{"id":383847,"date":"2020-11-18T08:03:17","date_gmt":"2020-11-18T13:03:17","guid":{"rendered":"http:\/\/www.marketnewsdesk.com\/?p=383847"},"modified":"2020-11-18T08:03:17","modified_gmt":"2020-11-18T13:03:17","slug":"xperi-licenses-dbi-to-canon-for-cmos-image-sensors","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/xperi-licenses-dbi-to-canon-for-cmos-image-sensors\/","title":{"rendered":"Xperi Licenses DBI to Canon for CMOS Image Sensors"},"content":{"rendered":"

<\/p>\n

Xperi Licenses DBI to Canon for CMOS Image Sensors<\/b><\/p>\n

Direct Bond Interconnect (DBI\u00ae<\/sup>) hybrid bonding portfolio licensed to Canon to enhance image sensors in its industry-leading products<\/i><\/b><\/p>\n

SAN JOSE, Calif.–(BUSINESS WIRE<\/a>)–Xperi Holding Corporation<\/a> (NASDAQ: XPER) (\u201cXperi\u201d) today announced Canon\u2019s license of Invensas<\/a> DBI hybrid bonding intellectual property (IP) portfolio to further enhance its image sensors.\n<\/p>\n

\nHybrid bonding, a foundational 3D integration technology, is increasingly being deployed in a range of semiconductor applications from image sensors to memory to reduce form factor, lower cost, enhance performance and increase functionality. In imaging applications, DBI technology has been leveraged to improve image quality, increase signal-to-noise ratios, and enable advanced features.\n<\/p>\n

\n\u201cCanon is recognized by customers around the world as a long-standing leader in optical and imaging products,\u201d said Craig Mitchell, President of Invensas, a wholly owned subsidiary of Xperi. \u201cOur DBI hybrid bonding technology is key to the continued advancement and miniaturization of semiconductors and the electronics products they are incorporated within. We are proud to support Canon\u2019s innovation efforts in the field of image sensors and look forward to expanding our relationship in the future.\u201d\n<\/p>\n

\nAs the limits of Moore\u2019s Law are being challenged, the industry is looking beyond conventional 2D scaling techniques to 3D structures, packages and interconnect innovations. Xperi has achieved fundamental advances in 3D semiconductor packaging and interconnect required to satisfy the demanding size, performance and functionality requirements of consumers today and tomorrow. With over 2,700 semiconductor patents covering wafer bonding, die bonding, 3D interconnect, 3D semiconductor packaging, processes, circuits and more, Xperi continues to license and partner with industry-leaders around the world.\n<\/p>\n

About Xperi Holding Corporation<\/b><\/p>\n

\nXperi invents, develops, and delivers technologies that enable extraordinary experiences. Xperi technologies, delivered via its brands (DTS, HD Radio, IMAX Enhanced, Invensas, TiVo), and by its startup, Perceive, make entertainment more entertaining, and smart devices smarter. Xperi technologies are integrated into billions of consumer devices, media platforms, and semiconductors worldwide, driving increased value for partners, customers and consumers.\n<\/p>\n

XPER \u2013 I<\/b><\/p>\n

\"\"<\/p>\n

View source version on businesswire.com: <\/span>https:\/\/www.businesswire.com\/news\/home\/20201118005215\/en\/<\/a><\/span><\/p>\n

Xperi Media Contact:
\n<\/b>
Lerin O\u2019Neill, Director of Communications
\n
+1 408-562-8455
\n
lerin.oneill@xperi.com<\/a><\/p>\n

Xperi Investor Contact:
\n<\/b>
Geri Weinfeld, Vice President of Investor Relations
\n
+1 818-436-1231
\n
geri.weinfeld@xperi.com<\/a><\/p>\n

KEYWORDS:<\/b> California United States North America<\/p>\n

INDUSTRY KEYWORDS:<\/b> Other Entertainment Internet Hardware Consumer Electronics Technology Semiconductor Mobile\/Wireless Entertainment<\/p>\n

MEDIA:<\/b><\/p>\n\n","protected":false},"excerpt":{"rendered":"

Xperi Licenses DBI to Canon for CMOS Image Sensors Direct Bond Interconnect (DBI\u00ae) hybrid bonding portfolio licensed to Canon to enhance image sensors in its industry-leading products SAN JOSE, Calif.–(BUSINESS WIRE)–Xperi Holding Corporation (NASDAQ: XPER) (\u201cXperi\u201d) today announced Canon\u2019s license of Invensas DBI hybrid bonding intellectual property (IP) portfolio to further enhance its image sensors. Hybrid bonding, a foundational 3D integration technology, is increasingly being deployed in a range of semiconductor applications from image sensors to memory to reduce form factor, lower cost, enhance performance and increase functionality. In imaging applications, DBI technology has been leveraged to improve image quality, increase signal-to-noise ratios, and enable advanced features. \u201cCanon is recognized by customers around the world as a long-standing leader in … <\/p>\n

Continue reading “Xperi Licenses DBI to Canon for CMOS Image Sensors”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-383847","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nXperi Licenses DBI to Canon for CMOS Image Sensors - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/xperi-licenses-dbi-to-canon-for-cmos-image-sensors\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Xperi Licenses DBI to Canon for CMOS Image Sensors - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Xperi Licenses DBI to Canon for CMOS Image Sensors Direct Bond Interconnect (DBI\u00ae) hybrid bonding portfolio licensed to Canon to enhance image sensors in its industry-leading products SAN JOSE, Calif.–(BUSINESS WIRE)–Xperi Holding Corporation (NASDAQ: XPER) (\u201cXperi\u201d) today announced Canon\u2019s license of Invensas DBI hybrid bonding intellectual property (IP) portfolio to further enhance its image sensors. Hybrid bonding, a foundational 3D integration technology, is increasingly being deployed in a range of semiconductor applications from image sensors to memory to reduce form factor, lower cost, enhance performance and increase functionality. In imaging applications, DBI technology has been leveraged to improve image quality, increase signal-to-noise ratios, and enable advanced features. \u201cCanon is recognized by customers around the world as a long-standing leader in … Continue reading "Xperi Licenses DBI to Canon for CMOS Image Sensors"\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/xperi-licenses-dbi-to-canon-for-cmos-image-sensors\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2020-11-18T13:03:17+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&sty=20201118005215r1&sid=flmnd&distro=nx&lang=en\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/xperi-licenses-dbi-to-canon-for-cmos-image-sensors\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/xperi-licenses-dbi-to-canon-for-cmos-image-sensors\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"Xperi Licenses DBI to Canon for CMOS Image Sensors\",\"datePublished\":\"2020-11-18T13:03:17+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/xperi-licenses-dbi-to-canon-for-cmos-image-sensors\\\/\"},\"wordCount\":406,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/xperi-licenses-dbi-to-canon-for-cmos-image-sensors\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/cts.businesswire.com\\\/ct\\\/CT?id=bwnews&sty=20201118005215r1&sid=flmnd&distro=nx&lang=en\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/xperi-licenses-dbi-to-canon-for-cmos-image-sensors\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/xperi-licenses-dbi-to-canon-for-cmos-image-sensors\\\/\",\"name\":\"Xperi Licenses DBI to Canon for CMOS Image Sensors - 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