{"id":414050,"date":"2021-01-13T08:34:32","date_gmt":"2021-01-13T13:34:32","guid":{"rendered":"http:\/\/www.marketnewsdesk.com\/?p=414050"},"modified":"2021-01-13T08:34:32","modified_gmt":"2021-01-13T13:34:32","slug":"lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design\/","title":{"rendered":"Lightwave Logic Announces Receipt of Patent on Innovative Polymer Modulator Packaging Design"},"content":{"rendered":"<div class=\"xn-newslines\">\n<h2 class=\"xn-hedline\">New Packaging Invention Enables Improved Modulator Performance Using Standardized Fabrication Techniques in Low-Cost, High-Volume Applications<\/h2>\n<p class=\"xn-distributor\">PR Newswire<\/p>\n<\/p><\/div>\n<div class=\"xn-content\">\n<p>\n        <span class=\"xn-location\">ENGLEWOOD, Colo.<\/span>, <span class=\"xn-chron\">Jan. 13, 2021<\/span> \/PRNewswire\/ &#8212;\u00a0Lightwave Logic, Inc. (OTCQB: LWLG), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power,<b>\u00a0<\/b>today announced the receipt of a patent on a new polymer modulator packaging invention, enabling low-cost and high-volume applications in datacenter and telecommunications markets.<\/p>\n<div class=\"PRN_ImbeddedAssetReference\" id=\"DivAssetPlaceHolder1\">\n<p>\n          <a href=\"https:\/\/mma.prnewswire.com\/media\/1311399\/Lightwave_Logic_Inc_Logo.html\" target=\"_blank\" rel=\"nofollow noopener noreferrer\"><br \/>\n            <img decoding=\"async\" src=\"https:\/\/mma.prnewswire.com\/media\/1311399\/Lightwave_Logic_Inc_Logo.jpg\" title=\"Lightwave Logic, Inc. Logo (PRNewsfoto\/Lightwave Logic, Inc.)\" alt=\"Lightwave Logic, Inc. Logo (PRNewsfoto\/Lightwave Logic, Inc.)\" \/><br \/>\n          <\/a>\n        <\/p>\n<\/p><\/div>\n<p>U.S. Patent number 10,886,694, granted on <span class=\"xn-chron\">January 5, 2021<\/span>, details an invention that allows electro-optic polymer modulators to be packaged in a hermetic environment using well-known, high-volume and low-cost fabrication processes that are available in a typical semiconductor fabrication foundry \u2013 improving suitability for mass production. Further, the design of this capsule package can improve both the reliability and the coupling interface between fiber optic cables and their laser sources for arrayed photonic integrated circuit solutions. The package can also interpose signals from an underlying circuit board to the polymer modulators, lasers, and other components for data transfer.<\/p>\n<p>As noted in the patent, the hermetic capsule is built from a semiconductor base that contains electrical and optical circuits and components. A hermetic capsule chamber is created by the design of a semiconductor lid that is sealed to the semiconductor base platform by a metallization process. <\/p>\n<p>&#8220;Using standardized fabrication techniques to create a package that achieves the performance, reliability, cost, and volume requirements has been a challenge for the photonics industry for years,&#8221; said Dr. <span class=\"xn-person\">Michael Lebby<\/span>, Chief Executive Officer of Lightwave Logic. &#8220;This incredible new hermetic capsule invention addresses this challenge, enabling the industry to progress past this hurdle. The team at Lightwave Logic is incredibly gifted to have created this and have all the skills and drive needed to push this breakthrough technological advancement through to a broader industry presence in the near-future. <\/p>\n<p>&#8220;This is yet another important patent that serves to further strengthen our U.S. patent portfolio, as well as our freedom of manufacturing in the field. I look forward to continued advancement of our inventions to create strong business, driving long-term value creation for our shareholders,&#8221; concluded Lebby. <\/p>\n<p>\n        <b>About Lightwave Logic, Inc.<br \/><\/b>Lightwave Logic, Inc. (OTCQB: LWLG) is developing a platform leveraging its proprietary engineered electro-optic (EO) polymers to transmit data at higher speeds with less power. The company&#8217;s high-activity and high-stability organic polymers allow Lightwave Logic to create next-generation photonic EO devices, which convert data from electrical signals into optical signals, for applications in data communications and telecommunications markets. For more information, please visit the company&#8217;s website at\u00a0<a target=\"_blank\" href=\"https:\/\/c212.net\/c\/link\/?t=0&amp;l=en&amp;o=3035583-1&amp;h=3593881632&amp;u=https%3A%2F%2Fc212.net%2Fc%2Flink%2F%3Ft%3D0%26l%3Den%26o%3D2770061-1%26h%3D2681764344%26u%3Dhttps%253A%252F%252Fc212.net%252Fc%252Flink%252F%253Ft%253D0%2526l%253Den%2526o%253D2691881-1%2526h%253D25330092%2526u%253Dhttps%25253A%25252F%25252Fc212.net%25252Fc%25252Flink%25252F%25253Ft%25253D0%252526l%25253Den%252526o%25253D2666007-1%252526h%25253D171174672%252526u%25253Dhttps%2525253A%2525252F%2525252Flightwavelogic.com%2525252F%252526a%25253Dlightwavelogic.com%2526a%253Dlightwavelogic.com%26a%3Dlightwavelogic.com&amp;a=lightwavelogic.com\" rel=\"nofollow noopener noreferrer\">lightwavelogic.com<\/a>.<\/p>\n<p>\n        <b>Safe Harbor Statement<br \/><\/b>The information posted in this release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. You can identify these statements by use of the words &#8220;may,&#8221; &#8220;will,&#8221; &#8220;should,&#8221; &#8220;plans,&#8221; &#8220;explores,&#8221; &#8220;expects,&#8221; &#8220;anticipates,&#8221; &#8220;continue,&#8221; &#8220;estimate,&#8221; &#8220;project,&#8221; &#8220;intend,&#8221; and similar expressions. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. These risks and uncertainties include, but are not limited to, lack of available funding; general economic and business conditions; competition from third parties; intellectual property rights of third parties; regulatory constraints; changes in technology and methods of marketing; delays in completing various engineering and manufacturing programs; changes in customer order patterns; changes in product mix; success in technological advances and delivering technological innovations; shortages in components; production delays due to performance quality issues with outsourced components; those events and factors described by us in Item 1.A &#8220;Risk Factors&#8221; in our most recent Form 10-K and Form 10-Q; other risks to which our company is subject; other factors beyond the Company&#8217;s control.<\/p>\n<p>\n        <b>Investor Relations Contact:\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0<br \/><\/b>Greg Falesnik\u00a0or\u00a0Luke Zimmerman\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0<br \/>MZ Group &#8211; MZ North America\u00a0<br \/>949-259-4987\u00a0 <br \/><a target=\"_blank\" href=\"mailto:LWLG@mzgroup.us\" rel=\"nofollow noopener noreferrer\">LWLG@mzgroup.us<\/a>\u00a0\u00a0 <br \/><a target=\"_blank\" href=\"https:\/\/c212.net\/c\/link\/?t=0&amp;l=en&amp;o=3035583-1&amp;h=2411227045&amp;u=https%3A%2F%2Fc212.net%2Fc%2Flink%2F%3Ft%3D0%26l%3Den%26o%3D2704645-1%26h%3D1417442472%26u%3Dhttps%253A%252F%252Fc212.net%252Fc%252Flink%252F%253Ft%253D0%2526l%253Den%2526o%253D2691881-1%2526h%253D2119840252%2526u%253Dhttps%25253A%25252F%25252Fc212.net%25252Fc%25252Flink%25252F%25253Ft%25253D0%252526l%25253Den%252526o%25253D2666007-1%252526h%25253D1122402200%252526u%25253Dhttp%2525253A%2525252F%2525252Fwww.mzgroup.us%2525252F%252526a%25253Dwww.mzgroup.us%2526a%253Dwww.mzgroup.us%26a%3Dwww.mzgroup.us&amp;a=www.mzgroup.us\" rel=\"nofollow noopener noreferrer\">www.mzgroup.us<\/a><b>\u00a0<\/b><\/p>\n<div class=\"PRN_ImbeddedAssetReference\" id=\"DivAssetPlaceHolder2\"><\/div>\n<p id=\"PURL\">\n        <img loading=\"lazy\" decoding=\"async\" title=\"Cision\" width=\"12\" height=\"12\" alt=\"Cision\" src=\"https:\/\/c212.net\/c\/img\/favicon.png?sn=CL46965&amp;sd=2021-01-13\" \/> View original content to download multimedia:<a id=\"PRNURL\" rel=\"nofollow\" href=\"http:\/\/www.prnewswire.com\/news-releases\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design-301207337.html\">http:\/\/www.prnewswire.com\/news-releases\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design-301207337.html<\/a><\/p>\n<p>SOURCE  Lightwave Logic, Inc.<\/p>\n<\/p><\/div>\n<p>    <img decoding=\"async\" alt=\"\" src=\"https:\/\/rt.prnewswire.com\/rt.gif?NewsItemId=CL46965&amp;Transmission_Id=202101130831PR_NEWS_USPR_____CL46965&amp;DateId=20210113\" style=\"border:0px;width:1px;height:1px\" \/><\/p>\n","protected":false},"excerpt":{"rendered":"<p>New Packaging Invention Enables Improved Modulator Performance Using Standardized Fabrication Techniques in Low-Cost, High-Volume Applications PR Newswire ENGLEWOOD, Colo., Jan. 13, 2021 \/PRNewswire\/ &#8212;\u00a0Lightwave Logic, Inc. (OTCQB: LWLG), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power,\u00a0today announced the receipt of a patent on a new polymer modulator packaging invention, enabling low-cost and high-volume applications in datacenter and telecommunications markets. U.S. Patent number 10,886,694, granted on January 5, 2021, details an invention that allows electro-optic polymer modulators to be packaged in a hermetic environment using well-known, high-volume and low-cost fabrication processes that are available in a typical semiconductor fabrication foundry \u2013 improving suitability for mass production. Further, the design of this &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Lightwave Logic Announces Receipt of Patent on Innovative Polymer Modulator Packaging Design&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-414050","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Lightwave Logic Announces Receipt of Patent on Innovative Polymer Modulator Packaging Design - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Lightwave Logic Announces Receipt of Patent on Innovative Polymer Modulator Packaging Design - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"New Packaging Invention Enables Improved Modulator Performance Using Standardized Fabrication Techniques in Low-Cost, High-Volume Applications PR Newswire ENGLEWOOD, Colo., Jan. 13, 2021 \/PRNewswire\/ &#8212;\u00a0Lightwave Logic, Inc. (OTCQB: LWLG), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power,\u00a0today announced the receipt of a patent on a new polymer modulator packaging invention, enabling low-cost and high-volume applications in datacenter and telecommunications markets. U.S. Patent number 10,886,694, granted on January 5, 2021, details an invention that allows electro-optic polymer modulators to be packaged in a hermetic environment using well-known, high-volume and low-cost fabrication processes that are available in a typical semiconductor fabrication foundry \u2013 improving suitability for mass production. 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Market Newsdesk","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.marketnewsdesk.com\/index.php\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design\/","og_locale":"en_US","og_type":"article","og_title":"Lightwave Logic Announces Receipt of Patent on Innovative Polymer Modulator Packaging Design - Market Newsdesk","og_description":"New Packaging Invention Enables Improved Modulator Performance Using Standardized Fabrication Techniques in Low-Cost, High-Volume Applications PR Newswire ENGLEWOOD, Colo., Jan. 13, 2021 \/PRNewswire\/ &#8212;\u00a0Lightwave Logic, Inc. (OTCQB: LWLG), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power,\u00a0today announced the receipt of a patent on a new polymer modulator packaging invention, enabling low-cost and high-volume applications in datacenter and telecommunications markets. U.S. Patent number 10,886,694, granted on January 5, 2021, details an invention that allows electro-optic polymer modulators to be packaged in a hermetic environment using well-known, high-volume and low-cost fabrication processes that are available in a typical semiconductor fabrication foundry \u2013 improving suitability for mass production. Further, the design of this &hellip; Continue reading \"Lightwave Logic Announces Receipt of Patent on Innovative Polymer Modulator Packaging Design\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design\/","og_site_name":"Market Newsdesk","article_published_time":"2021-01-13T13:34:32+00:00","og_image":[{"url":"https:\/\/mma.prnewswire.com\/media\/1311399\/Lightwave_Logic_Inc_Logo.jpg","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Lightwave Logic Announces Receipt of Patent on Innovative Polymer Modulator Packaging Design","datePublished":"2021-01-13T13:34:32+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design\/"},"wordCount":650,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design\/#primaryimage"},"thumbnailUrl":"https:\/\/mma.prnewswire.com\/media\/1311399\/Lightwave_Logic_Inc_Logo.jpg","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/lightwave-logic-announces-receipt-of-patent-on-innovative-polymer-modulator-packaging-design\/","name":"Lightwave Logic Announces Receipt of Patent on Innovative Polymer Modulator Packaging Design - 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