{"id":512136,"date":"2021-07-13T02:03:09","date_gmt":"2021-07-13T06:03:09","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-umc-collaborate-on-22ulp-ull-reference-flow-certification-for-advanced-consumer-5g-and-automotive-designs\/"},"modified":"2021-07-13T02:03:09","modified_gmt":"2021-07-13T06:03:09","slug":"cadence-and-umc-collaborate-on-22ulp-ull-reference-flow-certification-for-advanced-consumer-5g-and-automotive-designs","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-umc-collaborate-on-22ulp-ull-reference-flow-certification-for-advanced-consumer-5g-and-automotive-designs\/","title":{"rendered":"Cadence and UMC Collaborate on 22ULP\/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }\n.bwlistdisc { list-style-type: disc }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b>Cadence and UMC Collaborate on 22ULP\/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs<\/b><\/p>\n<p class=\"bwalignc\"><b><i>Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs<\/i><\/b><\/p>\n<p>SAN JOSE, Calif. &amp; HSINCHU, Taiwan,&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<br \/>\nCadence Design Systems, Inc. (Nasdaq: CDNS) and United Microelectronics Corporation (NYSE:UMC; TWSE: 2303) (\u201cUMC\u201d), a global semiconductor foundry, today announced that the Cadence digital full flow has been optimized and certified for the UMC 22ULP\/ULL process technologies to accelerate consumer, 5G and automotive application design. The flow, which incorporates leading implementation and signoff technology for ultra-low power designs, enables mutual customers to deliver top-quality designs and achieve a faster path to tapeout. To learn more about the Cadence digital advanced-node solutions, please visit <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.cadence.com%2Fgo%2Fadvnd22&amp;esheet=52458671&amp;newsitemid=20210712005821&amp;lan=en-US&amp;anchor=www.cadence.com%2Fgo%2Fadvnd22&amp;index=1&amp;md5=fdc5b25b22c0909f5be4a4408a121e6e\">www.cadence.com\/go\/advnd22<\/a>.\n<\/p>\n<p>\nThe Cadence digital full flow that has been optimized for use on UMC\u2019s 22ULP\/ULL process technologies includes the Innovus<sup>\u2122<\/sup> Implementation System, Genus<sup>\u2122<\/sup> Synthesis Solution, Liberate<sup>\u2122<\/sup> Characterization, Quantus<sup>\u2122<\/sup> Extraction Solution, Tempus<sup>\u2122<\/sup> Timing Signoff Solution, Litho Physical Analyzer and Physical Verification System. Some of the flow\u2019s key capabilities that enable 22ULP\/ULL design are as follows:\n<\/p>\n<ul class=\"bwlistdisc\">\n<li><b>Best-in-class design implementation and optimization engines:<\/b> The engines are fully integrated from RTL to GDSII, enabling users to achieve power, performance and area (PPA) goals and reduce time to market.\n<\/li>\n<li><b>Optimal signoff convergence:<\/b> Cadence offers the only digital flow with fully integrated place-and-route, timing signoff, physical verification and IR drop\/power signoff capabilities, which provide unparalleled last-mile design closure with the fewest iterations to facilitate the timely delivery of advanced-node products.\n<\/li>\n<li><b>Low-power standard cell library development and characterization: <\/b>UMC replaced its incumbent library characterization tool with Cadence Liberate Characterization, which is the foundation of the broader digital full flow and a critical piece that enables advanced timing and power analysis, optimization and signoff flows.\n<\/li>\n<\/ul>\n<p>\n\u201cOur 22ULP\/ULL platform is ideal for a wide variety of semiconductor applications, including power- or leakage-sensitive consumer chips and wearable products that require longer battery life,\u201d said Y.H. Chen, director of the IP Development and Design Support Division at UMC. \u201cBy collaborating with Cadence, we\u2019re providing access to our latest process technologies and Cadence\u2019s robust digital full flow, which enables our customers to meet stringent design requirements and achieve design and productivity goals.\u201d\n<\/p>\n<p>\n\u201cThrough our latest collaboration with UMC, our mutual customers can adopt our certified digital reference flow and UMC\u2019s 22ULP\/ULL low-power technologies and begin design work immediately,\u201d said Kam Kittrell, senior product management group director in the Digital &amp; Signoff Group at Cadence. \u201cThis certification allows UMC customers to leverage the most advanced low-power tool feature sets for synthesis, place-and-route, and signoff, enabling customers to design innovative applications with confidence.\u201d\n<\/p>\n<p>\nThe Cadence digital full flow provides customers with a fast path to design closure and better predictability and supports the company\u2019s Intelligent System Design<sup>\u2122<\/sup> strategy, which enables advanced-node system-on-chip (SoC) design excellence.\n<\/p>\n<p><b>About Cadence<\/b><\/p>\n<p>\nCadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world\u2019s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For seven years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.cadence.com&amp;esheet=52458671&amp;newsitemid=20210712005821&amp;lan=en-US&amp;anchor=cadence.com&amp;index=2&amp;md5=11f225ac57ffa471936b74d448e6f147\">cadence.com<\/a>.\n<\/p>\n<p><b>About UMC<\/b><\/p>\n<p>\nUMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC\u2019s comprehensive IC processing technologies and manufacturing solutions include Logic\/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC&#8217;s 12-in &amp; 8-in fabs with its core R&amp;D are located in Taiwan, with additional ones throughout Asia. UMC has total 12 fabs in production with combined capacity close to 800,000 wafers per month (8-in equivalent), and all of them are certified with IATF-16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea &amp; Singapore, with worldwide total 19,500 employees. For more information, please visit: <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.umc.com&amp;esheet=52458671&amp;newsitemid=20210712005821&amp;lan=en-US&amp;anchor=http%3A%2F%2Fwww.umc.com&amp;index=3&amp;md5=7f262cc1fc5e9c64374dc04bbd1499be\">http:\/\/www.umc.com<\/a>.\n<\/p>\n<p><b>Note from UMC Concerning Forward-Looking Statements<\/b><\/p>\n<p>\nSome of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC\u2019s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.\n<\/p>\n<p><i>\u00a9 2021 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.cadence.com%2Fgo%2Ftrademarks&amp;esheet=52458671&amp;newsitemid=20210712005821&amp;lan=en-US&amp;anchor=www.cadence.com%2Fgo%2Ftrademarks&amp;index=4&amp;md5=a914c76ebe94d3e5d9200217e2d84a55\">www.cadence.com\/go\/trademarks<\/a> are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.<\/i><\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20210712005821r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20210712005821\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20210712005821\/en\/<\/a><\/span><\/p>\n<p>\nFor more information, please contact:<br \/>\n<br \/>Cadence Newsroom<br \/>\n<br \/>408-944-7039<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:newsroom@cadence.com\">newsroom@cadence.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> United States Taiwan North America Asia Pacific California<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Electronic Design Automation Semiconductor Technology Software Internet Hardware<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20210712005821\/en\/633339\/3\/Cadence_Logo_2_Reg_Black.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Cadence and UMC Collaborate on 22ULP\/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs SAN JOSE, Calif. &amp; HSINCHU, Taiwan,&#8211;(BUSINESS WIRE)&#8211; Cadence Design Systems, Inc. (Nasdaq: CDNS) and United Microelectronics Corporation (NYSE:UMC; TWSE: 2303) (\u201cUMC\u201d), a global semiconductor foundry, today announced that the Cadence digital full flow has been optimized and certified for the UMC 22ULP\/ULL process technologies to accelerate consumer, 5G and automotive application design. The flow, which incorporates leading implementation and signoff technology for ultra-low power designs, enables mutual customers to deliver top-quality designs and achieve a faster path to tapeout. To &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-umc-collaborate-on-22ulp-ull-reference-flow-certification-for-advanced-consumer-5g-and-automotive-designs\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Cadence and UMC Collaborate on 22ULP\/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-512136","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Cadence and UMC Collaborate on 22ULP\/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/cadence-and-umc-collaborate-on-22ulp-ull-reference-flow-certification-for-advanced-consumer-5g-and-automotive-designs\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Cadence and UMC Collaborate on 22ULP\/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Cadence and UMC Collaborate on 22ULP\/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs SAN JOSE, Calif. &amp; HSINCHU, Taiwan,&#8211;(BUSINESS WIRE)&#8211; Cadence Design Systems, Inc. (Nasdaq: CDNS) and United Microelectronics Corporation (NYSE:UMC; TWSE: 2303) (\u201cUMC\u201d), a global semiconductor foundry, today announced that the Cadence digital full flow has been optimized and certified for the UMC 22ULP\/ULL process technologies to accelerate consumer, 5G and automotive application design. The flow, which incorporates leading implementation and signoff technology for ultra-low power designs, enables mutual customers to deliver top-quality designs and achieve a faster path to tapeout. 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(Nasdaq: CDNS) and United Microelectronics Corporation (NYSE:UMC; TWSE: 2303) (\u201cUMC\u201d), a global semiconductor foundry, today announced that the Cadence digital full flow has been optimized and certified for the UMC 22ULP\/ULL process technologies to accelerate consumer, 5G and automotive application design. The flow, which incorporates leading implementation and signoff technology for ultra-low power designs, enables mutual customers to deliver top-quality designs and achieve a faster path to tapeout. 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