{"id":1006827,"date":"2026-09-29T16:13:20","date_gmt":"2026-09-29T20:13:20","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/"},"modified":"2026-09-29T16:13:20","modified_gmt":"2026-09-29T20:13:20","slug":"ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/","title":{"rendered":"UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers"},"content":{"rendered":"<p>        <!--.bwlistdisc { list-style-type: disc }\n.bwalignl { text-align: left }body {font:normal small Arial,Helvetica,sans-serif;color:#000;background-color:#fff;padding:24px;margin:0;} a img {border:0;} h3 {font-size:medium;color:#000;margin:0 0 1em 0; text-align:center;}-->  <\/p>\n<p><b>UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers<\/b><\/p>\n<p><i>Certification evaluates liquid cooling subassemblies for safety, performance, leak integrity and interoperability, helping support reliable AI infrastructure.<\/i><\/p>\n<ul class=\"bwlistdisc\">\n<li>AI chips generate intense heat, making effective cooling essential to data center performance and reliability.<\/li>\n<li>The certification provides a consistent way to assess critical cooling components before deployment in AI data centers.<\/li>\n<li>Certification can help manufacturers demonstrate product readiness and help data center customers make informed purchasing and integration decisions.<\/li>\n<\/ul>\n<p>NORTHBROOK, Ill.&#8211;(<a href=\"http:\/\/www.businesswire.com\">BUSINESS WIRE<\/a>)&#8211;UL Solutions Inc. (NYSE: ULS), a global leader in applied safety science, today launched a certification program for liquid cooling subassemblies that target powerful chips directly, providing more effective cooling in AI data centers and other high-density computing systems.<\/p>\n<p id=\"news-body-cta\">This press release features multimedia. View the full release here: <a href=\"https:\/\/www.businesswire.com\/news\/home\/20260929465054\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20260929465054\/en\/<\/a><\/p>\n<div id=\"bwbodyimg\" style=\"width: 480px;float:left;padding-left:0px;padding-right:20px;padding-top:0px;padding-bottom:0px\"><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260929465054\/en\/2916892\/4\/Data_Center_Cold_Plate.jpg\" alt=\"UL Solutions today launched a certification program for liquid cooling subassemblies that target powerful chips directly, providing more effective cooling in AI data centers and other high-density computing systems.\" \/><\/p>\n<p style=\"font-size:85%\">UL Solutions today launched a certification program for liquid cooling subassemblies that target powerful chips directly, providing more effective cooling in AI data centers and other high-density computing systems.<\/p>\n<\/div>\n<p>AI computers use chips that produce a large amount of heat. If that heat is not removed, equipment may slow down, shut off or become damaged, but traditional air cooling, such as fans or chilled air, may not be enough for today\u2019s most powerful computing systems. With direct-to-chip liquid cooling, coolant flows through a cold plate that is attached to the chip. The coolant absorbs heat from the chip and carries it away, much like water flowing through a radiator.<\/p>\n<p>\u201cAs AI data centers handle more powerful computing, they depend on even more advanced cooling systems to operate safely and reliably,\u201d said Jennifer Scanlon, president and CEO of UL Solutions. \u201cOur certification helps IT equipment manufacturers demonstrate product performance and safety while giving data center operators greater confidence during integration.\u201d<\/p>\n<p>AI and other high-performance computing systems are increasing energy use and heat in data centers. <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.iea.org%2Freports%2Fenergy-and-ai%2Fenergy-supply-for-ai&amp;esheet=54612627&amp;newsitemid=20260929465054&amp;lan=en-US&amp;anchor=Global+data+center+electricity+use+is+expected+to+more+than+double+between+2024+and+2030&amp;index=1&amp;md5=72659e3274e27523f52838f6201e7086\">Global data center electricity use is expected to more than double between 2024 and 2030<\/a>. Cooling can account for up to <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.energy.gov%2Farticles%2Fdoe-announces-40-million-more-efficient-cooling-data-centers&amp;esheet=54612627&amp;newsitemid=20260929465054&amp;lan=en-US&amp;anchor=40%25+of+a+data+center%27s+energy+use&amp;index=2&amp;md5=74fd4100c624e92933870786a348728a\">40% of a data center\u2019s energy use<\/a>. Liquid cooling can improve heat control, but it also brings risks. Leaks, corrosion, contamination or parts that do not work well together can affect system safety, performance and reliability.<\/p>\n<p>Connecting parts from different suppliers can also be a challenge. Parts may fit together but require different coolants, pressure levels or operating conditions. <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.mckinsey.com%2Fcapabilities%2Foperations%2Four-insights%2Foperations-blog%2Fkeeping-cool-in-the-data-age&amp;esheet=54612627&amp;newsitemid=20260929465054&amp;lan=en-US&amp;anchor=Industry+observers&amp;index=3&amp;md5=7db8c1cb6baa801de14b6675986dc404\">Industry observers<\/a> have identified integration problems and limited standards as barriers to wider use of liquid cooling.<\/p>\n<p>The UL Solutions certification program covers eligible liquid-filled parts and subassemblies that move coolant through information and communication technology equipment. These may include:<\/p>\n<ul class=\"bwlistdisc\">\n<li>Cold plates, which absorb heat directly from computer chips<\/li>\n<li>Manifolds, which send coolant to servers and equipment racks<\/li>\n<li>Quick disconnects, which allow equipment to be serviced without draining the full cooling system<\/li>\n<\/ul>\n<p>UL Solutions uses UL 4501, the Outline of Investigation for Safety, Performance and Interoperability of Liquid-Filled Components and Assemblies Used in Liquid Cooling Systems, to evaluate eligible liquid cooling subassemblies. The evaluation covers coolant compatibility, pressure and leak integrity, durability, liquid flow, interoperability, production controls and installation requirements.<\/p>\n<p>Evaluating these parts before adding them to a complete cooling system can help identify problems earlier and reduce the need for repeated testing. Independent certification demonstrates that an eligible product meets applicable requirements. This helps manufacturers support their product claims and helps data center customers make informed buying and integration decisions.<\/p>\n<p>\u201cAI infrastructure must scale without sacrificing safety or reliability,\u201d said Milan Dotlich, vice president and general manager of Data Center Solutions at UL Solutions. \u201cIndependent evaluation of liquid cooling components can help organizations deploy advanced computing systems with greater confidence.\u201d<\/p>\n<p>UL Solutions can also evaluate other data center cooling equipment under applicable UL Standards. This equipment includes coolant distribution units, self-contained liquid-filled systems, liquid-cooled busways, cables, connectors, power whips, gaskets, O-rings and hoses. Requirements depend on each product\u2019s design, function and intended use.<\/p>\n<p><a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.ul.com%2Findustries%2Fdata-centers&amp;esheet=54612627&amp;newsitemid=20260929465054&amp;lan=en-US&amp;anchor=Learn+more+about+UL+Solutions+services+that+support+data+center+development+and+operations&amp;index=4&amp;md5=159dc4693f93ac48a112fddcec2fb1b1\">Learn more about UL Solutions services that support data center development and operations<\/a>.<\/p>\n<p><strong>About UL Solutions<\/strong><\/p>\n<p>A global leader in applied safety science, UL Solutions (NYSE: ULS) transforms safety, security and sustainability challenges into opportunities for customers in more than 110 countries. UL Solutions delivers testing, inspection and certification services, advisory offerings and software solutions that support our customers\u2019 product innovation and business growth. The UL Mark serves as a recognized symbol of trust in our customers\u2019 products and reflects an unwavering commitment to advancing our safety mission. We help our customers innovate, launch new products and services, navigate global markets and complex supply chains, and grow sustainably and responsibly into the future. Our science is your advantage. <a rel=\"nofollow\" href=\"https:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=https%3A%2F%2Fwww.ul.com%2F&amp;esheet=54612627&amp;newsitemid=20260929465054&amp;lan=en-US&amp;anchor=Learn+more+about+UL+Solutions&amp;index=5&amp;md5=9135231cf1b07e639965c6efab145012\">Learn more about UL Solutions<\/a>.<\/p>\n<p><strong>Source Code:<\/strong> ULS-IR<\/p>\n<p><b>Source:<\/b> UL Solutions<\/p>\n<p><img decoding=\"async\" alt=\"\" src=\"https:\/\/cts.businesswire.com\/ct\/CT?id=bwnews&amp;sty=20260929465054r1&amp;sid=flmnd&amp;distro=nx&amp;lang=en\" style=\"width:0;height:0\" \/><span class=\"bwct31415\" \/><\/p>\n<p id=\"mmgallerylink\"><span id=\"mmgallerylink-phrase\">View source version on businesswire.com: <\/span><span id=\"mmgallerylink-link\"><a href=\"https:\/\/www.businesswire.com\/news\/home\/20260929465054\/en\/\" rel=\"nofollow\">https:\/\/www.businesswire.com\/news\/home\/20260929465054\/en\/<\/a><\/span><\/p>\n<p class=\"bwalignl\"><b>Media:<\/b><br \/>Kathy Fieweger<br \/>Senior Vice President and Chief Corporate Communications Officer<br \/><a rel=\"nofollow\" href=\"mailto:Kathy.Fieweger@ul.com\">Kathy.Fieweger@ul.com<\/a><br \/>+1 312-852-5156<\/p>\n<p><b>Investors:<\/b><br \/>Yijing Brentano<br \/>Vice President, Investor Relations<br \/><a rel=\"nofollow\" href=\"mailto:IR@ul.com\">IR@ul.com<\/a><br \/>+1 312-895-9873<\/p>\n<p><b>KEYWORDS:<\/b> United States North America Illinois<\/p>\n<p><b>INDUSTRY KEYWORDS:<\/b> Hardware Electronic Design Automation Data Management Technology Artificial Intelligence Semiconductor Construction &amp; Property Other Manufacturing Engineering Building Systems Other Technology Manufacturing<\/p>\n<p><b>MEDIA:<\/b><\/p>\n<table cellpadding=\"3\" cellspacing=\"3\">\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Photo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260929465054\/en\/2916892\/3\/Data_Center_Cold_Plate.jpg\" alt=\"Photo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\">UL Solutions today launched a certification program for liquid cooling subassemblies that target powerful chips directly, providing more effective cooling in AI data centers and other high-density computing systems.<\/font><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><b>Logo<\/b><\/font><\/td>\n<\/tr>\n<tr>\n<td><img decoding=\"async\" src=\"https:\/\/mms.businesswire.com\/media\/20260929465054\/en\/2129141\/3\/UL_Solutions_logo.jpg\" alt=\"Logo\" \/><\/td>\n<\/tr>\n<tr>\n<td><font face=\"Arial\" size=\"2\"><\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers Certification evaluates liquid cooling subassemblies for safety, performance, leak integrity and interoperability, helping support reliable AI infrastructure. AI chips generate intense heat, making effective cooling essential to data center performance and reliability. The certification provides a consistent way to assess critical cooling components before deployment in AI data centers. Certification can help manufacturers demonstrate product readiness and help data center customers make informed purchasing and integration decisions. NORTHBROOK, Ill.&#8211;(BUSINESS WIRE)&#8211;UL Solutions Inc. (NYSE: ULS), a global leader in applied safety science, today launched a certification program for liquid cooling subassemblies that target powerful chips directly, providing more effective cooling in AI data centers and other high-density &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\"> &#8220;UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers&#8221;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-1006827","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.6 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers Certification evaluates liquid cooling subassemblies for safety, performance, leak integrity and interoperability, helping support reliable AI infrastructure. AI chips generate intense heat, making effective cooling essential to data center performance and reliability. The certification provides a consistent way to assess critical cooling components before deployment in AI data centers. Certification can help manufacturers demonstrate product readiness and help data center customers make informed purchasing and integration decisions. NORTHBROOK, Ill.&#8211;(BUSINESS WIRE)&#8211;UL Solutions Inc. (NYSE: ULS), a global leader in applied safety science, today launched a certification program for liquid cooling subassemblies that target powerful chips directly, providing more effective cooling in AI data centers and other high-density &hellip; Continue reading &quot;UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers&quot;\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/\" \/>\n<meta property=\"og:site_name\" content=\"Market Newsdesk\" \/>\n<meta property=\"article:published_time\" content=\"2026-09-29T20:13:20+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/mms.businesswire.com\/media\/20260929465054\/en\/2916892\/4\/Data_Center_Cold_Plate.jpg\" \/>\n<meta name=\"author\" content=\"Newsdesk\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Newsdesk\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"4 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\\\/\"},\"author\":{\"name\":\"Newsdesk\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/#\\\/schema\\\/person\\\/482f27a394d4fda80ecb5499e519d979\"},\"headline\":\"UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers\",\"datePublished\":\"2026-09-29T20:13:20+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\\\/\"},\"wordCount\":892,\"image\":{\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/mms.businesswire.com\\\/media\\\/20260929465054\\\/en\\\/2916892\\\/4\\\/Data_Center_Cold_Plate.jpg\",\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\\\/\",\"url\":\"https:\\\/\\\/www.marketnewsdesk.com\\\/index.php\\\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\\\/\",\"name\":\"UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers - 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AI chips generate intense heat, making effective cooling essential to data center performance and reliability. The certification provides a consistent way to assess critical cooling components before deployment in AI data centers. Certification can help manufacturers demonstrate product readiness and help data center customers make informed purchasing and integration decisions. NORTHBROOK, Ill.&#8211;(BUSINESS WIRE)&#8211;UL Solutions Inc. (NYSE: ULS), a global leader in applied safety science, today launched a certification program for liquid cooling subassemblies that target powerful chips directly, providing more effective cooling in AI data centers and other high-density &hellip; Continue reading \"UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers\"","og_url":"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/","og_site_name":"Market Newsdesk","article_published_time":"2026-09-29T20:13:20+00:00","og_image":[{"url":"https:\/\/mms.businesswire.com\/media\/20260929465054\/en\/2916892\/4\/Data_Center_Cold_Plate.jpg","type":"","width":"","height":""}],"author":"Newsdesk","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Newsdesk","Est. reading time":"4 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/#article","isPartOf":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/"},"author":{"name":"Newsdesk","@id":"https:\/\/www.marketnewsdesk.com\/#\/schema\/person\/482f27a394d4fda80ecb5499e519d979"},"headline":"UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers","datePublished":"2026-09-29T20:13:20+00:00","mainEntityOfPage":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/"},"wordCount":892,"image":{"@id":"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/#primaryimage"},"thumbnailUrl":"https:\/\/mms.businesswire.com\/media\/20260929465054\/en\/2916892\/4\/Data_Center_Cold_Plate.jpg","inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/","url":"https:\/\/www.marketnewsdesk.com\/index.php\/ul-solutions-launches-certification-for-direct-to-chip-liquid-cooling-equipment-used-in-ai-data-centers\/","name":"UL Solutions Launches Certification for Direct-to-Chip Liquid Cooling Equipment Used in AI Data Centers - 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