution of 5G RF module design Amkor DSMBGA enables integration of more components The advanced packaging market for 5G RF Front End Module (FEM) projected to reach US $2.3B by 2026 Amkor continues to innovate in advanced SiP technologies TEMPE, Ariz.&#8211;(BUSINESS WIRE)&#8211; Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module design, characterization and packaging technology. With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other 5G-enabled devices. 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(Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module design, characterization and packaging technology. With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other 5G-enabled devices. Amkor\u2019s double-sided, molded ball grid array (DSMBGA) is &hellip; Continue reading \"Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip\/","og_site_name":"Market Newsdesk","article_published_time":"2021-08-10T16:16:01+00:00","og_image":[{"url":"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20210810005796r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"4 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP","datePublished":"2021-08-10T16:16:01+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip\/"},"wordCount":849,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip\/#primaryimage"},"thumbnailUrl":"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20210810005796r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-empowers-rf-front-end-cellular-innovations-with-advanced-sip\/","name":"Amkor Empowers RF Front-End Cellular Innovations with Advanced SiP - 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