{"id":1009599,"date":"2026-10-13T11:03:22","date_gmt":"2026-10-13T15:03:22","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/"},"modified":"2026-10-13T11:03:22","modified_gmt":"2026-10-13T15:03:22","slug":"nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/","title":{"rendered":"nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution"},"content":{"rendered":"<div class=\"mw_release\">\n<p align=\"center\">\n        <em>nVent will add liquid and air cooling solution to AMD rack-scale AI platform to create a fully integrated system for large AI workloads<\/em>\n      <\/p>\n<p align=\"center\">\n        <em>The companies will unveil a first look of the open-source solution at the OCP Global Summit<\/em>\n      <\/p>\n<p>LONDON, Oct.  13, 2026  (GLOBE NEWSWIRE) &#8212; nVent (NYSE: NVT) and AMD today announced a collaboration to bring rack-level cooling to the AMD Helios\u2122 Rackscale solution. The joint effort pairs nVent&#8217;s data center cooling expertise with AMD Helios to help operators deploy AI capacity at scale. This will add nVent rear door heat exchanger (RDHx) as part of the fully integrated AMD Helios AI infrastructure platform that includes AMD Instinct\u2122 graphical processing units (GPUs), EPYC\u2122 central processing units (CPUs), Pensando\u2122 networking technologies, and the AMD ROCm\u2122 open software stack. nVent will unveil a first look at the OCP Global Summit in San Jose, CA, October 12 to 16, 2026.<\/p>\n<p>\u201cThis collaboration brings nVent&#8217;s cooling expertise to one of the leading AI platforms in the industry,\u201d said Eric Osborn, vice president and general manager of Data Solutions, Cooling &amp; Power at nVent. \u201cWe are designing for the platforms our customers are building on, and working closely with AMD is how we make sure the fit is right.\u201d<\/p>\n<p>nVent&#8217;s DC-powered RDHx is an industry-first dual rear door, designed for the double-wide AMD Helios rack. It captures the heat that direct-to-chip liquid cooling leaves behind and returns cooled air to the space, keeping the rack effectively room-neutral. It is fully-integrated with the AMD Helios platform and offers intelligent cooling with no wasted watts, integrated air temperature, humidity sensors and differential pressure fan speed control. Additionally, its DC power matches how next-generation AI racks are powered. The result is a cooling solution that allows customers to start with a single rack and scale larger deployments over time.<\/p>\n<p>\u201cThe rack, not any single component within it, has now become the unit of deployment; and compute, networking, software, power and cooling must operate as one system,\u201d said Ravi Pendekanti, corporate vice president, Data Center Solutions Business Group, AMD. \u201cAMD Helios brings those elements together in an open, standards-based architecture designed to help customers scale from a single rack to large AI factories with long-term flexibility. Our collaboration with nVent expands the cooling options available for AMD Helios, helping operators bring high-density AI infrastructure online across a broader range of data center environments.\u201d<\/p>\n<p>At the OCP Global Summit, nVent and AMD will show the RDHx for the first time on an Open Rack Wide (ORW) rack alongside the manifolds, bus bars, and power shelves of a Helios deployment, giving operators a first look at how the companies&#8217; work comes together. Visit Booth #A9 at OCP for more information.<\/p>\n<p>\n        <strong>About nVent<\/strong><br \/>\n        <br \/>nVent is a leading global provider of electrical connection and protection solutions. We believe our inventive electrical solutions enable safer systems and ensure a more secure world. We design, manufacture, market, install and service high-performance products and solutions that connect and protect some of the world&#8217;s most sensitive equipment, buildings and critical processes. We offer a comprehensive range of systems protection and electrical connections solutions across industry-leading brands that are recognized globally for quality, reliability and innovation. Our principal office is in London and our management office in the United States is in Minneapolis. Our robust portfolio of leading electrical product brands dates back more than 100 years and includes nVent CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE. Learn more at www.nvent.com.<\/p>\n<p>nVent, CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE are trademarks owned or licensed by nVent Services GmbH or its affiliates.<\/p>\n<p>\n        <strong>CAUTION CONCERNING FORWARD-LOOKING STATEMENTS<\/strong>\u00a0<br \/>This press release contains statements that we believe to be \u201cforward-looking statements\u201d within the meaning of the Private Securities Litigation Reform Act of 1995. All statements, other than statements of historical fact are forward-looking statements. Without limitation, any statements preceded or followed by or that include the words \u201ctargets,\u201d \u201cplans,\u201d \u201cbelieves,\u201d \u201cexpects,\u201d \u201cintends,\u201d \u201cwill,\u201d \u201clikely,\u201d \u201cmay,\u201d \u201canticipates,\u201d \u201cestimates,\u201d \u201cprojects,\u201d \u201cforecasts,\u201d \u201cshould,\u201d \u201cwould,\u201d \u201ccould,\u201d \u201cpositioned,\u201d \u201cstrategy,\u201d \u201cfuture,\u201d \u201care confident,\u201d or words, phrases or terms of similar substance or the negative thereof, are forward-looking statements. These forward-looking statements are not guarantees of future performance and are subject to risks, uncertainties, assumptions and other factors, some of which are beyond our control, which could cause actual results to differ materially from those expressed or implied by such forward-looking statements. Among these factors are adverse effects on our business operations or financial results, including the overall global economic and business conditions impacting our business; the ability to achieve the benefits of our restructuring plans; the ability to successfully identify, finance, complete and integrate acquisitions, including the Maverick Power acquisition; competition and pricing pressures in the markets we serve, including the impacts of tariffs; volatility in currency exchange rates, interest rates and commodity prices; inability to generate savings from excellence in operations initiatives consisting of lean enterprise, supply management and cash flow practices; inability to mitigate material and other cost inflation; risks related to the availability of, and cost inflation in, supply chain inputs, including labor, raw materials, commodities, packaging and transportation; increased risks associated with operating foreign businesses; risks associated with or arising from military conflicts; the ability to deliver backlog and win future project work; failure of markets to accept new product introductions and enhancements; the impact of changes in laws and regulations, including those that limit U.S. tax benefits; the outcome of litigation and governmental proceedings; and the ability to achieve our long-term strategic operating goals. Additional information concerning these and other factors is contained in our filings with the U.S. Securities and Exchange Commission, including our Annual Report on Form 10-K and our Quarterly Reports on Form 10-Q. All forward-looking statements speak only as of the date of this press release. nVent assumes no obligation, and disclaims any obligation, to update the information contained in this press release.\u00a0<\/p>\n<p>\n        <strong>Investor Contact<\/strong><br \/>\n        <br \/>Tony Riter\u00a0<br \/>Vice President, Investor Relations\u00a0<br \/>nVent\u00a0<br \/>763.204.7750\u00a0<br \/><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=5so6OlsaCzSczBmjBXnj8KZjWSFuVU1L4151pAkjWwNSkDPjJe9J_Y5cbzj6H6pCPujxCe8-4NXrTZj5JOFG3JzzD4FVztnir7xs5Bm5byU=\" rel=\"nofollow\" target=\"_blank\"><u>Tony.Riter@nVent.com<\/u><\/a><\/p>\n<p>\n        <strong>Media Contact<\/strong><br \/>\n        <br \/>Kevin H. King<br \/>Vice President, Global Communications<br \/>nVent<br \/>763.291.0526<br \/><a href=\"https:\/\/www.globenewswire.com\/Tracker?data=1xB37Fw0OIci-KRewOzeV6mWiTh69dxh33cn4e67AU5EA36EgxNqNEH_QcQI9KF95IQHDAOfIma7rCe_ihXMxYtMKzsVsnX-Q5Mnl_0HDiI=\" rel=\"nofollow\" target=\"_blank\"><u>Kevin.King@nVent.com<\/u><\/a><\/p>\n<p>      <img decoding=\"async\" alt=\"\" class=\"__GNW8366DE3E__IMG\" src=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTg0NDE3NiM3ODkxNTc3IzIyOTU1MDk=\" \/><br \/>\n      <br \/>\n      <img decoding=\"async\" alt=\"\" src=\"https:\/\/ml.globenewswire.com\/media\/OTE4NWRjZGMtZTk1Yi00MzAzLTk4MWQtODk1NjRmZWNlMmU4LTEzMDcwNTktMjAyNi0xMC0xMy1lbg==\/tiny\/nVent.png\" \/>\n    <\/div>\n<div class=\"mw_contactinfo\"><\/div>\n","protected":false},"excerpt":{"rendered":"<p>nVent will add liquid and air cooling solution to AMD rack-scale AI platform to create a fully integrated system for large AI workloads The companies will unveil a first look of the open-source solution at the OCP Global Summit LONDON, Oct. 13, 2026 (GLOBE NEWSWIRE) &#8212; nVent (NYSE: NVT) and AMD today announced a collaboration to bring rack-level cooling to the AMD Helios\u2122 Rackscale solution. The joint effort pairs nVent&#8217;s data center cooling expertise with AMD Helios to help operators deploy AI capacity at scale. This will add nVent rear door heat exchanger (RDHx) as part of the fully integrated AMD Helios AI infrastructure platform that includes AMD Instinct\u2122 graphical processing units (GPUs), EPYC\u2122 central processing units (CPUs), Pensando\u2122 networking &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-1009599","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.6 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"nVent will add liquid and air cooling solution to AMD rack-scale AI platform to create a fully integrated system for large AI workloads The companies will unveil a first look of the open-source solution at the OCP Global Summit LONDON, Oct. 13, 2026 (GLOBE NEWSWIRE) &#8212; nVent (NYSE: NVT) and AMD today announced a collaboration to bring rack-level cooling to the AMD Helios\u2122 Rackscale solution. The joint effort pairs nVent&#8217;s data center cooling expertise with AMD Helios to help operators deploy AI capacity at scale. This will add nVent rear door heat exchanger (RDHx) as part of the fully integrated AMD Helios AI infrastructure platform that includes AMD Instinct\u2122 graphical processing units (GPUs), EPYC\u2122 central processing units (CPUs), Pensando\u2122 networking &hellip; Continue reading &quot;nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2026-10-13T15:03:22+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTg0NDE3NiM3ODkxNTc3IzIyOTU1MDk=\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"5 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution\",\"datePublished\":\"2026-10-13T15:03:22+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\\\/\"},\"wordCount\":1012,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.globenewswire.com\\\/newsroom\\\/ti?nf=OTg0NDE3NiM3ODkxNTc3IzIyOTU1MDk=\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\\\/\",\"name\":\"nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution - 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The joint effort pairs nVent&#8217;s data center cooling expertise with AMD Helios to help operators deploy AI capacity at scale. This will add nVent rear door heat exchanger (RDHx) as part of the fully integrated AMD Helios AI infrastructure platform that includes AMD Instinct\u2122 graphical processing units (GPUs), EPYC\u2122 central processing units (CPUs), Pensando\u2122 networking &hellip; Continue reading \"nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/","og_site_name":"Market Newsdesk","article_published_time":"2026-10-13T15:03:22+00:00","og_image":[{"url":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTg0NDE3NiM3ODkxNTc3IzIyOTU1MDk=","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"5 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution","datePublished":"2026-10-13T15:03:22+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/"},"wordCount":1012,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/#primaryimage"},"thumbnailUrl":"https:\/\/www.globenewswire.com\/newsroom\/ti?nf=OTg0NDE3NiM3ODkxNTc3IzIyOTU1MDk=","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/nvent-and-amd-collaborate-on-cooling-for-amd-helios-rackscale-solution\/","name":"nVent and AMD Collaborate on Cooling for AMD Helios Rackscale Solution - 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