{"version":"1.0","provider_name":"Market Newsdesk","provider_url":"https:\/\/www.marketnewsdesk.com","author_name":"Newsdesk","author_url":"https:\/\/www.marketnewsdesk.com\/index.php\/author\/newsdesk\/","title":"Intel Accelerates Process and Packaging Innovations - Market Newsdesk","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"x6FnOrXbCb\"><a href=\"https:\/\/www.marketnewsdesk.com\/index.php\/intel-accelerates-process-and-packaging-innovations\/\">Intel Accelerates Process and Packaging Innovations<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.marketnewsdesk.com\/index.php\/intel-accelerates-process-and-packaging-innovations\/embed\/#?secret=x6FnOrXbCb\" width=\"600\" height=\"338\" title=\"&#8220;Intel Accelerates Process and Packaging Innovations&#8221; &#8212; Market Newsdesk\" data-secret=\"x6FnOrXbCb\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script>\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/www.marketnewsdesk.com\/wp-includes\/js\/wp-embed.min.js\n<\/script>\n","description":"Intel Accelerates Process and Packaging Innovations Annual cadence of innovations drives leadership from silicon to system. NEWS HIGHLIGHTS Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel\u2019s first new transistor architecture in more than a decade, and PowerVia, an industry-first for backside power delivery. Continued leadership in advanced 3D packaging innovations with Foveros Omni and Foveros Direct. New node naming to create consistent framework, more accurate view of process nodes for customers and the industry as Intel enters the angstrom era of semiconductors. Strong momentum for Intel Foundry Services (IFS) with first customer announcements. SANTA CLARA, Calif.&#8211;(BUSINESS WIRE)&#8211; Intel Corporation today revealed one of the most detailed &hellip; Continue reading \"\"","thumbnail_url":"https:\/\/mms.businesswire.com\/media\/20210726005136\/en\/893701\/4\/Intel-Accelerated-Pat-Gelsinger-3.jpg"}