{"id":473764,"date":"2021-04-08T15:17:15","date_gmt":"2021-04-08T19:17:15","guid":{"rendered":"http:\/\/www.marketnewsdesk.com\/?p=473764"},"modified":"2021-04-08T15:17:15","modified_gmt":"2021-04-08T19:17:15","slug":"canon-commences-sales-of-the-fpa-5520iv-lf-option-for-back-end-process-semiconductor-lithography-systems","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/canon-commences-sales-of-the-fpa-5520iv-lf-option-for-back-end-process-semiconductor-lithography-systems\/","title":{"rendered":"Canon Commences Sales of the FPA-5520iV LF Option for Back-End Process Semiconductor Lithography Systems"},"content":{"rendered":"
\n

The new i-line stepper system realizes a wide exposure field, supporting larger advanced packaging<\/h2>\n

PR Newswire<\/p>\n<\/p><\/div>\n

\n

\n MELVILLE, N.Y.<\/span>, April 8, 2021<\/span> \/PRNewswire\/ — Canon U.S.A.<\/span>, Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., has launched the FPA-5520iV LF Option<\/a> for back-end process semiconductor lithography systems. This device features an i-line stepper1<\/sup>\u00a0with a 1.5 micrometer2<\/sup> resolution and a wide exposure field of 52 mm x 68 mm for advanced packaging3<\/sup>.<\/p>\n

\n

\n
\n \"Canon
\n <\/a>\n <\/p>\n<\/p><\/div>\n

In the field of semiconductor chip performance enhancement, alongside the miniaturization of circuits in front-end process of semiconductor manufacturing, higher-density packaging in back-end processes has become a valuable resource within this market. Advanced packaging with high performance requires fine redistribution layer patterns4<\/sup>, and in recent years, semiconductor lithography systems have been used for this purpose. Inheriting the same basic functionality of its predecessor model, the FPA-5520iV, released in July 2016<\/span>, the new FPA-5520iV LF Option for advanced packaging achieves a wide exposure field of circuit patterns to meet a variety of advanced packaging needs including heterogeneous integration5<\/sup>.<\/p>\n

As a result of its projection optical system, the Option recognizes single exposure with a large field of 52 mm \u00d7 68 mm \u2014 more than four times the standard exposure field (26 mm x 33 mm) of front-end process lithography systems, making support for integrations possible, in which multiple large semiconductor chips are bonded. In addition, with a high resolution of 1.5 micrometers, it is possible to expose fine redistribution layer patterns, thus supporting a variety of advanced packaging types. What’s more, by introducing this high resolution option, redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.<\/p>\n

The FPA-5520iV LF Option inherits the basic performance of the FPA-5520iV, which has received praise for its ability to handle warped reconstituted substrates6<\/sup>, an issue which can occur in packaging layers during the mass-production process. This system also offers enhanced availability by detecting alignment marks on the reconstituted substrates with large chip array variations.<\/p>\n

\n The back-end process of semiconductor manufacturing<\/b>\n <\/p>\n

In the semiconductor chip manufacturing process, the semiconductor lithography system plays the role of “exposing” the circuit patterns. In the series of lithography processes, the process of forming a semiconductor chip on a silicon wafer is called the “front-end process.” Meanwhile, the “back-end process” entails sealing a delicate semiconductor chip in a package, known as the “packaging process,” to protect it from the external environment and to enable electrical connection with the external portion.<\/p>\n

\n The Canon Lithography System website<\/b>\n <\/p>\n

The “Canon Lithography System Website” features easy-to-understand explanations, including illustrations and videos, of the technologies behind semiconductor lithography, as well as a dedicated page for kids.<\/p>\n

URL: https:\/\/global.canon\/en\/product\/indtech\/semicon\/50th\/<\/a>\u00a0<\/p>\n

\n About Canon U.S.A.<\/span>, Inc.<\/b>
\n
Canon U.S.A.<\/span>, Inc., is a leading provider of consumer, business-to-business, and industrial digital imaging solutions to the United States<\/span> and to Latin America<\/span> and the Caribbean<\/span> markets. With approximately $30.4 billion<\/span> in global revenue, its parent company, Canon Inc. (NYSE:CAJ), ranks third overall in U.S. patents granted in 2020\u2020 and is one of Fortune Magazine’s\u00a0World’s Most Admired Companies<\/i>\u00a0in 2020. Canon U.S.A.<\/span> is dedicated to its\u00a0Kyosei<\/i>\u00a0philosophy of social and environmental responsibility. To keep apprised of the latest news from Canon U.S.A.<\/span>, sign up for the Company’s RSS news feed by visiting\u00a0www.usa.canon.com\/rss<\/a>\u00a0and follow us on Twitter @CanonUSA.<\/p>\n

\u2020 Based on weekly patent counts issued by United States Patent and Trademark Office.<\/p>\n

Availability and other specifications are subject to change without notice.<\/p>\n

\n 1<\/sup>\u00a0A semiconductor lithography system that utilizes a 365 nm wavelength mercury lamp as the light source. 1 nm (1 nanometer) = 1 billionth of a meter.<\/p>\n

\n 2<\/sup>\u00a01 micrometer = one millionth of a meter = one thousandth of a millimeter.<\/p>\n

\n 3<\/sup>\u00a0Protects delicate semiconductor chips from the external environment and allows them to be electrically connected to the outside at the implementation.<\/p>\n

\n 4<\/sup>\u00a0Fine wiring for connecting between semiconductor chips or between semiconductor chips and bumps (protruding connecting electrodes).<\/p>\n

\n 5<\/sup>\u00a0Packaging to combine different chips such as CPU and DRAM, or CPU and GPU. The chips can be placed close together and connected by a number of circuits to increase processing capability.<\/p>\n

\n 6<\/sup>\u00a0Wafers created by attaching and encasing in resin multiple individual semiconductor chips that are produced during the front-end processes of semiconductor manufacturing.<\/p>\n

CONTACT: Nicole Esan<\/span>, niesan@cusa.canon.com<\/a><\/p>\n

\n

\n
\n \"Canon
\n <\/a>\n <\/p>\n<\/p><\/div>\n

\n \"Cision\" View original content to download multimedia:http:\/\/www.prnewswire.com\/news-releases\/canon-commences-sales-of-the-fpa-5520iv-lf-option-for-back-end-process-semiconductor-lithography-systems-301265420.html<\/a><\/p>\n

SOURCE Canon U.S.A.<\/span> Inc.<\/p>\n<\/p><\/div>\n

\"\"<\/p>\n","protected":false},"excerpt":{"rendered":"

The new i-line stepper system realizes a wide exposure field, supporting larger advanced packaging PR Newswire MELVILLE, N.Y., April 8, 2021 \/PRNewswire\/ — Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., has launched the FPA-5520iV LF Option for back-end process semiconductor lithography systems. This device features an i-line stepper1\u00a0with a 1.5 micrometer2 resolution and a wide exposure field of 52 mm x 68 mm for advanced packaging3. In the field of semiconductor chip performance enhancement, alongside the miniaturization of circuits in front-end process of semiconductor manufacturing, higher-density packaging in back-end processes has become a valuable resource within this market. Advanced packaging with high performance requires fine redistribution layer patterns4, and in … <\/p>\n

Continue reading “Canon Commences Sales of the FPA-5520iV LF Option for Back-End Process Semiconductor Lithography Systems”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-473764","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nCanon Commences Sales of the FPA-5520iV LF Option for Back-End Process Semiconductor Lithography Systems - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/canon-commences-sales-of-the-fpa-5520iv-lf-option-for-back-end-process-semiconductor-lithography-systems\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Canon Commences Sales of the FPA-5520iV LF Option for Back-End Process Semiconductor Lithography Systems - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"The new i-line stepper system realizes a wide exposure field, supporting larger advanced packaging PR Newswire MELVILLE, N.Y., April 8, 2021 \/PRNewswire\/ — Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., has launched the FPA-5520iV LF Option for back-end process semiconductor lithography systems. 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