{"id":519832,"date":"2021-07-29T08:04:14","date_gmt":"2021-07-29T12:04:14","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/micron-launches-worlds-first-176-layer-nand-in-mobile-solutions-to-power-lightning-fast-5g-experiences\/"},"modified":"2021-07-29T08:04:14","modified_gmt":"2021-07-29T12:04:14","slug":"micron-launches-worlds-first-176-layer-nand-in-mobile-solutions-to-power-lightning-fast-5g-experiences","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/micron-launches-worlds-first-176-layer-nand-in-mobile-solutions-to-power-lightning-fast-5g-experiences\/","title":{"rendered":"Micron Launches World\u2019s First 176-Layer NAND in Mobile Solutions to Power Lightning-Fast 5G Experiences"},"content":{"rendered":"

\nAdvanced 3D NAND in Micron\u2019s mobile storage enables rich, seamless multimedia experiences
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BOISE, Idaho, July 29, 2021 (GLOBE NEWSWIRE) — Micron Technology, Inc., (Nasdaq: MU) announced today it has begun volume shipments of the world\u2019s first 176-layer NAND<\/a> Universal Flash Storage (UFS) 3.1 mobile solution. Engineered for high-end and flagship phones, Micron\u2019s discrete UFS 3.1 mobile NAND unlocks 5G\u2019s potential with up to 75% faster sequential write and random read performance than prior generations,1<\/sup> enabling downloads of two-hour 4K movies2<\/sup> in as little as 9.6 seconds.<\/p>\n

\n Micron\u2019s 176-layer NAND<\/a> offers a compact design ideal for the high capacity, small form factors required in mobile devices. This launch follows quickly on the heels of Micron\u2019s volume delivery of PCIe Gen4 solid-state drives with 176-layer NAND in June<\/a>, bringing high performance, design flexibility and low power consumption to professional workstations and ultrathin notebooks. Now available for smartphones, Micron\u2019s industry-pioneering advanced NAND technology and performance enables a more responsive mobile experience with true multitasking across apps.<\/p>\n

\u201c5G delivers multigigabit speeds to mobile devices, and a high-performance hardware foundation is critical to powering these lightning-fast mobile experiences,\u201d\u00a0said Raj\u00a0Talluri, senior vice president and general manager of Micron\u2019s Mobile Business Unit. \u201cOur breakthrough 176-layer NAND supercharges smartphones with unparalleled performance, delivering rich multimedia content to consumers\u2019 fingertips in a flash.\u201d<\/p>\n

Micron\u2019s 176-layer UFS 3.1 solution provides 15% faster mixed workload performance than its prior generation, enabling faster app launching and switching across multiple apps for a smoother mobile experience. Without storage as a bottleneck, users can take advantage of 5G\u2019s speeds with the powerful combination of UFS 3.1 and Micron\u2019s 176-layer NAND.<\/p>\n

\u201cMicron\u2019s first-of-its-kind combination of UFS 3.1 and 176-layer NAND will give our HONOR Magic3 Series an edge as the first smartphone to debut with this high-performance 3D NAND solution,\u201d said Fang Fei, president of product line at Honor Device Co., Ltd. \u201cUsers of our new flagship HONOR Magic3 Series will be able to enjoy snappy, seamless multitasking across apps, fast downloads and storage supported by Micron\u2019s industry-leading solution.\u201d<\/p>\n

Micron\u2019s 176-layer mobile solution features:<\/p>\n