{"id":511805,"date":"2021-07-12T09:03:36","date_gmt":"2021-07-12T13:03:36","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/"},"modified":"2021-07-12T09:03:36","modified_gmt":"2021-07-12T13:03:36","slug":"media-alert-intel-accelerated-webcast-on-july-26","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/","title":{"rendered":"Media Alert: Intel Accelerated Webcast on July 26"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b>Media Alert: Intel Accelerated Webcast on July 26<\/b><\/p>\n<p class=\"bwalignc\"><b>Join Intel CEO Pat Gelsinger for a webcast detailing the company\u2019s process and packaging innovations.<\/b><\/p>\n<p>SANTA CLARA, Calif.&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<br \/>\nIntel is accelerating its annual cadence of innovation with new advancements in semiconductor process and packaging as part of its <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.intel.com%2Fcontent%2Fwww%2Fus%2Fen%2Fnewsroom%2Fnews%2Fidm-manufacturing-innovation-product-leadership.html%23gs.59qrms&amp;esheet=52457914&amp;newsitemid=20210712005123&amp;lan=en-US&amp;anchor=IDM+2.0+strategy&amp;index=1&amp;md5=8ae499e0eb733b1e54054b3baa18a79d\">IDM 2.0 strategy<\/a>.\n<\/p>\n<p id=\"news-body-cta\">This press release features multimedia. View the full release here: <a href=\"https:\/\/www.businesswire.com\/news\/home\/20210712005123\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20210712005123\/en\/<\/a><\/p>\n<div id=\"bwbodyimg\" style=\"width: 480px;float:left;padding-left:0px;padding-right:20px;padding-top:0px;padding-bottom:0px\"><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20210712005123\/en\/890489\/4\/Intel_Accelerated_KeyVisual.jpg\" alt=\"During a webcast at 2 p.m. PDT, Monday, July 26, Intel's leaders will provide a deeper look at the company's process and packaging roadmaps. (Credit: Intel Corporation)\" \/><\/p>\n<p style=\"font-size:85%\">During a webcast at 2 p.m. PDT, Monday, July 26, Intel&#8217;s leaders will provide a deeper look at the company&#8217;s process and packaging roadmaps. (Credit: Intel Corporation)<\/p>\n<\/div>\n<p>\nJoin a webcast with CEO <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.intel.com%2Fcontent%2Fwww%2Fus%2Fen%2Fnewsroom%2Fbiographies%2Fbiography-patrick-gelsinger.html&amp;esheet=52457914&amp;newsitemid=20210712005123&amp;lan=en-US&amp;anchor=Pat+Gelsinger&amp;index=2&amp;md5=2af50a1ace8295209e36c2f3aea06bec\">Pat Gelsinger<\/a> and <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.intel.com%2Fcontent%2Fwww%2Fus%2Fen%2Fnewsroom%2Fbiographies%2Fbiography-ann-b-kelleher.html%3Fwapkw%3Dann%2520kelleher%23gs.55y9k3&amp;esheet=52457914&amp;newsitemid=20210712005123&amp;lan=en-US&amp;anchor=Dr.+Ann+Kelleher&amp;index=3&amp;md5=d5c9ce188d5f9e40c333847f5a013d89\">Dr. Ann Kelleher<\/a>, senior vice president and general manager of Technology Development, where they will provide a deeper look at Intel\u2019s process and packaging roadmaps.\n<\/p>\n<p><b>When: <\/b>2 p.m. PDT, Monday, July 26\n<\/p>\n<p><b>Where: <\/b>Watch live on the <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.intel.com%2Fcontent%2Fwww%2Fus%2Fen%2Fnewsroom%2Fhome.html&amp;esheet=52457914&amp;newsitemid=20210712005123&amp;lan=en-US&amp;anchor=Intel+Newsroom&amp;index=4&amp;md5=7f2909f27bfdfa15a507ae113be988ad\">Intel Newsroom<\/a>.\n<\/p>\n<p><b>Event Replay:<\/b> A video replay will be available on the Intel Newsroom following the webcast.\n<\/p>\n<p><b>Updates: \u00ad\u00ad\u00ad\u00ad<\/b>To receive updates on the news, visit the <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.intel.com%2Fcontent%2Fwww%2Fus%2Fen%2Fnewsroom%2Fhome.html&amp;esheet=52457914&amp;newsitemid=20210712005123&amp;lan=en-US&amp;anchor=Intel+Newsroom&amp;index=5&amp;md5=d1e139e7196193011a8d034667b426ed\">Intel Newsroom<\/a> and follow along on Twitter with <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Ftwitter.com%2Fintelnews&amp;esheet=52457914&amp;newsitemid=20210712005123&amp;lan=en-US&amp;anchor=%40IntelNews&amp;index=6&amp;md5=19e3b31d3c815672330fa1ab74bb6375\">@IntelNews<\/a>.\n<\/p>\n<p><b>More:<\/b><a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.intel.com%2Fcontent%2Fwww%2Fus%2Fen%2Fnewsroom%2Fresources%2Fpress-kit-accelerated-event-2021.html&amp;esheet=52457914&amp;newsitemid=20210712005123&amp;lan=en-US&amp;anchor=Process+%26amp%3B+Packaging+Innovations&amp;index=7&amp;md5=fb6ddb7a654b393b611d31fe754b8126\">Process &amp; Packaging Innovations<\/a> (Press Kit)\n<\/p>\n<p><b>About Intel <\/b><\/p>\n<p>\nIntel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore\u2019s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers\u2019 greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel\u2019s innovations, go to <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fnewsroom.intel.com%2F&amp;esheet=52457914&amp;newsitemid=20210712005123&amp;lan=en-US&amp;anchor=newsroom.intel.com&amp;index=8&amp;md5=8e5ea7b8a13fcb121e5c7692ce92ef23\">newsroom.intel.com<\/a> and <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fintel.com%2F&amp;esheet=52457914&amp;newsitemid=20210712005123&amp;lan=en-US&amp;anchor=intel.com&amp;index=9&amp;md5=cb6b6f5dff218db66f1aa1c354b40d66\">intel.com<\/a>.\n<\/p>\n<p>\n\u00a9 Intel Corporation. Intel, the Intel logo and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.\n<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20210712005123r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20210712005123\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20210712005123\/en\/<\/a><\/span><\/p>\n<p>\nAgnes Kwan<br \/>\n<br \/>1-408-765-5714<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:agnes.ck.kwan@intel.com\">agnes.ck.kwan@intel.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> United States North America California<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Technology Hardware Semiconductor<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20210712005123\/en\/817781\/3\/intel-logo-ub-RGB_SD-Classic.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Photo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20210712005123\/en\/890489\/3\/Intel_Accelerated_KeyVisual.jpg\" alt=\"Photo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\">During a webcast at 2 p.m. PDT, Monday, July 26, Intel&#8217;s leaders will provide a deeper look at the company&#8217;s process and packaging roadmaps. (Credit: Intel Corporation)<\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Media Alert: Intel Accelerated Webcast on July 26 Join Intel CEO Pat Gelsinger for a webcast detailing the company\u2019s process and packaging innovations. SANTA CLARA, Calif.&#8211;(BUSINESS WIRE)&#8211; Intel is accelerating its annual cadence of innovation with new advancements in semiconductor process and packaging as part of its IDM 2.0 strategy. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20210712005123\/en\/ During a webcast at 2 p.m. PDT, Monday, July 26, Intel&#8217;s leaders will provide a deeper look at the company&#8217;s process and packaging roadmaps. (Credit: Intel Corporation) Join a webcast with CEO Pat Gelsinger and Dr. Ann Kelleher, senior vice president and general manager of Technology Development, where they will provide a deeper look at Intel\u2019s process and packaging &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Media Alert: Intel Accelerated Webcast on July 26&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-511805","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Media Alert: Intel Accelerated Webcast on July 26 - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Media Alert: Intel Accelerated Webcast on July 26 - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Media Alert: Intel Accelerated Webcast on July 26 Join Intel CEO Pat Gelsinger for a webcast detailing the company\u2019s process and packaging innovations. SANTA CLARA, Calif.&#8211;(BUSINESS WIRE)&#8211; Intel is accelerating its annual cadence of innovation with new advancements in semiconductor process and packaging as part of its IDM 2.0 strategy. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20210712005123\/en\/ During a webcast at 2 p.m. PDT, Monday, July 26, Intel&#8217;s leaders will provide a deeper look at the company&#8217;s process and packaging roadmaps. (Credit: Intel Corporation) Join a webcast with CEO Pat Gelsinger and Dr. Ann Kelleher, senior vice president and general manager of Technology Development, where they will provide a deeper look at Intel\u2019s process and packaging &hellip; Continue reading &quot;Media Alert: Intel Accelerated Webcast on July 26&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2021-07-12T13:03:36+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/mms.businesswire.com\/media\/20210712005123\/en\/890489\/4\/Intel_Accelerated_KeyVisual.jpg\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/media-alert-intel-accelerated-webcast-on-july-26\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/media-alert-intel-accelerated-webcast-on-july-26\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Media Alert: Intel Accelerated Webcast on July 26\",\"datePublished\":\"2021-07-12T13:03:36+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/media-alert-intel-accelerated-webcast-on-july-26\\\/\"},\"wordCount\":367,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/media-alert-intel-accelerated-webcast-on-july-26\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/mms.businesswire.com\\\/media\\\/20210712005123\\\/en\\\/890489\\\/4\\\/Intel_Accelerated_KeyVisual.jpg\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/media-alert-intel-accelerated-webcast-on-july-26\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/media-alert-intel-accelerated-webcast-on-july-26\\\/\",\"name\":\"Media Alert: Intel Accelerated Webcast on July 26 - 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SANTA CLARA, Calif.&#8211;(BUSINESS WIRE)&#8211; Intel is accelerating its annual cadence of innovation with new advancements in semiconductor process and packaging as part of its IDM 2.0 strategy. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20210712005123\/en\/ During a webcast at 2 p.m. PDT, Monday, July 26, Intel&#8217;s leaders will provide a deeper look at the company&#8217;s process and packaging roadmaps. (Credit: Intel Corporation) Join a webcast with CEO Pat Gelsinger and Dr. Ann Kelleher, senior vice president and general manager of Technology Development, where they will provide a deeper look at Intel\u2019s process and packaging &hellip; Continue reading \"Media Alert: Intel Accelerated Webcast on July 26\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/","og_site_name":"Market Newsdesk","article_published_time":"2021-07-12T13:03:36+00:00","og_image":[{"url":"https:\/\/mms.businesswire.com\/media\/20210712005123\/en\/890489\/4\/Intel_Accelerated_KeyVisual.jpg","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Media Alert: Intel Accelerated Webcast on July 26","datePublished":"2021-07-12T13:03:36+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/"},"wordCount":367,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/#primaryimage"},"thumbnailUrl":"https:\/\/mms.businesswire.com\/media\/20210712005123\/en\/890489\/4\/Intel_Accelerated_KeyVisual.jpg","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/media-alert-intel-accelerated-webcast-on-july-26\/","name":"Media Alert: Intel Accelerated Webcast on July 26 - 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