{"id":399545,"date":"2020-12-15T03:48:03","date_gmt":"2020-12-15T08:48:03","guid":{"rendered":"http:\/\/www.marketnewsdesk.com\/?p=399545"},"modified":"2020-12-15T03:48:03","modified_gmt":"2020-12-15T08:48:03","slug":"tower-semiconductor-and-opix-announce-the-successful-development-of-a-world-class-itof-technology-platform-for-3d-imaging-and-face-recognition-applications","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/tower-semiconductor-and-opix-announce-the-successful-development-of-a-world-class-itof-technology-platform-for-3d-imaging-and-face-recognition-applications\/","title":{"rendered":"Tower Semiconductor and OPIX Announce the Successful Development of a World Class iToF Technology Platform for 3D Imaging and Face Recognition Applications"},"content":{"rendered":"
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\n Featuring state of the art performance including multiple depth sensing and distance measurement applications for a broad range of fast-growing markets such as mobile, AR\/VR, retail, robotics, and automation<\/em>
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\n Based on Tower\u2019s leading-edge pixel-level stacked wafer BSI technology with enhanced NIR sensitivity<\/em>
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\n MIGDAL HAEMEK, Israel, and SHENZEN, China, December 15, 2020<\/strong> \u2013 Tower Semiconductor<\/a> (NASDAQ\/TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, and OPIX, an innovative supplier of 3D Time-of-Flight (ToF) image sensor solutions, today announced the successful development of a world class iToF technology platform for 3D imaging and face recognition,\u00a0 featuring multiple depth sensing and distance measurement applications for a broad range of markets, based on Tower\u2019s state of the art, pixel level wafer stacking BSI technology.<\/p>\n

The newly developed technology is implemented in a high-end image sensor product that is being integrated into a 3D camera module in partnership with a global industry leader of 3D cameras and imaging systems for mobile applications. This three-party collaboration produced a unique sensor product that is perfectly suited to serve a wide variety of fast-growing markets such as mobile, AR\/VR, retail, robotics, automation, and industrial inspection.<\/p>\n

Utilizing TOWER\u2019s 65nm leading pixel-level stacked BSI CIS technology fabricated in its Uozu, Japan facility, as well as Tower\u2019s vast expertise in development of iToF image sensor technology, provided an outstanding platform for the design of this cutting-edge performing product, a first in a series of iToF products.<\/p>\n

\u201cWe are very excited about our collaboration with the Opix team of experts who helped \u00a0bring to the market this new, world-class iToF technology\u201d, said Dr. Avi Strum, Senior Vice President and General Manager of the Sensors and Displays Business Unit, Tower Semiconductor. \u201cThis highly advanced technology comprehensively meets the challenging requirements and specifications of a small sized iToF imager and demonstrates our notable capabilities and fervent commitment to provide our customers with market-leading imaging solutions\u201d.<\/p>\n

The first sensor that is currently being prototyped to customers features a 5\u00b5m 3-tap state-of-the-art iToF pixel incorporating a pixel array with resolution of 640×480 pixels. The BSI technology provides excellent sensitivity at NIR wavelengths. \u00a0In addition, the wafer stacking enables very high modulation frequencies of up to 165 MHz and 30 depth frames per second which results in industry-leading depth accuracy at short, mid and long-range distances even in challenging ambient light conditions by using pulse modulation iToF technique. Advanced features such as multiple acquisition modes,depth with single and dual frequency, low-power standby modes and an industry standard MIPI CSI-2 interface, allow very versatile and flexible operation, providing a cost effective all-in solution, making this product the ultimate choice for various 3D imaging applications, especially in the mobile market.\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0<\/p>\n

\u201cAt Opix, we worked hard during the past 18 months in order to make this development successful. 3D imaging becomes ubiquitous in all imaging markets nowadays and as a CEO I am very proud to see us competing already on spec level with known solutions of tech giants,\u201d said Dr. Xinyang Wang, CEO at Opix.\u00a0 \u201cWith our 100% focus and dedication to 3D imaging and support of our partners, we have a strong belief we can play an important role in the coming years to serve the market with innovative solutions for the emerging 3D imaging market.\u201d\u00a0\u00a0<\/p>\n

For more information about Tower Semiconductor\u2019s CMOS Image Sensor technology platform, please click here<\/a>.<\/p>\n

For more information about Tower Semiconductor\u2019s process technology offerings, please\u00a0click here<\/a>\u00a0or inquire at:\u00a0info@towersemi.com<\/a><\/p>\n

For more information about Opix technology and services, please click here<\/a>.<\/p>\n

\n About Opix<\/strong>
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Opix, a fabless IC company with headquarters in Shenzhen, China, is a young and innovative company dedicated to state-of-the-art 3D Time-of-Flight (ToF) CMOS-based digital imaging addressing markets such as consumer applications like mobile phones, industrial automation and various emerging markets where 3D imaging plays a disruptive role. Opix is technically and financially backed up by strong partners who are world leading figures in CMOS design and 3D sensing applications.
Please visit www.opix-opto.com<\/a> for more information.<\/p>\n

\n About Tower Semiconductor <\/strong>\n <\/p>\n

Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, provides technology and manufacturing platforms for integrated circuits (ICs) in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor\u2019s focuses on creating positive and sustainable impact on the world through long term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal\/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as Transfer Optimization and development Process Services (TOPS) to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor operates two manufacturing facilities in Israel (150mm and 200mm), two in the U.S. (200mm) and three facilities in Japan (two 200mm and one 300mm) through TPSCo. For more information, please visit www.towersemi.com<\/a>.<\/p>\n

\n Safe Harbor Regarding Forward-Looking Statements<\/strong>
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This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower\u2019s business is included under the heading \u201cRisk Factors\u201d in Tower\u2019s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the \u201cSEC\u201d) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release.\u00a0<\/p>\n<\/p>\n

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