{"id":389569,"date":"2020-11-30T09:03:32","date_gmt":"2020-11-30T14:03:32","guid":{"rendered":"http:\/\/www.marketnewsdesk.com\/?p=389569"},"modified":"2020-11-30T09:03:32","modified_gmt":"2020-11-30T14:03:32","slug":"broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\/","title":{"rendered":"Broadcom Debuts Industry\u2019s First 5nm ASIC for Data Center and Cloud Infrastructure"},"content":{"rendered":"<h2>\n5nm technology platform accelerates silicon innovation across artificial intelligence, high performance computing and 5G wireless infrastructure markets<br \/>\n<\/h2>\n<div class=\"mw_release\">\n<p>SAN JOSE, Calif., Nov.  30, 2020  (GLOBE NEWSWIRE) &#8212; Broadcom Inc. (NASDAQ: AVGO) today announced sampling of its\u00a05nm ASIC device for data center and cloud infrastructure. Built on TSMC\u2019s N5 process and measuring 625 mm<sup>2<\/sup>, this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC CoWoS<sup>\u00ae<\/sup> interposer technology. In addition, Broadcom has multiple ASIC devices in development targeting artificial intelligence (AI), high performance computing (HPC) and 5G wireless infrastructure applications.<\/p>\n<p>\n        <strong>5nm<\/strong><br \/>\n        <strong>Technology<\/strong><br \/>\n        <strong> Portfolio <\/strong><br \/>\n        <strong>Highlights<\/strong>\n      <\/p>\n<ul type=\"disc\">\n<li>High speed multi-protocol 112-Gbps, 64-Gbps and 32-Gbps SerDes cores<\/li>\n<li>HBM2e and HBM3 protocol solution<\/li>\n<li>High bandwidth Die2Die PHY for multi-die SoC and silicon disaggregation<\/li>\n<li>High performance and high-density standard cell libraries and memory compilers<\/li>\n<li>Advanced packaging solutions including multi-chip-modules and 2.5D stacking<\/li>\n<\/ul>\n<p>\n        <strong>Benefits of <\/strong><br \/>\n        <strong>5nm ASIC <\/strong><br \/>\n        <strong>Platform<\/strong><br \/>\n        <strong> vs. Previous Generation<\/strong>\n      <\/p>\n<ul type=\"disc\">\n<li>2x increase in on-die computation for training and inference applications<\/li>\n<li>2x to 4x increase in memory bandwidth with HBM2e and HBM3 PHY<\/li>\n<li>2x higher bandwidth serial links with 112-Gbps SerDes<\/li>\n<li>Up to 30% reduction in power per given work function<\/li>\n<li>System size and cost reduction with advanced packaging solutions<\/li>\n<\/ul>\n<p>\u201cBroadcom\u2019s pioneering ASIC leverages both N5, the industry\u2019s most advanced silicon technology, and our high-performance CoWoS integration solution to address the demanding requirements of next-generation cloud and data center applications,\u201d said Dr. Kevin Zhang, senior vice president of business development at TSMC. \u201cWe\u2019re excited to see the new applications Broadcom\u2019s ASIC platform will enable, and look forward to continued partnership to empower end customers and their innovations.\u201d<\/p>\n<p>\u201cThis first-to-market 5nm ASIC extends Broadcom\u2019s embedded SoC leadership and paves the way for new innovations across AI, HPC, 5G and hyperscale infrastructure applications,\u201d said\u00a0Frank Ostojic, senior vice president and general manager of the ASIC Product Division at\u00a0Broadcom. \u201cOur innovative IP, proven design methodology and partnership with TSMC continue to provide leadership solutions with power, performance and time to market advantage for our customers.\u201d<\/p>\n<p>\n        <strong>About\u00a0Broadcom<\/strong><br \/>\n        <br \/>Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom\u2019s category-leading product portfolio serves critical markets including data center, networking, enterprise software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise, mainframe and cyber security software focused on automation, monitoring and security, smartphone components, telecoms and factory automation. For more information, go to <a href=\"https:\/\/www.globenewswire.com\/Tracker?data=Adg2VKqGBt_Kxtu1CT9wHMOQLHUOPd0AJBb2cj9X945N-wy1kF4Rw1DPRvVhtEe33ZHFKl5oQegPvlaoyQvq8A==\" rel=\"nofollow noopener noreferrer\" target=\"_blank\">www.broadcom.com<\/a>.<\/p>\n<p>Broadcom, the pulse logo, and Connecting everything are among the trademarks of Broadcom.\u00a0 The term &#8220;Broadcom&#8221; refers to Broadcom Inc., and\/or its subsidiaries. Other trademarks are the property of their respective owners.<\/p>\n<p>Press Contact:<br \/>Khanh Lam<br \/>Corporate Communications<br \/>press.relations@broadcom.com<br \/>Telephone: +1 408 433 8649<\/p>\n<p>      <img loading=\"lazy\" decoding=\"async\" class=\"__GNW8366DE3E__IMG\" src=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=ODA5MzMxOCMzODQ2ODIzIzIwMDQwNjg=\" width=\"1\" height=\"1\" \/><br \/>\n      <br \/>\n      <img loading=\"lazy\" decoding=\"async\" class=\"__GNW8366DE3E__IMG\" src=\"https:\/\/ml.globenewswire.com\/release\/track\/f1833773-6a95-4573-b948-fbdca6c97e7f\" width=\"1\" height=\"1\" \/>\n    <\/div>\n<div class=\"mw_contactinfo\"><\/div>\n","protected":false},"excerpt":{"rendered":"<p>5nm technology platform accelerates silicon innovation across artificial intelligence, high performance computing and 5G wireless infrastructure markets SAN JOSE, Calif., Nov. 30, 2020 (GLOBE NEWSWIRE) &#8212; Broadcom Inc. (NASDAQ: AVGO) today announced sampling of its\u00a05nm ASIC device for data center and cloud infrastructure. Built on TSMC\u2019s N5 process and measuring 625 mm2, this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC CoWoS\u00ae interposer technology. In addition, Broadcom has multiple ASIC devices in development targeting artificial intelligence (AI), high performance computing (HPC) and 5G wireless infrastructure applications. 5nm Technology Portfolio Highlights High speed multi-protocol 112-Gbps, 64-Gbps and 32-Gbps SerDes cores HBM2e and HBM3 protocol solution High bandwidth Die2Die PHY &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;Broadcom Debuts Industry\u2019s First 5nm ASIC for Data Center and Cloud Infrastructure&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-389569","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.7 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Broadcom Debuts Industry\u2019s First 5nm ASIC for Data Center and Cloud Infrastructure - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Broadcom Debuts Industry\u2019s First 5nm ASIC for Data Center and Cloud Infrastructure - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"5nm technology platform accelerates silicon innovation across artificial intelligence, high performance computing and 5G wireless infrastructure markets SAN JOSE, Calif., Nov. 30, 2020 (GLOBE NEWSWIRE) &#8212; Broadcom Inc. (NASDAQ: AVGO) today announced sampling of its\u00a05nm ASIC device for data center and cloud infrastructure. Built on TSMC\u2019s N5 process and measuring 625 mm2, this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC CoWoS\u00ae interposer technology. In addition, Broadcom has multiple ASIC devices in development targeting artificial intelligence (AI), high performance computing (HPC) and 5G wireless infrastructure applications. 5nm Technology Portfolio Highlights High speed multi-protocol 112-Gbps, 64-Gbps and 32-Gbps SerDes cores HBM2e and HBM3 protocol solution High bandwidth Die2Die PHY &hellip; Continue reading &quot;Broadcom Debuts Industry\u2019s First 5nm ASIC for Data Center and Cloud Infrastructure&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2020-11-30T14:03:32+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=ODA5MzMxOCMzODQ2ODIzIzIwMDQwNjg=\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Broadcom Debuts Industry\u2019s First 5nm ASIC for Data Center and Cloud Infrastructure\",\"datePublished\":\"2020-11-30T14:03:32+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\\\/\"},\"wordCount\":473,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=ODA5MzMxOCMzODQ2ODIzIzIwMDQwNjg=\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\\\/\",\"name\":\"Broadcom Debuts Industry\u2019s First 5nm ASIC for Data Center and Cloud Infrastructure - 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(NASDAQ: AVGO) today announced sampling of its\u00a05nm ASIC device for data center and cloud infrastructure. Built on TSMC\u2019s N5 process and measuring 625 mm2, this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC CoWoS\u00ae interposer technology. In addition, Broadcom has multiple ASIC devices in development targeting artificial intelligence (AI), high performance computing (HPC) and 5G wireless infrastructure applications. 5nm Technology Portfolio Highlights High speed multi-protocol 112-Gbps, 64-Gbps and 32-Gbps SerDes cores HBM2e and HBM3 protocol solution High bandwidth Die2Die PHY &hellip; Continue reading \"Broadcom Debuts Industry\u2019s First 5nm ASIC for Data Center and Cloud Infrastructure\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\/","og_site_name":"Market Newsdesk","article_published_time":"2020-11-30T14:03:32+00:00","og_image":[{"url":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=ODA5MzMxOCMzODQ2ODIzIzIwMDQwNjg=","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"Broadcom Debuts Industry\u2019s First 5nm ASIC for Data Center and Cloud Infrastructure","datePublished":"2020-11-30T14:03:32+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\/"},"wordCount":473,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\/#primaryimage"},"thumbnailUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=ODA5MzMxOCMzODQ2ODIzIzIwMDQwNjg=","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/broadcom-debuts-industrys-first-5nm-asic-for-data-center-and-cloud-infrastructure\/","name":"Broadcom Debuts Industry\u2019s First 5nm ASIC for Data Center and Cloud Infrastructure - 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