{"id":419874,"date":"2021-01-25T01:03:03","date_gmt":"2021-01-25T06:03:03","guid":{"rendered":"http:\/\/www.marketnewsdesk.com\/?p=419874"},"modified":"2021-01-25T01:03:03","modified_gmt":"2021-01-25T06:03:03","slug":"mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\/","title":{"rendered":"Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices"},"content":{"rendered":"

<\/p>\n

Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae<\/sup>, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices<\/b><\/p>\n

Beginning mass production and shipment for a multi-chip module manufacturer in January 2021<\/b><\/p>\n

TOKYO–(BUSINESS WIRE<\/a>)–
\nFor the commercialization of HRDP\u00ae1<\/sup>, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, \u201cMitsui Kinzoku\u201d) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP\u00ae<\/sup> has started for a domestic multi-chip module manufacturer.\n<\/p>\n

This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20210124005060\/en\/<\/a><\/p>\n

\"Exterior<\/p>\n

Exterior photograph of HRDP\u00ae, in the 12-inch wafer type (Photo: Business Wire)<\/p>\n<\/div>\n

\nIn its January 2018 news release, Mitsui Kinzoku announced the development of HRDP\u00ae<\/sup>, a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method2<\/sup>.\n<\/p>\n

\nHRDP\u00ae<\/sup> is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3<\/sup>, the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line\/space (L\/S) ratio of 2\/2 \u03bcm or less4<\/sup>. Currently, over 20 customers are evaluating HRDP\u00ae<\/sup> for commercialization.\n<\/p>\n

\nAs the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP\u00ae <\/sup>to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules5<\/sup>, and other devices for a variety of applications with plans to increase sales.\n<\/p>\n

\nAs the second stage, an overseas leading package manufacturer is planning to adopt HRDP\u00ae<\/sup> within FY2021.\n<\/p>\n

\nIn addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC6<\/sup> and mobile phones for FY2022 and onward, and the HRDP\u00ae<\/sup> market is expected to expand.\n<\/p>\n

\nUnder its slogan of Material Intelligence, Mitsui Kinzoku will realize customers\u2019 wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.\n<\/p>\n

\nDescription of Terms
\n
1 <\/sup>Abbreviation of High Resolution De-bondable Panel
\n
2 <\/sup>Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer
\n
3 <\/sup>Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size
\n
4 <\/sup>L\/S=2\/2 \u00b5m: The line width of 2 \u00b5m and the space between neighboring circuit lines of 2 \u00b5m.
\n
5 <\/sup>Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed
\n
6 <\/sup>High Performance Computing: Computer with large-scale, ultra high-speed computing\/processing capability\n<\/p>\n

\nReference
\n
“Development of HRDP\u00ae<\/sup> Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package” (Release as of January 25, 2018)
\n
https:\/\/www.mitsui-kinzoku.com\/Portals\/0\/resource\/uploads\/topics_180125e.pdf?TabModule127<\/a><\/p>\n

\nVideo of the RDL First method using HRDP\u00ae
\n
<\/sup>https:\/\/www.youtube.com\/watch?v=vHhng-NV9QA<\/a><\/p>\n

\"\"<\/p>\n

View source version on businesswire.com: <\/span>https:\/\/www.businesswire.com\/news\/home\/20210124005060\/en\/<\/a><\/span><\/p>\n

\n[Contact for inquiries about this release and HRDP\u00ae products]
\n
Corporate Communications Department, Mitsui Mining & Smelting Co., Ltd.
\n
Mr. KASAHARA Norio
\n
TEL: +81-3-5437-8028 E-mail: PR@mitsui-kinzoku.com<\/a><\/p>\n

\n[Contact for Inquiries about HRDP\u00ae<\/sup> products] (Native language is available.)
\n
In China
\n
EVER TEAM TECHNOLOGY (NANJING) CO., LTD.
\n
Mr. Jordon Jiang
\n
TEL: +86-18601423513 E-MAIL: jordon@evertech.com.tw
\n<\/a>
In Taiwan
\n
EVER TECH INSTRUMENTAL CO., LTD
\n
Mr. Alvin Tu
\n
TEL: +886-915973025 E-MAIL: alvin@evertech.com.tw
\n<\/a>
In Korea
\n
AJ COMPANY
\n
Mr. Suh Jeong Wook
\n
TEL: +82-1053711563 E-MAIL: jwsuh@aj-company.com<\/a><\/p>\n

KEYWORDS:<\/b> Japan Asia Pacific<\/p>\n

INDUSTRY KEYWORDS:<\/b> Packaging Semiconductor Technology Manufacturing Other Manufacturing Hardware<\/p>\n

MEDIA:<\/b><\/p>\n\n\n\n\n\n\n\n\n\n\n
Logo<\/b><\/font><\/td>\n<\/tr>\n
\"Logo\"<\/td>\n<\/tr>\n
<\/font><\/td>\n<\/tr>\n
Photo<\/b><\/font><\/td>\n<\/tr>\n
\"Photo\"<\/td>\n<\/tr>\n
Exterior photograph of HRDP\u00ae, in the 12-inch wafer type (Photo: Business Wire)<\/font><\/td>\n<\/tr>\n
Photo<\/b><\/font><\/td>\n<\/tr>\n
\"Photo\"<\/td>\n<\/tr>\n
HRDP\u00ae product diagram, in the wafer type (Graphic: Business Wire)<\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices Beginning mass production and shipment for a multi-chip module manufacturer in January 2021 TOKYO–(BUSINESS WIRE)– For the commercialization of HRDP\u00ae1, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, \u201cMitsui Kinzoku\u201d) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP\u00ae has started for a domestic multi-chip module manufacturer. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20210124005060\/en\/ Exterior photograph of HRDP\u00ae, in the … <\/p>\n

Continue reading “Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-419874","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nMitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices Beginning mass production and shipment for a multi-chip module manufacturer in January 2021 TOKYO–(BUSINESS WIRE)– For the commercialization of HRDP\u00ae1, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, \u201cMitsui Kinzoku\u201d) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP\u00ae has started for a domestic multi-chip module manufacturer. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20210124005060\/en\/ Exterior photograph of HRDP\u00ae, in the … Continue reading "Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices"\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2021-01-25T06:03:03+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/mms.businesswire.com\/media\/20210124005060\/en\/853632\/4\/HRDP_1.jpg\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices\",\"datePublished\":\"2021-01-25T06:03:03+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\\\/\"},\"wordCount\":655,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/mms.businesswire.com\\\/media\\\/20210124005060\\\/en\\\/853632\\\/4\\\/HRDP_1.jpg\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\\\/\",\"name\":\"Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices - 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(President: Keiji Nishida; hereinafter, \u201cMitsui Kinzoku\u201d) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP\u00ae has started for a domestic multi-chip module manufacturer. This press release features multimedia. View the full release here: https:\/\/www.businesswire.com\/news\/home\/20210124005060\/en\/ Exterior photograph of HRDP\u00ae, in the … Continue reading \"Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\/","og_site_name":"Market Newsdesk","article_published_time":"2021-01-25T06:03:03+00:00","og_image":[{"url":"https:\/\/mms.businesswire.com\/media\/20210124005060\/en\/853632\/4\/HRDP_1.jpg","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices","datePublished":"2021-01-25T06:03:03+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\/"},"wordCount":655,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\/#primaryimage"},"thumbnailUrl":"https:\/\/mms.businesswire.com\/media\/20210124005060\/en\/853632\/4\/HRDP_1.jpg","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/mitsui-mining-smelting-co-ltd-to-initiate-mass-production-of-hrdp-a-special-glass-carrier-for-next-generation-semiconductor-packaging-devices\/","name":"Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP\u00ae, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices - 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