{"id":458657,"date":"2021-03-16T09:03:07","date_gmt":"2021-03-16T13:03:07","guid":{"rendered":"http:\/\/www.marketnewsdesk.com\/?p=458657"},"modified":"2021-03-16T09:03:07","modified_gmt":"2021-03-16T13:03:07","slug":"xilinx-expands-into-new-applications-with-cost-optimized-ultrascale-portfolio-for-ultra-compact-high-performance-edge-compute","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/xilinx-expands-into-new-applications-with-cost-optimized-ultrascale-portfolio-for-ultra-compact-high-performance-edge-compute\/","title":{"rendered":"Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute"},"content":{"rendered":"<p>        <!--.bwalignc { text-align: center; list-style-position: inside }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p class=\"bwalignc\"><b>Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute <\/b><\/p>\n<p class=\"bwalignc\"><i>Enhanced scalability with low power and cost in new form factors enable UltraScale+ devices for numerous growth market opportunities ranging from IoT to networking<\/i><\/p>\n<p>SAN JOSE, Calif.&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;<br \/>\nXilinx, Inc., (NASDAQ: XLNX), the leader in adaptive computing, today announced the company has expanded its UltraScale+\u2122 portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix\u00ae and Zynq\u00ae UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.\n<\/p>\n<p id=\"news-body-cta\">This press release features multimedia. View the full release here: <a href=\"https:\/\/www.businesswire.com\/news\/home\/20210316005267\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20210316005267\/en\/<\/a><\/p>\n<div id=\"bwbodyimg\" style=\"width: 480px;float:left;padding-left:0px;padding-right:20px;padding-top:0px;padding-bottom:0px\"><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20210316005267\/en\/865292\/4\/Xilinx_ZYNQ_UltraSCALE%2B_Chips.jpg\" alt=\"Xilinx\u00ae Zynq\u00ae UltraScale\u2122 + Chip (Photo: Business Wire)\" \/><\/p>\n<p style=\"font-size:85%\">Xilinx\u00ae Zynq\u00ae UltraScale\u2122 + Chip (Photo: Business Wire)<\/p>\n<\/div>\n<p>\nAs the world\u2019s only hardware adaptable cost-optimized portfolio based on 16 nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC\u2019s state-of-the-art InFO (Integrated Fan-Out) packaging technology. Using InFO, Artix and Zynq UltraScale+ devices meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.\n<\/p>\n<p>\n\u201cDemand for compact, intelligent edge applications is driving the requirement for processing and bandwidth engines to not only provide higher performance, but also new levels of compute density to enable the smallest form factor systems,\u201d said Sumit Shah, senior director, Product Line Management and Marketing at Xilinx. \u201cThe new cost-optimized additions to our UltraScale+ portfolio are powerful enhancements that leverage the architecture and production-proven technology of Xilinx\u2019s UltraScale+ FPGAs and MPSoCs, which collectively have been deployed in millions of systems worldwide.\u201d\n<\/p>\n<p><b>Artix UltraScale+ FPGAs: Built for High I\/O Bandwidth and DSP Compute<\/b><\/p>\n<p>\nThe Artix UltraScale+ family is built on its production-proven FPGA architecture and is ideal for a range of applications including machine vision with advanced sensor technology, high-speed networking, and ultra-compact \u201c8K-ready\u201d video broadcasting. Artix UltraScale+ devices deliver 16 gigabits-per-second transceivers to support emerging and advanced protocols in networking, vision, and video, while also delivering the highest DSP compute in its class.\n<\/p>\n<p><b>Zynq UltraScale+ MPSoCs: Optimized for Power and Cost<\/b><\/p>\n<p>\nCost-optimized Zynq UltraScale+ MPSoCs include the new ZU1 and production-proven ZU2 and ZU3 devices, all available in InFO packaging. As part of the multiprocessing SoC line from the Zynq UltraScale+ family, ZU1 is designed for connectivity at the edge and for industrial and healthcare IoT systems, including embedded vision cameras, AV-over-IP 4K and 8K-ready streaming, hand-held test equipment, as well as consumer and medical applications. ZU1 is built for miniaturized compute-intensive applications and powered by a heterogeneous Arm\u00ae processor-based multicore processor subsystem, while also being able to migrate to common package footprints for greater compute.\n<\/p>\n<p>\n\u201cLUCID has worked closely with Xilinx to integrate the new UltraScale+ ZU3 into our next generation industrial machine vision camera, <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fthinklucid.com%2Ftriton-edge%2F&amp;esheet=52396421&amp;newsitemid=20210316005267&amp;lan=en-US&amp;anchor=the+Triton+Edge&amp;index=1&amp;md5=ea654b2bcbe3037f6c027e239ea1d13a\">the Triton Edge<\/a>,\u201d said Rod Barman, founder and president at LUCID Vision Labs. \u201cWith the UltraScale+ ZU3 and its InFO packaging, LUCID was able to utilize an innovative rigid-flex board architecture to squeeze an amazing amount of processing power into an ultra-compact IP67, factory-tough camera.\u201d\n<\/p>\n<p><b>Artix and Zynq UltraScale+ are Scalable and Secure<\/b><\/p>\n<p>\nWith the addition of Artix devices and the extension to the Zynq UltraScale+ family, Xilinx\u2019s portfolio now spans across the high-end with Virtex\u00ae UltraScale+, to the midrange with Kintex\u00ae UltraScale+, to the new cost-optimized low-end. These new devices round out the portfolio and provide scalability for customers to develop multiple solutions using the same Xilinx platform. This preserves design investments across the portfolio and speeds time-to-market.\n<\/p>\n<p>\nSecurity is a critical component in Xilinx designs, and both cost-optimized Artix and Zynq UltraScale+ families include the same robust security features found across the UltraScale+ portfolio. Included are RSA-4096 authentication, AES-CGM decryption, DPA countermeasures, and Xilinx\u2019s proprietary Security Monitor IP that adapts to security threats across the product life cycle, meeting the security needs for both defense and commercial projects.\n<\/p>\n<p>\n\u201cThe ability for customers to scale their designs using a single secure platform for a wide range of applications and markets is key to enabling faster, easier design integration as well as for capturing critical time-to-market opportunities,\u201d said Dan Mandell, senior analyst, IoT and Embedded Technology at VDC Research. \u201cXilinx\u2019s strategy to expand its portfolio to meet these market needs with its scalable and secure UltraScale+ Artix and Zynq families is compelling, especially considering the strong business opportunities in growth markets where these solutions are being deployed.\u201d\n<\/p>\n<p><b>Availability<\/b><\/p>\n<p>\nThe first cost-optimized Artix UltraScale+ devices are expected to be available in production by Q3 CY2021, with Vivado\u00ae Design Suite and Vitis\u2122 Unified Software Platform tool support starting late summer. Zynq UltraScale+ ZU1 devices will also begin sampling in Q3 with tool support in Q2, and volume production of the extended portfolio beginning Q4.\n<\/p>\n<p>\nFollow Xilinx on <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Ftwitter.com%2FXilinxInc&amp;esheet=52396421&amp;newsitemid=20210316005267&amp;lan=en-US&amp;anchor=Twitter&amp;index=2&amp;md5=fbf180acf2ed30f56f1ea704cff00ddf\">Twitter<\/a>, <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.linkedin.com%2Fcompany%2Fxilinx%2F&amp;esheet=52396421&amp;newsitemid=20210316005267&amp;lan=en-US&amp;anchor=LinkedIn&amp;index=3&amp;md5=372f55df8bec6b4c2f7d0cb10d84ef95\">LinkedIn<\/a>, and <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.facebook.com%2FXilinxInc&amp;esheet=52396421&amp;newsitemid=20210316005267&amp;lan=en-US&amp;anchor=Facebook&amp;index=4&amp;md5=5ba08d61c248a7fec67b0f82d43d269c\">Facebook<\/a>.\n<\/p>\n<p><b>About Xilinx<\/b><\/p>\n<p>\nXilinx, Inc. develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies &#8211; from the cloud, to the edge, to the endpoint. Xilinx is the inventor of the FPGA and Adaptive SoCs (including our Adaptive Compute Acceleration Platform, or ACAP), designed to deliver the most dynamic computing technology in the industry. We collaborate with our customers to create scalable, differentiated and intelligent solutions that enable the adaptable, intelligent and connected world of the future. For more information, visit xilinx.com.\n<\/p>\n<p>\nSource: Xilinx Newsroom\n<\/p>\n<p>\nCategory: Product Announcements\n<\/p>\n<p><i>\u00a9 Copyright 2021 Xilinx, Inc. Xilinx, the Xilinx logo and other designated brands included herein are trademarks of Xilinx in the United States and other countries.<\/i><\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20210316005267r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20210316005267\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20210316005267\/en\/<\/a><\/span><\/p>\n<p><b>PR Contact:<br \/>\n<br \/><\/b>Xilinx PR<br \/>\n<br \/><a rel=\"nofollow\" href=\"mailto:email@xilinx.com\">media@xilinx.com<\/a><\/p>\n<p><b>KEYWORDS:<\/b> United States North America California<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Data Management Semiconductor Technology Nanotechnology Telecommunications Networks Hardware<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20210316005267\/en\/784046\/3\/xilinx-logo-full-color.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Photo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20210316005267\/en\/865292\/3\/Xilinx_ZYNQ_UltraSCALE%2B_Chips.jpg\" alt=\"Photo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\">Xilinx\u00ae Zynq\u00ae UltraScale\u2122 + Chip (Photo: Business Wire)<\/font><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Photo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20210316005267\/en\/865294\/3\/Xilinx_ARTIX_UltraScale_%2B.jpg\" alt=\"Photo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\">Xilinx\u00ae Artix\u00ae UltraScale\u2122 + Chip (Photo: Business Wire)<\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute Enhanced scalability with low power and cost in new form factors enable UltraScale+ devices for numerous growth market opportunities ranging from IoT to networking SAN JOSE, Calif.&#8211;(BUSINESS WIRE)&#8211; Xilinx, Inc., (NASDAQ: XLNX), the leader in adaptive computing, today announced the company has expanded its UltraScale+\u2122 portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix\u00ae and Zynq\u00ae UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets. This press release features multimedia. View the full release here: &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/xilinx-expands-into-new-applications-with-cost-optimized-ultrascale-portfolio-for-ultra-compact-high-performance-edge-compute\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-458657","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/xilinx-expands-into-new-applications-with-cost-optimized-ultrascale-portfolio-for-ultra-compact-high-performance-edge-compute\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute Enhanced scalability with low power and cost in new form factors enable UltraScale+ devices for numerous growth market opportunities ranging from IoT to networking SAN JOSE, Calif.&#8211;(BUSINESS WIRE)&#8211; Xilinx, Inc., (NASDAQ: XLNX), the leader in adaptive computing, today announced the company has expanded its UltraScale+\u2122 portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix\u00ae and Zynq\u00ae UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets. This press release features multimedia. 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Market Newsdesk","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.marketnewsdesk.com\/index.php\/xilinx-expands-into-new-applications-with-cost-optimized-ultrascale-portfolio-for-ultra-compact-high-performance-edge-compute\/","og_locale":"en_US","og_type":"article","og_title":"Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute - Market Newsdesk","og_description":"Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute Enhanced scalability with low power and cost in new form factors enable UltraScale+ devices for numerous growth market opportunities ranging from IoT to networking SAN JOSE, Calif.&#8211;(BUSINESS WIRE)&#8211; Xilinx, Inc., (NASDAQ: XLNX), the leader in adaptive computing, today announced the company has expanded its UltraScale+\u2122 portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix\u00ae and Zynq\u00ae UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets. This press release features multimedia. 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