{"id":1001589,"date":"2026-09-08T18:24:33","date_gmt":"2026-09-08T22:24:33","guid":{"rendered":"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-technology-announces-phase-2-of-arizona-advanced-packaging-and-test-campus-expands-investment-to-12-billion\/"},"modified":"2026-09-08T18:24:33","modified_gmt":"2026-09-08T22:24:33","slug":"amkor-technology-announces-phase-2-of-arizona-advanced-packaging-and-test-campus-expands-investment-to-12-billion","status":"publish","type":"post","link":"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-technology-announces-phase-2-of-arizona-advanced-packaging-and-test-campus-expands-investment-to-12-billion\/","title":{"rendered":"Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion"},"content":{"rendered":"

<\/p>\n

Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion<\/b><\/p>\n

Strong customer commitments support 60,000 square meter expansion of U.S. advanced packaging capacity<\/i><\/p>\n

TEMPE, Ariz.–(BUSINESS WIRE<\/a>)–
\nAmkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus. Driven by strong customer commitments that have surpassed the 33,000 square meters of cleanroom capacity planned for phase 1, the phase 2 expansion is expected to add 60,000 square meters and bring the campus to approximately 93,000 square meters of cleanroom space. The expansion increases the project\u2019s planned investment to approximately $12 billion.<\/p>\n

\nDesigned from the outset as a multi-phase project, Amkor\u2019s Arizona campus, which includes wafer bump, probe, assembly and test capabilities, is being developed to support long-term demand for advanced semiconductor packaging and test services in the U.S. Phase 2 expands manufacturing scale, and together with phase 1 is expected to support a workforce of more than 3,500 Arizona-based employees.<\/p>\n

\n\u201cThis next phase reflects the confidence our customers have placed in Amkor, the critical role advanced packaging plays in enabling the future of semiconductor innovation, and the strategic importance of our Arizona campus,\u201d said Kevin Engel, president and chief executive officer of Amkor Technology. \u201cAs chip architectures become more complex, customers need a trusted partner that can deliver at scale with the quality, technology leadership and operational discipline required for their most advanced products, and it is critical to have that capacity in the U.S.\u201d<\/p>\n

\nAmkor\u2019s Arizona campus is the first OSAT production site in the U.S. for advanced packaging in high volume, giving customers access to a full domestic turnkey manufacturing platform. Construction of phase 2 is anticipated to begin late 2027, with completion expected by the end of 2029. Amkor\u2019s Arizona 170-acre campus allows for further expansion as needed to support customer demand.<\/p>\n

About Amkor Technology, Inc.<\/b><\/p>\n

\nAmkor Technology, Inc. (Nasdaq: AMKR) is the world\u2019s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world\u2019s leading semiconductor and electronics companies to bring advanced technologies to market. The company\u2019s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com<\/a>.<\/p>\n

Amkor Technology, Inc. Forward-Looking Statement Disclaimer<\/b><\/p>\n

\nThis press release contains forward-looking statements within the meaning of the federal securities laws, including statements about the demand for and expansion of advanced packaging capacity in the United States, planned investments, construction timing, and long-term technology roadmaps. You are cautioned not to place undue reliance on forward-looking statements. All forward-looking statements in this press release are made based on our current expectations, forecasts, estimates, and assumptions. Because such statements include risks and uncertainties, actual results may differ materially from those anticipated in such forward-looking statements. Risk factors that could affect the outcome of the events set forth in these statements include, but are not limited to, that there can be no assurance that the Arizona campus will be built on the timeline, at the cost or to the specifications expected or at all or that the campus will generate sales or other benefits of the type or amount expected or at all and other factors discussed in the company\u2019s reports filed with or furnished to the Securities and Exchange Commission. All forward-looking statements attributable to us or persons acting on our behalf are expressly qualified in their entirety by this cautionary statement. We assume no obligation to review or update any forward-looking statements to reflect events or circumstances occurring after the date of this press release except as may be required by applicable law.<\/p>\n

\"\"<\/p>\n

View source version on businesswire.com: <\/span>https:\/\/www.businesswire.com\/news\/home\/20260908126184\/en\/<\/a><\/span><\/p>\n

\nKris Pugsley
\n
Vice President, Marketing Communications
\n
kris.pugsley@amkor.com<\/a><\/p>\n

\nJennifer Jue
\n
Vice President, Investor Relations
\n
jennifer.jue@amkor.com<\/a><\/p>\n

KEYWORDS:<\/b> Arizona United States North America<\/p>\n

INDUSTRY KEYWORDS:<\/b> Semiconductor Hardware Manufacturing Technology Packaging<\/p>\n

MEDIA:<\/b><\/p>\n\n\n\n\n
Logo<\/b><\/font><\/td>\n<\/tr>\n
\"Logo\"<\/td>\n<\/tr>\n
<\/font><\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion Strong customer commitments support 60,000 square meter expansion of U.S. advanced packaging capacity TEMPE, Ariz.–(BUSINESS WIRE)– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus. Driven by strong customer commitments that have surpassed the 33,000 square meters of cleanroom capacity planned for phase 1, the phase 2 expansion is expected to add 60,000 square meters and bring the campus to approximately 93,000 square meters of cleanroom space. The expansion increases the project\u2019s planned investment to approximately $12 billion. Designed from the outset as a multi-phase … <\/p>\n

Continue reading “Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion”<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-1001589","post","type-post","status-publish","format-standard","hentry"],"yoast_head":"\nAmkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion - Market Newsdesk<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.marketnewsdesk.com\/index.php\/amkor-technology-announces-phase-2-of-arizona-advanced-packaging-and-test-campus-expands-investment-to-12-billion\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion - Market Newsdesk\" \/>\n<meta property=\"og:description\" content=\"Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion Strong customer commitments support 60,000 square meter expansion of U.S. advanced packaging capacity TEMPE, Ariz.–(BUSINESS WIRE)– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus. Driven by strong customer commitments that have surpassed the 33,000 square meters of cleanroom capacity planned for phase 1, the phase 2 expansion is expected to add 60,000 square meters and bring the campus to approximately 93,000 square meters of cleanroom space. The expansion increases the project\u2019s planned investment to approximately $12 billion. 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